U.S. Navy Awards Raytheon $112 Million Miniature Air-Launched Decoy Contract
December 26, 2019 | Raytheon CompanyEstimated reading time: Less than a minute
Raytheon Company was awarded a U.S. Navy contract for the Miniature Air-Launched Decoy – Navy, as announced by the U.S. Department of Defense on Dec. 20, 2019.
Raytheon Missile Systems in Tucson, Arizona, is awarded a $112,267,649 modification to a previously awarded cost-plus-incentive-fee contract. This modification provides non-recurring engineering support throughout the engineering and manufacturing development phase as well as through payload integration and transition to production for the MALD-N.
Work will be performed in Tucson (65%); and Goleta, California (35%), and is expected to be completed in September 2022. The Naval Air Systems Command, Patuxent River, Maryland, is the contracting activity.
Suggested Items
ASMC 2024 to Showcase AI, Smart Manufacturing and Sustainability to Advance Chip Industry Manufacturing Expertise
03/27/2024 | SEMIMore than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York.
IPC APEX EXPO 2024: LPKF—Debunking Depaneling Industry Perceptions
03/27/2024 | Nolan Johnson, I-Connect007In this audio interview, listen to Jake Benz discuss advances in laser depaneling at LPKF. Thanks to advances in laser technology, perceptions about laser depaneling are changing from a low-speed, specialized process to a high volume process suitable for production manufacturing. Benz elaborates on some of the development and engineering that went into creating their latest, most capable depaneling machines.
Seeking Employment: Meet Gary Turner
03/25/2024 | Barry Matties, I-Connect007Meet Gary Turner, a recent graduate from the University of Texas at Dallas with a bachelor’s degree in mechanical engineering and a master’s in material science and engineering. He is currently seeking employment in the industry. The following interview will allow you to learn about Gary and see if he might be a good candidate for a position you are looking to fill.
The Challenges, Opportunities, and Future Specialties of PCB Design
03/19/2024 | Stephen V. Chavez, Siemens EDAWhat were once specialties have become more generalized over time—PCB designers must learn about design automation, signal integrity (SI), electromagnetic compatibility (EMC), complex high-speed design, mechanical design, and manufacturability/producibility. Design engineers must learn about layout, simulation, and supply chains—and in their place new specialties have emerged, like multi-gigabit SerDes channel design, advanced manufacturing, IoT, and multi-physics system verification.
Siemens, NVIDIA Expand Collaboration on Generative AI for Immersive Real-time Visualization
03/19/2024 | PRNewswireSiemens announced that it will deepen its collaboration with NVIDIA to help build the industrial metaverse. Siemens is bringing immersive visualization powered by new NVIDIA Omniverse Cloud APIs to the Siemens Xcelerator platform, driving increased use of AI-driven digital twin technology.