Henkel Collaborates in Reducing CO2 Emissions by Improving Materials Utilization in Aerospace

Reading time ( words)

Henkel Adhesive Technologies, a leader in structural adhesives and surface treatments for the aircraft OEM and MRO industries worldwide, has announced its collaboration on a research study focused on Reducing CO2 Emissions by Improving Materials Utilization. The study is currently being conducted by Boeing Germany in partnership with the Institute for Lightweight Construction at the University of the Federal Armed Forces in Munich, and is funded by Germany’s Federal Ministry for Economic Affairs and Energy.

This 36-month sustainability study, launched in January 2021, will research strategies to reduce the carbon footprint of composite parts by decreasing the weight of aerospace assemblies through controlled materials consumption, making parts production as efficient as possible. The study will combine traditional engineering with finite element analysis (FEA) and digital twin technology. Exact virtual representations of test samples will undergo digital manipulation to generate material performance data spanning the sample’s lifecycle. This digital simulation reduces the mechanical effort and time required to complete traditional testing.

Henkel will contribute state-of-the-art epoxy and polyurethane reactive composite matrix resins, industry expertise, and material modifications as needed to the study. The company will also fabricate epoxy and polyurethane composite samples using its Loctite and Bonderite resins with carbon fibers provided by Teijin Carbon.

“Too much CO2 is generated during the production and service life of fiber composite components,” explains Martin Renkel, Senior Regional Product Development Manager for Henkel Adhesive Technologies. “Through this study, Henkel will help to make the aerospace industry more sustainable by improving production efficiency of composites and reducing component weight. Lower fuel and materials consumption result in considerable greenhouse gas reduction. Even the study itself is green. Digitized testing reduces physical testing which means fewer samples needed and lower study expenses.”

“We are so proud to collaborate on this study that will help the aerospace industry achieve sustainability and climate goals before 2050,” added Ruairi O’Kane, Global Segment Strategy Head for Aviation, Space and Rail at Henkel Adhesive Technologies. “Manufacturing with composites reduces fuel consumption by 10 to 15% with comparable reduction in CO2 emissions. Our scientists and engineers understand the importance of cutting-edge technology to advance the adoption of new materials and processes and are excited to partner on this highly digitized initiative.”



Suggested Items

Boeing's Latest 737-9 ecoDemonstrator Testing Crane A&Es New Long-range Sensing

09/28/2021 | Crane Aerospace & Electronics
Crane Aerospace & Electronics, a segment of Crane Co., has been selected to feature its new Long-Range Wireless Tire Pressure Sensors on Boeing’s 2021 737-9 ecoDemonstrator program.

Meet Chris Young, MilAero007 Columnist

04/20/2021 | I-Connect007 Editorial Team
Meet Chris Young, one of our newest I-Connect007 columnists! Chris’ columns will take a lighthearted (sometimes humorous) and informative view of the aerospace and defense industry.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Copyright © 2021 I-Connect007. All rights reserved.