BAE Systems Wins DARPA Contract to Develop Machine Learning Analytics as a Service for Constant Global Situational Awareness


Reading time ( words)

BAE Systems was awarded a contract by the U.S. Defense Advanced Research Projects Agency (DARPA) to develop machine learning analytics as a servicea first-of-its-kind, cloud-based model for the government. This new technology model seeks to provide an automated service that aims to leverage commercial and open source data, including satellite imagery, to deliver continuous worldwide situational awareness for a diverse range of challenges, including anomaly detection and prediction.

As part of DARPA’s Geospatial Cloud Analytics (GCA) program, the BAE Systems FAST Labs research and development team aims to use the company’s Multi-INT Analytics for Pattern Learning & Exploitation (MAPLE) technologya proven solution with more than 10 years of developmentto offer MAPLE as a service (MaaS). This approach seeks to apply automated analytics to a problem, freeing operators to query the data to answer specific questions about important mission issues at hand while removing the traditional need to conduct extensive manual analysis. For the purposes of this program, the BAE Systems team seeks to apply MaaS to a proposed maritime challenge to automatically and reliably detect vessels that are engaging in illegal fishing.

Our technology can be used across a number of domains and can be leveraged in the cloud, making it an extremely flexible and easily scalable solution that provides operators with worldwide vigilance. Our goal is to automate analytics in a new way so that we can take the incredible capabilities of machine learning to discover nuanced patterns in both sparse and large data volumes to solve extremely complicated problems that could threaten our nation’s security.

Research on the GCA program leverages BAE Systems’ machine learning and artificial intelligence capabilities such as adaptive reasoning and analysis in its autonomy technology. The GCA program is one of several fields BAE Systems is researching, including current work on DARPA’s Hallmark Tools, Capabilities, and Evaluation Methodology program, and represents several years of research on various other programs with DARPA as well as the Air Force Research Lab.

Share

Print


Suggested Items

Use of IMS Thermal Materials in Multilayer Stackups for Power Applications

12/01/2020 | I-Connect007 Editorial Team
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.

The Heterogeneous Integration Roadmap for Aerospace and Defense

11/24/2020 | Jeff Demmin, Keysight Technologies
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.

Additive Electronics TechXchange: NSWC Crane and Lockheed Martin Presentations

10/27/2020 | Happy Holden, I-Connect007
The Additive Electronics TechXchange this year was a virtual event. Happy Holden covers two presentations, including “Very High-Density Investigation Project” by Steve Vetter of the NSWC Crane Naval Facility and "Electronics Additive Manufacturing for Defense and Space" by Kourtney Wright, Ph.D., of Lockheed Martin Advanced Technology Center.



Copyright © 2021 I-Connect007. All rights reserved.