HENSOLDT and Nano Dimension Achieve Breakthrough in Electronics 3D Printing


Reading time ( words)

Sensor solutions provider HENSOLDT together with the leading Additively Manufactured Electronics (AME)/Printed Electronics (PE) provider, Nano Dimension, has achieved a major breakthrough on its way to utilizing 3D printing in the development process of high-performance electronics components. Utilizing a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D-printed boards could not bear the soldering process necessary for two-sided population of components.

“Military sensor solutions require performance and reliability levels far above those of commercial components.” said HENSOLDT CEO, Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”

“Nano Dimension’s relationship with HENSOLDT is the type of partnership with customers we are striving for,” commented Yoav Stern, Nano Dimension President and CEO. “Working together and learning from HENSOLDT led us to reach a first-of-its-kind in-depth knowledge of polymer materials applications. Additionally, it guided us in the development of Hi-PEDs (high performance electronic device) that create competitive edges by enabling unique implementations with shortest time to market.”

AMEs are useful to verify a new design and functionality of specialized electronic components before production. AME is a highly agile and individual engineering methodology to prototype a new electronic circuitry. This leads to significant reduction of time and cost in the development process. Furthermore, AME gives a verified and approved design before production starts, leading to higher quality of the final product.

HENSOLDT started working with Nano Dimension’s DragonFly 3D printing system in 2016, in order to examine the possibilities of 3D printing electronics. Last year, HENSOLDT successfully implemented the DragonFly Lights-Out Digital Manufacturing (LDM) printing technology, the industry’s only additive manufacturing platform for round-the-clock 3D printing of electronic circuitry.

Share

Print


Suggested Items

Survey Results: ‘Are You Currently Hiring?’

11/04/2020 | Michelle Te, I-Connect007
The I-Connect007 research team invited readers to share their thoughts on what's happening with staffing and retention to help prepare for an upcoming issue on this important topic. Here, we delve into the first question, "Are you currently hiring?"

I-Connect007 Editor's Choice: Five Must-Reads for the Week

10/30/2020 | Nolan Johnson, I-Connect007
Welcome to the Halloween issue of the I-Connect007 Top Five Editor’s Picks! This year’s Halloween lands on a doozy of a day. Astronomers among us will, undoubtedly, already have noticed that not only does the spooky holiday fall on a Saturday night, but it also falls exactly on a full moon—and a Blue Moon, at that! The last time a Halloween Blue Moon occurred in all time zones was in 1941. As if there weren’t enough “ghoulishness” already, 2020 delivers yet another rare occurrence.

EIPC Technical Snapshot: Automotive Technology

10/19/2020 | Pete Starkey, I-Connect007
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.



Copyright © 2020 I-Connect007. All rights reserved.