BSU Updates High-Performance X-ray Inspection Capability

Reading time ( words)

BSU Inc., a growing EMS company, has updated its high-performance X-ray inspection capability with the installation of a Nikon XT V Series world-class X-ray and CT inspection system. In addition to inspecting many areas of SMT/PCB assemblies that are generally inaccessible to visual inspection, the new X-ray system will be used to inspect Ball Grid Array (BGA), leadless, and connector components to identify problems such as solder joint defects, shorts, opens, etc.

In making the announcement, Dennis Leahy, VP of Sales and Customer Success, said, “We will continue to incorporate X-ray technology as a standard offering in our build process here at BSU.  Our XT V 160 provides high-resolution to ensure compliance with our stringent quality standards. Each board is examined at varying levels/angles, and the images are saved to become part of the manufacturing records for our customers. This provides the opportunity for us to recommend design and build efficiencies.”

He added, “This advanced X-ray system features a 5-axis part manipulation capability, which allows us to look at a component or solder connection from several different angles, and to view internal connections of molded devices or modules, for example, so that no defect will escape detection. Our quality personnel are trained and certified to operate our state of the art X-ray system and get the best possible results from our equipment.”

The Nikon XT V Series provides world-class X-ray and CT inspection systems for electronics (PCB, BGA, chip design) and component inspection for a wide range of industries, meeting today's need for high performance inspection of increasingly complex components with ever tighter tolerances. The systems are intuitive to use and harness industry-leading software to maximize productivity for all operators, with minimal need for training. Automated inspection modes allow inspection of samples at high throughput rates, with intuitive pass / fail reporting.

BSU Inc’s services include Prototyping, PCB Assembly, Engineering Design Services (EE, ME), High Mix Low to Medium Volume production, Mechanical, Electrical, Cabling and SW/FW programming, Board and Functional Testing, and Global supply chain services, to name a few. In addition to PCBA assembly, BSU also offers box build services, wiring harness assembly, complex and simple cables, and mechanical components assembly. BSU Inc’s customers span multiple industries including industrial, IoT, military and high reliability, entertainment, healthcare, education, energy, and communications, to name a few.



Suggested Items

Catching Up With Nova Engineering

04/27/2021 | Dan Beaulieu, D.B. Management Group
When searching for companies to interview, I always look for something unique and that makes the company special. Truth be told, I am a collector of stories about good, well-run, unique companies that we can learn something from. Nova Engineering is one of those companies.

Hans-Peter Tranitz: Dieter Bergman IPC Fellowship Award Recipient

04/22/2021 | Patty Goldman, I-Connect007
In this wide-ranging interview, Patty Goldman speaks with Continental Automotive’s Peter Tranitz about his IPC involvement with press-fit and other automotive standards which have earned him the coveted Dieter Bergman IPC Fellowship Award.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 3

04/22/2021 | Brent Fischthal, Koh Young America
Initiatives like the IPC Connected Factory Exchange (CFX) and IPC-Hermes-9852 underpin efforts within the industry to develop standards and help create a smart factory. These M2M communication standards, guided in part by Industry 4.0, are altering the manufacturing process by improving metrics such as first pass yield and throughput by applying autonomous process adjustments.

Copyright © 2021 I-Connect007. All rights reserved.