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John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave™ family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave™ is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
Watch this Real Time with... IPC APEX EXPO 2021 interview conducted by Pete Starkey, I-Connect007 Technical Editor.
Andy Shaughnessy, Design007 Magazine
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.
Dan Beaulieu, D.B. Management Group
As a student of the printed circuit board industry, I am always interested in learning more about companies all over the world. When I connected with Abhay Doshi, managing director of Fine-Line Circuits Ltd. in India, I welcomed the opportunity to learn more about him, his company, and the Indian PCB business as a whole—it was all that, and so much more. Here’s what I learned.
Pete Starkey, I-Connect007
Although it was originally proposed to hold a one-day face-to-face EIPC conference in Frankfurt, travel restrictions in Germany made this impractical. But the Technical Snapshot webinar format has proved so successful that it was decided to run an extended version as an alternative—two sessions, with three presentations each. It worked extremely well. The carefully selected program on February 23 featured excellent speakers, and seamless organisation added up to an outstanding event.