Embedded Technology: It’s All Around Us


Reading time ( words)

In the early ‘80s, the PCB company I worked for was testing some of the first material for buried resistors. I can’t recall what customer it was for, or how far along the project got, but over the years it seemed like the technology was slow to be adopted and perhaps ahead of its time. Now, a lot of years later, embedded technology seems to be finally coming into its own—thanks to Moore’s Law and the ever-pressing need for more real estate on the circuit board surface. No longer just for the odd, expensive military product, buried components can be found in that most ubiquitous of consumer products, the smartphone, as you will learn in this issue. Who knew!

Back then, there were only buried resistors and from what I understand, the material was not cheap. Most uses involved either a need for extraordinary reliability or there was enough savings in reduced layers or improved abilities that would justify the cost. But there are other types of passives as well as buried active components. And the justifications are more complicated: signal integrity, greatly improved imaging capability which means more accurate resistive values, and always space, as in the required surface area of a circuit board.

We thought we would find out from our readers just how “popular” this technology really was. After all, as circuits get denser and lines/ spaces get smaller, it stands to reason that burying components would be an increasing requirement and they would be part of every complicated multilayer. From our recent survey, we learned that more than half the respondents saw very little embedded technology work and about 5% worked with it a great deal (


To read the full version of this article which appeared in the June 2017 issue of The PCB Magazine, click here.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/23/2021 | Andy Shaughnessy, I-Connect007
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.

Time, Space, Structure, and Model Analysis of CCL Price Increase

04/19/2021 | Hu Yang, Zhongtai Securities Research Center
According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.

PCB Sourcing Using PCQR2

03/30/2021 | Al Block, Naji Norder, and Chris Joran, National Instruments
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also achieving the lowest costs for your products. Considering each PCB supplier has their own niche in terms of equipment, process, and performance, uniform test data from the IPC-9151D Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements.



Copyright © 2021 I-Connect007. All rights reserved.