FTG Secures Licensing Agreement With EarthOne Circuit Technologies Corporation


Reading time ( words)

Firan Technology Group Corporation announces a licensing agreement between FTG and EarthOne Circuit Technologies Corporation, whereby FTG will license the eSurface technology owned by EarthOne for use in the manufacture of printed circuit boards. The eSurface technology is proprietary to EarthOne and is used to prepare a wide array of surfaces for metallization. This technology enables printed electronics on a wide range of materials, can work on three dimensional geometries, can yield finer traces with better edge geometries and is a large step towards additive manufacturing. FTG's Chatsworth facility will be the first to implement the eSurface technology.

FTG was introduced to the eSurface technology almost 4 years ago and has been working collaboratively with EarthOne to prove out and advance eSurface technology. The execution of the license agreement is a testament to the value and confidence in the game changing eSurface technology.

"FTG continuously investigates future circuit board manufacturing technologies suitable to the Aerospace and Defense market, such as various additive manufacturing processes and concluded that the eSurface technology is very appropriate for the needs of our customers. This process will help us in producing finer pitch printed circuit boards with improved signal integrity critical to high density and RF applications," stated Brad Bourne, President and CEO of FTG Corporation.

EarthOne's President, Dr. William Wismann, stated, "We are fortunate to have such a capable partner so close to our base operations. We have worked with FTG for several years and look forward to a continued partnership of successes."

Michael Labrador, President of the FTG Chatsworth facility commented, "We are as excited as our customers! FTG has already engaged with a number of globally recognized customers specifically aimed at utilizing eSurface and the advances it provides."

Under the terms of the agreement, FTG is to adopt eSurface for the manufacturing of select high technology electronic parts. FTG plans to undertake an expedited eSurface implementation schedule that includes tooling, engineering, production, quality, sales and service functions. The initiative is expected to result in commercial production within three months, with a goal to scale eSurface production rapidly as the technology becomes a keystone to FTG's future technology roadmap.

About eSurface Technologies

eSurface Technologies is the creator of the eSurface process, a proprietary patent-pending process that can dramatically impacts the manufacturing and design segment of multiple industries. The initial adoption of the eSurface process by the global circuit board manufacturing industry is leading to the innovation of products previously not thought possible. EarthOne Circuit Technologies Corporation (DBA as eSurface Technologies, a privately-held corporation) is based in Newbury Park, California.

About FTG

FTG is an aerospace and defense electronics product and subsystem supplier to customers around the globe. FTG has two operating units:

FTG Circuits is a manufacturer of high technology, high reliability printed circuit boards. Our customers are leaders in the aviation, defense, and high technology industries. FTG Circuits has operations in Toronto, Ontario, Chatsworth, California and a joint venture in Tianjin, China.

FTG Aerospace manufactures illuminated cockpit panels, keyboards and sub-assemblies for original equipment manufacturers of aerospace and defense equipment. FTG Aerospace has operations in Toronto, Ontario, Chatsworth, California, Fort Worth, Texas and Tianjin, China.

Share




Suggested Items

Understanding the UHDI Market

11/28/2022 | I-Connect007 Editorial Team
The more we investigate UHDI in the current market, the more advanced packaging becomes a part of the conversation. Yet there are so many questions to be answered. The I-Connect007 Editorial Team met with Calumet’s Todd Brassard and Meredith LaBeau recently to get answers to these questions and find out where the UHDI market is headed.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/07/2022 | Andy Shaughnessy, Design007 Magazine
It’s been a busy week for I-Connect007. Managing Editor Nolan Johnson and I covered PCB West at the Santa Clara Convention Center, and, as you’ll see in my article below the place was packed. We have an article about SMTA International, scheduled for the end of October. I think the trade show season is looking good into 2023. People are done with COVID shutdowns and ready to get back to live trade shows and conferences. We’ll be in Minneapolis to bring you the latest news and technical information. We also have a news report about the European Union committing to craft its own version of America’s CHIPS Act. There’s a great interview with Dana Korf and John Strubbe about the latest innovations in materials at TUC. And columnist Paige Fiet explains why she is committed to making manufacturing “cool” again to help recruit and retain young technologists.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.