Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Expanded Semiconductor Assembly and Test Facility Database Tracks OSAT and Integrated Device Manufacturers in 670 Facilities

03/18/2024 | SEMI
The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced.

Indium Corporation Experts to Present Throughout IPC APEX EXPO

03/18/2024 | Indium Corporation
Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.​​​​​​​

A Brief History of IPC APEX EXPO

03/13/2024 | Alicia Balonek, IPC
In 1998, the Surface Mount Equipment Manufacturers Association (SMEMA) approached IPC for help. Because of IPC’s success with the Printed Circuits Expo and recognizing the need to establish control of its own event, the discussions between SMEMA and IPC ensued. This led to a merger between the two organizations and provided SMEMA with IPC member benefits.

Tata Group to Build the Nation’s First Indigenous Semiconductor Assembly and Test Facility in Assam

03/11/2024 | Tata Group
In a significant step towards creating an end-to-end semiconductor manufacturing ecosystem in India, Government of India has approved a proposal by Tata Electronics to build a state-of-the-art, greenfield semiconductor assembly and test facility in Jagiroad, Assam.

Europlacer Integrates Siemens Valor Process Preparation Software Into SMT Assembly Equipment

02/28/2024 | Europlacer
Europlacer has signed a global partnership agreement with Siemens, provider of the industry’s leading electronics manufacturing software solutions, to integrate Valor Process Preparation software into its Surface Mount assembly platforms and products worldwide.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in