Qorvo Selects Cadence Design Systems for US Government SHIP-RF Program


Reading time ( words)

Cadence Design Systems, Inc. announced participation in Qorvo’s State-of-the-Art Heterogeneous Integrated Packaging (SHIP-RF) Design Center. The SHIP-RF program is a Department of Defense (DoD)-sponsored initiative aimed at advancing leading-edge microelectronics design and manufacturing capabilities in the United States. As part of the program, Cadence is providing services, tools and Assembly Design Kits (ADKs) to enable Qorvo and their customers to achieve first-pass design and manufacturing success for next-generation RF and mixed-signal systems that are delivered as both packages and modules.

As part of Qorvo’s Design Center team, Cadence will develop methodologies and flows to implement seamless design and simulation capabilities for 2.5D and 3D heterogeneous integration. These include advanced technologies that have been internally developed in alignment with the Cadence® Intelligent System Design™ strategy, including Allegro® Pulse™, Clarity™ 3D Solver, Celsius™ Thermal Solver, and Allegro X Design Platform. Incorporating Cadence ADK solutions with Qorvo’s foundry PDKs and their SHIP-RF Assembly and Test Center (ATC) manufacturing rules enables complete modeling and product simulation for mission-critical aerospace and defense applications.

“Cadence is the only EDA company accredited by the DoD as a Trusted Supplier. We will provide Qorvo and our customers with capabilities to rapidly and accurately design sophisticated packages and modules that will be fabricated and tested in the Qorvo manufacturing facility, resulting in reduced development time, iterations and cost,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group, Cadence. “With our continued focus on developing the most advanced computational software solutions, Cadence is well-positioned to deliver an optimized flow for RF and mixed-signal systems to be designed, verified and assembled in the most advanced packages and modules.”

“Cadence’s participation in the SHIP-RF program benefits Qorvo and our customers as they will be able to access Cadence flows when utilizing Qorvo’s advanced, industry-leading heterogenous RF packaging, assembly and testing solutions,” said Roger Hall, general manager of Qorvo’s High Power Solutions (HPS) business. “Cadence’s offerings can increase design productivity to meet the size, weight, power and cost (SWAP-C) requirements for next-generation phased array radar systems, unmanned vehicles, electronic warfare platforms and satellite communications.”

The Cadence Aerospace and Defense solutions support the company’s broader Intelligent System Design strategy, enabling system innovation.

Share




Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/17/2022 | Andy Shaughnessy, Design007 Magazine
We’re still not officially into summer yet, but Atlanta is bringing the heat, baby! It’s hit 97 degrees a few times this week, and I now have a fan aimed right at my face. At least it’s nice and humid too. I’m glad I don’t wear make-up. And it’s been a hot week in the circuit board community. This week, Eltek reported a fire at a board shop in Israel, and Flex committed to building a 145,000-square-foor facility in Jalisco, Mexico to serve the electric and autonomous vehicle segment.

Additive Design: Same Steps, Different Order

04/12/2022 | I-Connect007 Editorial Team
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.

AltiumLive 2022: Left-Shifting Modeling and Simulation

03/10/2022 | Andy Shaughnessy, I-Connect007
Harry Kennedy and Sarmad Khemmoro of Altair recently spoke with Andy Shaughnessy about their AltiumLive presentations, which are now available online. They discuss the need for modeling, simulation, and verification in PCB design, and why these actions should be performed as early in the design process as possible.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.