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The IPC Flexible Circuits-HDI Forum, scheduled for October 28-30, 2015, in Minneapolis, Minnesota, will provide attendees the opportunity to learn through various tutorials, speaker presentations, and keynote speeches.
Focusing on military, aerospace, medical, and automotive electronics industries, the event will feature senior technologists from companies including TTM Technologies, DuPont, Battelle, Multek-Flextronics, Insulectro, Firan Technology Group Corporation, Orbotech, eSurface, Science Applications International Corp. (SAIC), RBP Chemical Technology, and Intrinsiq Materials.
To register for the event, click here.
Patty Goldman, I-Connect007
Dieter Bergman IPC Fellowship Award winner Curtis Grosskopf, a senior engineer at IBM, reflects on the evolution of IPC committees and the vital importance of their work, especially in collaboratively creating industry-wide standards to guide the work of professionals in every sector. This commitment to multidisciplinary cooperation is a mindset that should be fostered at the start of every career.
Nolan Johnson, I-Connect007
In his State of the Union address in early February, President Biden departed from his usual topics about education and the economy to mention the new CHIPS Act, as well as supply chain and infrastructure issues. For perspective on those remarks, Nolan Johnson chats with David Schild, executive director of the Printed Circuit Board Association of America (PCBAA).
Pete Starkey, I-Connect007
The EIPC Winter Conference returned to the Metropolis of Lyon in eastern France this month. In 2018, the venue was Villeurbanne in the Auvergne-Rhône-Alpes region. Five years later the setting was the Groupama Stadium in Décines-Charpieu, and leaders of the European printed circuit community gathered in expectation of a spectacular programme of 16 presentations, a visit to a nuclear power station, and an invaluable networking opportunity. They weren’t disappointed.