The dissipation of heat from electronic power modules is increasingly critical to maintain their functionality and increase their reliability. Insulated metal substrates (IMS) offer a proven route to thermal management, and this specialist technology is increasingly employed in multilayer stack-ups for power applications.
This Realtime with... I-Connect007 roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer. The benefits of technical and engineering support from a one-stop laminate supplier become clearly apparent.