Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'

Reading time ( words)

The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art is the second in a two-part series. This book builds on the material presented in the first by describing up-to-the-minute products and design techniques for thermal management with IMS.

The first volume comprehensively covers principles of heat transfer and modeling of thermal systems to help engineers quantify the thermal-management challenges in the application at hand, the nature of IMS, typical material parameters, and the choices available for designers to reach the desired performance.

We recommend reading the first book in order to understand the issue from first principles, how to navigate the many material choices offered, and appreciate how adjusting the various combinations of material types and thicknesses can help you arrive at a solution that meets your requirements from all standpoints, particularly system reliability, size, cost, and manufacturability.

The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, covers additional use cases and materials, including those used for high-temperature applications as well as high-emissivity surface treatment that can significantly enhance thermal performance. A web-based thermal calculator is demonstrated, which helps arrive at the exact size of baseplate needed to achieve the desired thermal performance in the smallest possible volume—much smaller than would be possible using a suitably sized heatsink.

Volume 2 delves deeper into issues such as test methods and how these can affect assessments of IMS materials and analyzes the effects of tolerances in material properties and thickness on the overall thermal conductivity. Understanding this can critically influence measurement error, ultimately determining whether or not an accurate result for reliability can be calculated. The authors look at how problems such as solder cracks affect thermal performance, and share application examples showing design with multilayer IMS.

As application challenges have evolved, and new component types and thermal materials have entered the market, there is more to say about thermal management and the options available to designers striving for an effective, economical, and compact solution to meet system-reliability targets.

To continue reading this book from the I-007eBooks library, download it today!



Suggested Items

DFM 101: Final Finishes—ENIG and ENIPIG

08/03/2022 | Anaya Vardya, American Standard Circuits
One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability. Final finishes provide a surface for the component assembler to either solder, wire bond, or conductively attach a component pad or lead to a pad, hole, or area of a PCB.

A Textbook Look: Signal Integrity and Impedance

05/18/2022 | Pete Starkey, I-Connect007
Believing that I knew a bit about signal integrity and controlled impedance, I was pleased to take the opportunity to connect with an educational webinar that I hoped would extend my knowledge. In the event I was surprised at how little I actually knew, and the webinar was an excellent learning opportunity. The webinar was introduced and expertly moderated by Anna Brockman of Phoenix Contact in Germany.

Additive Manufacturing Requires Additive Design Techniques

05/09/2022 | Luca Gautero, SUSS MicroTec
Although I am not a designer by trade, I want to share my thoughts on what additive manufacturing means for designers, especially how it relates to solder mask. In this article, you will learn what topics I feel are the most important to address.

Copyright © 2022 I-Connect007. All rights reserved.