EIPC Summer Conference, Berlin: Day 1


Reading time ( words)

14DrOlafWittler.jpg‘Reliability and Environmental Aspects for Future PCB’ was the topic of Dr. Olaf Wittler, head of environmental and reliability engineering at Fraunhofer IZM. He made it clear that environmental concerns would continue to be important technology drivers in the electronics industry. In the recent past, regulations such as the RoHS and ELV directives had resulted in increased performance demands on PCBs, and certain RoHS exemptions, originally permitted because of a lack of appropriate substitute materials, were due to expire in the near future. New trends in use conditions, particularly in power and LED applications, continued to increase the temperature load on the PCB. Fraunhofer IZM had developed material characterisation techniques to determine copper properties and monitor dielectric degradation and were now able to measure yield stress of copper within via holes and non-destructively compare, test and qualify polymer dielectric materials for long term and high-temperature use. The reliability of solder joints at high temperatures was also an issue. New interconnect technologies were under development, capable of operating at high temperatures and showing higher reliability than standard interconnection methods. Environmental considerations such as the need to avoid climate change and save energy were driving the development of LED lighting and power electronics. There was a continuing trend towards improved resource efficiency and a consequent need for highly reliable electronics, and ongoing research at Fraunhofer IZM would determine how this trend would influence future electronics manufacturing.

15TheWalkToFraunhofer.jpgAt the conclusion of the technical session, delegates had the opportunity of a refreshing 2 km walk to Fraunhofer IZM (because the bus didn’t arrive!) and a privileged tour around the photonics laboratory, the power laboratory, and the former flip-chip line, now converted to an embedding line. And a long and interesting day concluded with a conference dinner in downtown Berlin.

I am grateful to Alun Morgan for allowing me to use his photographs.

Day 2 of the conference is covered here.

Based in the UK, Pete Starkey is technical editor for I-Connect007. He has more than 30 years experience in the PCB industry, with a background in process development, technical service and technical sales.

Share




Suggested Items

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

Technica Heats Up ROI Discussion

05/17/2022 | I-Connect007 Editorial Team
The I-Connect007 Editorial Team speaks with Technica’s Frank Medina, Ed Carrigan, and Jason Perry about trending hotspots that provide the PCB fabricator a high return on investment (ROI). A theme that carries throughout the conversation is that traditional methods for calculating ROI are being replaced by models that include more qualitative factors.

EIPC Technical Snapshot: Supporting Autonomous Driving

05/12/2022 | Pete Starkey, I-Connect007
EIPC’s 17th Technical Snapshot webinar on May 4 focused on developments in automotive electronics, particularly on advances in the technologies required to support the evolution of autonomous driving. The team brought together two expert speakers to present their detailed views on topics encompassed within “CASE,” the acronym that appears to be taking over the automotive industry.



Copyright © 2022 I-Connect007. All rights reserved.