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SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium

03/13/2024 | SMTA
The SMTA is excited to announce a Workforce Development Breakfast Panel, “Building Tomorrow’s Expertise,” taking place on March 26, 2024 in Peoria, Arizona, USA.

UHDI Fundamentals: Talking UHDI with John Johnson, Part 3

03/07/2024 | Steve Williams, The Right Approach Consulting LLC
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra high density interconnect (UHDI) products. In this final part of my interview with industry veteran John Johnson, vice president of business development at American Standard Circuits, we use photos, slides, and materials to discuss what he learned from his previous role at Averatek.

Sondrel Announces Two New Design Contract Wins

02/29/2024 | Sondrel
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.

SMTA Ultra High-Density Interconnect Symposium Is Nearly Here

02/27/2024 | SMTA
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.

ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event

02/27/2024 | ASC Sunstone
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.
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