Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Adura Solutions Exhibits at Delmar 2024

04/18/2024 | Adura Solutions
Sumit Tomar CEO of Adura Solutions has announced that his company will be exhibiting at this years Delmar Electronics and Manufacturing Show to be held at the Delmar Fairgrounds, San Diego, California April 24-25.

Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology

04/17/2024 | Real Time with...IPC APEX EXPO
Editor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.

Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper

04/17/2024 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality. 

Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

T-Global Technology Offers Solutions for Thermal Management Challenges

04/10/2024 | I-Connect007 Editorial Team
James Hopkins from T-Global discusses the company's focus on thermal management products, including thermal interface materials, heat sinks, and thermal simulation services. He highlights the importance of collaborating with mechanical engineers and addressing challenges in balancing thermal performance and mechanical requirements. Hopkins also mentions the role of thermal simulation in guiding product recommendations and the significance of early collaboration among stakeholders for optimal product outcomes.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in