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I-Connect007 and American Standard Circuits are proud to announce the launch of the companion guide to the immensely popular The Printed Circuit Designer’s Guide to... Flex and Rigid-flex Fundamentals.
This short guide, written by topic experts at American Standard Circuits, is designed to provide additional insights and best practices for those who design or utilize flexible and/or rigid-flex circuit boards. Topics covered include trace routing options, guidelines for process optimization, dynamic flexing applications, rigid-to-flex transition and more. Visit I-007ebooks.com/flexcg to download and learn more.
I-Connect007 has published nearly three dozen educational books serving the printed circuit electronics supply chain. Visit the entire library here.
American Standard Circuits is a total solutions provider, manufacturing quality rigid, metal-backed, RF/microwave, flex, and rigid-flex PCBs for the markets such as medical, automotive, industrial, defense, and aerospace in volumes from test and prototypes to large production orders. They have published multiple books, which can be found in the I-007ebooks library.
Andy Shaughnessy, Design007 Magazine
Texans like to say that everything is bigger in Texas. That certainly seems to be the case for the SMTA Dallas Expo & Tech Forum. Publisher Barry Matties and I attended SMTA Dallas on Tuesday, and the tabletop show has now grown to 100 exhibitors, up from 92 vendors last year. It’s become more than a local or regional show, with some exhibitors flying in from Silicon Valley and the East Coast.
Malcolm Thompson, NextFlex
The chip shortage is by no means over, with estimates expecting it will last into 2023. Some could see it taking even longer, such as Intel CEO Pat Gelsinger, who expects it to see shortages into 2024 due to those now impacting electronics production equipment. But if there’s any bright spot to be had, it’s that a crisis often leads to long-term solutions. In this case, it’s the increase in government funding for semiconductor production in the United States. Once the CHIPS Act proceeds, we can significantly accelerate building semiconductor fabs in the United States and work toward preventing future chip shortages that would put us back into our current situation.
Sean Nachnani, NextFlex
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.