BAE Systems to Innovate Electronic Warfare Jamming Technology for U.S. Army
November 12, 2019 | BAE SystemsEstimated reading time: 1 minute
BAE Systems was awarded research and development funding through the U.S. Army to create an advanced radar jamming technology. The technology aims to improve air survivability and mission effectiveness for U.S. Army rotary-wing aircraft and unmanned aerial systems (UAS) by detecting and defeating complex and unknown threats in electronic combat.
As part of the contract, BAE Systems FAST Labs™ research and development team will design technology to integrate adaptive radio frequency jamming and sensing capabilities into one system. Whereas today's electronic countermeasure systems are too bulky and heavy for most rotary-wing and UAS platforms, BAE Systems technology will combine multiple, software-programmable antennas into a digital phased array that will enable simultaneous functions, exceeding existing capabilities while reducing the size, weight, and power (SWaP) of current systems. The technology will enable these platforms to safely fly closer to threats and within contested areas while remaining protected.
"With the continuously evolving threat landscape, it's critical to provide the next-generation of digital phased array technology to better defend our armed forces in electronic warfare," said Chris Rappa, product line director for Radio Frequency, Electronic Warfare, and Advanced Electronics at BAE Systems FAST Labs. "Our technology will give the Army's rotary-wing aircraft and UAS a new, low SWaP system to securely and drastically increase their range of movements in future missions."
Research for this contract adds to BAE Systems' advanced electronics portfolio and is based on many years of investment on various programs with the Air Force Research Lab (AFRL), U.S. Army, and the Defense Advanced Research Projects Agency (DARPA), including DARPA's CONverged Collaborative Elements for RF Task Operations (CONCERTO) and DARPA's Radio Frequency Field Programmable Gate Arrays (RF-FPGA) programs. Work for the contract will be completed at the company's facilities in Nashua, New Hampshire and Merrimack, New Hampshire.
About FAST Labs™ R&D
The FAST Labs™ R&D group of BAE Systems pushes the limits of what is possible; to create advanced technologies that give our customers the edge they need to win and our employees the chance to change the world.
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methosd for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.