EMCORE Introduces New LiDAR and Optical Sensing Products


Reading time ( words)

EMCORE Corporation, a leading provider of advanced mixed-signal products that serve the aerospace & defense and broadband communications markets, announced the introduction of the Model 1790 1550 nm High-Power Laser Module for LiDAR (Light Detection and Ranging) and Optical Sensing. The 1790 laser module was developed for use as a CW (Continuous Wavelength) coherent optical source for next generation FMCW (Frequency Modulation Continuous Wavelength) LiDAR systems. A custom version of this product has already been adopted by a major provider of LiDAR systems for its anticipated use in autonomous vehicles.

The underlying technology for the Model 1790 has been in development for over 3 years and was designed to address demanding applications in industrial sensing and measurement. The 1790 achieves extremely narrow linewidths combined with a high-efficiency coupling scheme to enable high optical output power of 18 dBm, creating a compact, robust solution for FMCW sensing. Its monolithic design, combined with optimized coupling optics, makes it highly immune to the mode or optical frequency hopping typically found with single isolator, external cavity designs. EMCORE’s LiDAR laser technology maintains optical frequency stability over temperature, suppressing false readings caused by the mode or frequency hopping which is typical in conventional designs.

“We are extremely excited about the development of our laser technology for LiDAR and optical sensing and see it supporting a broad array of industrial applications beyond autonomous vehicles including materials characterization, strain measurement, terahertz-spectroscopy, interferometry, position and interference measurement, and other applications,” said Gyo Shinozaki, Vice President and General Manager of Broadband for EMCORE. “Our vertical integration allows for different wavelengths to be available for custom applications and form factors, including packaged component or micro-optical subassembly,” added Mr. Shinozaki.

The Model 1790 laser module is DC-coupled with a built-in TEC (Thermo-Electric Cooler), thermistor and monitor photodiode. The device is packaged in a 14-pin, OC-48 pinout compatible hermetic butterfly form factor with double optical isolator mounted on the TEC. It has a wide operating temperature range from -10 °C to +65 °C and is Telcordia Technologies® GR-468 and RoHS compliant.

Share

Print


Suggested Items

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

12/01/2020 | I-Connect007 Editorial Team
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.



Copyright © 2021 I-Connect007. All rights reserved.