HEICO Subsidiaries Supply NASA's New Horizons Spacecraft
July 14, 2015 | Globe NewswireEstimated reading time: 1 minute
HEICO Corporation today reported that two of its subsidiaries supplied products for NASA's remarkable New Horizons spacecraft which is scheduled to make a historic first Flyby past Pluto tomorrow, July 14, 2015.
HEICO's Buc, France-based 3D PLUS subsidiary supplied 4Gbit NAND Flash memory modules for the Solid State Data Recorder which will be used to store data and pictures of Pluto. This was the first time that NAND Flash was used for space operations.
HEICO's Blacksburg, VA-based VPT, Inc. subsidiary supplied hybrid power converters for the mission.
3D PLUS, VPT and HEICO's Sierra Microwave Technology have all supplied critical components on numerous NASA and European Space Agency programs. These HEICO subsidiaries are known leaders in complex, high-reliability and mission-critical engineering and manufacturing for spacecraft.
HEICO, 3D PLUS, VPT and Sierra Microwave all congratulate NASA and the team leaders on New Horizons -- Johns Hopkins Applied Physics Laboratory and Southwest Research Institute -- on another remarkable mission. The fastest spacecraft ever launched, New Horizons has traveled more time and distance than any space mission in history to reach its primary target. Tomorrow's Flyby will complete the initial exploration of the classical solar system while opening the door to an entirely new realm of mysterious small planets and planetary building blocks in the Kuiper Belt.
About HEICO Corporation
HEICO Corporation is engaged primarily in the design, production, servicing and distribution of certain niche aviation, defense, space, medical, telecommunications and electronics products. HEICO's customers include a majority of the world's airlines and overhaul shops as well as numerous defense and space contractors and military agencies worldwide in addition to medical, telecommunications and electronics equipment manufacturers. For more information about HEICO, please visit our web site at http://www.heico.com.
Suggested Items
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
03/18/2024 | IPCDevan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly created role, Dr. Iyer leads IPC's work with leading electronics companies and governments to identify and deliver news solutions to IPC members and the industry.
IEC Congratulates Bruno Ferri for 25 Years of Service
03/19/2024 | IECPlease join IEC (International Electronic Components) in congratulating Bruno Ferri for 25 years of service and camaraderie. Bruno is an integral part of our team and has significantly contributed to our success.
ROCKA Solutions Expands into Brazil
03/15/2024 | ROCKA SolutionsROCKA Solutions is thrilled to announce its expansion into Brazil. With a commitment to serving the growing needs of the Brazilian electronics manufacturing market, ROCKA has established new distribution and manufacturing services in the region.
Altium to Exhibit Latest Innovations at Embedded World 2024
03/15/2024 | AltiumAltium (ASX: ALU), a global leader in electronics design systems, will be at Embedded World 2024 to reveal its latest innovations across its ecosystem, spanning Altium Designer,
Northrop Grumman Honors Suppliers for Excellence
03/14/2024 | Northrop GrummanNorthrop Grumman Corporation honored more than 70 suppliers for their outstanding contributions in 2023. In an annual recognition event, the companies included women-, minority- and veteran-owned small businesses as well as those operating in underdeveloped areas.