NEO Tech Completes CTPAT Certification
November 6, 2019 | NEO TechEstimated reading time: 1 minute
NEO Tech announces that it has completed and received approval for its certification for Customs Trade Partnership Against Terrorism (CTPAT), that is part of the U.S. Customs and Border Protection’s (CBP) multi-layered cargo enforcement strategy.
With this certification NEO Tech can now achieve faster clearance through CBP for products manufactured in NEO Tech Juarez and Tijuana Mexico locations with access to the Free and Secure Trade (FAST) Lanes at the U.S. land borders. At the same time the NEO Tech network of U.S. electronic manufacturing service locations will experience more expeditious CBP clearance for inbound materials. These logistical improvements will enable enhanced end-customer experiences.
“With NEO Tech now a certified CTPAT partner, our end customers can now benefit with more predictable logistics and supply chain performance,” stated Magdy Henry, NEO Tech Vice President of Supply Chain. “We are also proud to join the community of other certified partners to strengthen international supply chains and improve United States border security.”
CTPAT is a voluntary public-private sector partnership program which recognizes that CBP can provide the highest level of cargo security only through close cooperation with the principle stakeholders of the international supply chain. Participants in the community of certified partners work with CBP to protect the supply chain, identify security gaps, and implement specific security measures and best practices.
Suggested Items
AT&S Well Prepared to Benefit from AI Boom
03/26/2024 | AT&SThe rapid progress in the development of artificial intelligence promises to revolutionize all areas of daily life in the coming years. In order to operate such AI systems, an enormous amount of computing power is required, which is provided by a vast network of data centres.
American Made Advocacy: Going Beyond the CHIPS Act to Power American Manufacturing
03/26/2024 | Travis Kelly -- Column: American Made AdvocacyWhere have all the factories gone? A tour of America’s former bustling manufacturing communities is a stark reminder that, for the past three decades, we let the microelectronics manufacturing ecosystem disappear overseas, primarily to Asia. For decades, foreign competitors seeking to control critical markets played a long game. Government investment and subsidies were effective in undercutting U.S. and European companies. As other countries created this unfair competitive advantage in manufacturing, the know-how also migrated in their direction. This resulted in the serious workforce challenges the semiconductor and printed circuit board industries face today.
ROCKA Solutions to Showcase Comprehensive Manufacturing Solutions at the Del Mar Show
03/25/2024 | ROCKA SolutionsROCKA Solutions is excited to announce its participation in the upcoming Del Mar Electronics & Manufacturing Show, scheduled to take place on April 24-25, 2024 at the Del Mar Fairgrounds in San Diego, CA. ROCKA Solutions will be exhibiting in Booth 650, where attendees can learn more about the company's commitment to enhancing supply chains and supporting various manufacturing sectors.
SEMI Applauds U.S. Chips Act Incentives for Intel Manufacturing Facilities to Bolster Semiconductor Supply
03/21/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support four new Intel Corporation semiconductor manufacturing sites in the states of Arizona, New Mexico, Ohio and Oregon.
Arlon EMC Receives IPC-4101 QPL Recertification
03/20/2024 | Arlon Electronic MaterialsArlon Electronic Materials has successfully completed an intensive two-day recertification audit by IPC Validation Services that examined Arlon’s manufacturing processes and testing procedures to assure that they are in conformance to the requirements of IPC-4101E-WAM1, the Specification for Base Materials for Rigid and Multilayer Printed Boards.