North American PCB Industry Sales Up 9% in October


Reading time ( words)

IPC announced the October 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.07.

Total North American PCB shipments in October 2022 were up 9.0 percent compared to the same month last year. Compared to the preceding month, October shipments fell 13.3 percent.

PCB year-to-date bookings in October were down 4.5 percent compared to last year. October bookings were down 22.5 percent compared to the same month last year.

“Both order and shipment data in October were relatively weak but these data come on the heels of a strong September which has left the book-to-bill in positive territory,” said Shawn DuBravac, IPC’s chief economist. “Strong bookings in September suggest shipments should remain solid in the month ahead.”

IPC_PCB_October2022_Fig1.jpg

IPC_PCB_October2022_Fig2.jpg

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

Share




Suggested Items

EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace

10/26/2022 | Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/14/2022 | Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.

Microvias Can Be Stacked in Certain Package Densities

10/13/2022 | I-Connect007 Editorial Team
Summit Interconnect’s Gerry Partida recently spoke with the I-Connect007 Editorial Team about his research into root causes of weak microvias. Rather than a single manufacturing process cause, Gerry suggests that microvia reliability is the culmination of several material interactions and that contrary to popular belief, microvias can still be stacked in small, tight packaging densities. He highlights the need for simulation, as well as some of his findings that he plans to publish in a paper at IPC APEX EXPO 2023.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.