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Arlon Electronic Materials, Rancho Cucamonga, CA, announced its entrance into the high-speed, low loss, materials market with Arlon’s upcoming “Aero” line of High-Speed materials, with the first release being the “HS-320”. Arlon’s Aero High-Speed (HS) line of materials represents a significant enhancement to the company’s product portfolio that has historically been known for primarily polyimide resin-based products.
“I am very excited to have these new materials to offer our valued customers in the AIM (aerospace, industrial and military) markets.” commented Dave Nelson, Arlon’s Global Business Development Manager. “For nearly 40 years, Arlon has been known as the company to go to when polyimide and no-flow materials are required. Now, with our Aero High-Speed product line, Arlon has a great opportunity to support our customers with world class high-speed, low loss materials, designed to meet demanding electrical requirements.”
Arlon’s first release of Aero High-Speed materials will have dielectric constants from 2.8-3.4 with loss tangency between 0.001-0.003 tested at 10 GHz. The materials will be anti-CAF, up to 9 sequential laminations, and suitable for HDI.
The first production release of Arlon’s Aero High-Speed material is slated for early 2023. Data sheets for the product will be available at: www.arlonemd.com.
Nolan Johnson, I-Connect007
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
Nolan Johnson, I-Connect007
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
I-Connect007 Editorial Team
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.