Boeing Proposes ‘Fewest Steps to the Moon’ for NASA’s Human Lander
November 5, 2019 | BoeingEstimated reading time: 2 minutes
Boeing today submitted a proposal to NASA for an integrated Human Lander System (HLS) designed to safely take astronauts to the surface of the moon and return them to lunar orbit as part of the Artemis space exploration program.
The company’s proposal calls for delivering the lander’s Ascent Element and Descent Element to lunar orbit in one rocket launch to ensure it is tailored for maximum capability and crew safety. This approach reduces the complexity and risk of sending multiple segments to orbit on multiple launches, enabling a crewed lunar surface landing with only five mission critical events instead of the 11 or more required by alternate strategies. Boeing’s integrated lander also can carry itself from lunar orbit to the surface without an additional transfer stage or “space tug,” further reducing launches and simplifying the steps to a successful landing.
“Using the lift capability of NASA’s Space Launch System (SLS) Block 1B, we have developed a ‘Fewest Steps to the Moon’ approach that minimizes mission complexity, while offering the safest and most direct path to the lunar surface,” said Jim Chilton, senior vice president of Space and Launch for Boeing Defense, Space & Security.
Boeing’s design relies on NASA’s exploration backbone, the SLS rocket currently in production at NASA’s Michoud Assembly Facility (MAF). The SLS has an unmatched lift capability that builds on proven flight components. This approach shortens development time and lowers risk, enabling NASA to safely land on the moon’s surface by 2024.
The lander’s flexible design allows for the fastest path to lunar flights while providing a robust platform that can perform NASA’s full range of exploration missions. It can dock with the Gateway lunar orbiter or directly with NASA’s Orion to eliminate the need for an additional spacecraft, both on time to meet the 2024 mandate.
The design includes innovations in its engines, composites, and automated landing and rendezvous systems. Key technologies are based on the Boeing CST-100 Starliner spacecraft, which will be fully demonstrated and proven during its upcoming Orbital Flight Test to the International Space Station in December 2019.
Boeing partnered with NASA’s Marshall Space Flight Center, Johnson Space Center, and Kennedy Space Center and will collaborate closely with NASA to integrate, certify, and operate this innovative HLS. The company also will provide the critical resources and industry knowledge required to ensure on-time delivery in support of a 2024 lunar landing. Whether serving in NASA’s 2024 or 2025 mission slot, Boeing’s approach maximizes return from agency investments in previous and ongoing programs to allow for the simplest and therefore highest probability path back to the lunar surface.
Suggested Items
PCBflow Helps Designers Choose Best Manufacturer for the Job
03/28/2024 | Andy Shaughnessy, Design007 MagazineI recently spoke with a few technologists who have first-hand experience with PCBflow: Susan Kayesar, technical product manager with Siemens; Evgeny Makhline, CTO of Nistec, a CEM based in Israel; and Peter Tranitz, senior director of technology solutions and leader of the IPC Design Initiative. They explain how PCBflow functions, from the designer’s and manufacturer’s viewpoint, and how this database helps break down the wall between these stakeholders.
Elementary, Mr. Watson: Ensuring Design Integrity
03/28/2024 | John Watson -- Column: Elementary, Mr. WatsonBack in February, many of us watched the "Big Game." It reminded me of the saying, “It's not how you start that is important, but rather how you finish." It is perfectly okay when you are talking about sports, you get off to a bad first half and need to recover in the second half. However, when it comes to PCB design, this is not a good practice. If things start badly, they usually don't recover. They continue down that same path, costing more money and losing design time.
Arrow Electronics Launches Intelligent Vision Ecosystem
03/27/2024 | BUSINESS WIREArrow Electronics, Inc. is utilizing the onsemi Imager Access System (IAS) module standard for developing intelligent vision solutions for use in robotics, machine vision, commercial cameras and other uses.
Dymax Will Exhibit Light-Cure Solutions for Today’s Electronics at IPC APEX 2024
03/26/2024 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, will exhibit at the IPC APEX EXPO 2024 in Anaheim, CA, April 9-11.
Synopsys Announces New AI-Driven EDA, IP and Systems Design Solutions At SNUG Silicon Valley
03/25/2024 | PRNewswireSynopsys, Inc. kicked off its annual flagship Synopsys User Group (SNUG) conference in Silicon Valley at the Santa Clara Convention Center with a keynote presentation by Synopsys president and CEO Sassine Ghazi. Ghazi discussed the unprecedented innovation opportunities and challenges that technology R&D teams face in this era of pervasive intelligence.