Nordson to Demonstrate Plasma Treatment, Automated Fluid Dispensing Systems at SEMICON China 2024
March 6, 2024 | Nordson Electronics SolutionsEstimated reading time: 1 minute
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.
Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. Equipment in the booth includes:
- The MARCH FlexTRAK®-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
- The ASYMTEK Vantage® fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet® valves, using Nordson’s patented jetting technology, Vantage can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.
Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of electronics manufacturing to enhance efficiency, precision, and reliability across your projects. SEMICON China will be held at the New International Expo Centre, Shanghai, China, March 20 – 23, 2024. Our booth #3645 is shared with the Nordson Test and Inspection division.
Suggested Items
Marcy’s Musings: The ‘Magic’ of Additive Processes
05/21/2024 | Marcy LaRont -- Column: Marcy's MusingsThough modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. Many PCB fabricators find themselves at a crossroads when deciding whether to change their current processes and go additive or stay the course until something significant compels a change. But change is on the horizon, and it seems to be driven by significant technological advancements in chips and advanced packaging, offering PCB fabricators some additive manufacturing solutions to explore.
Real Time with… IPC APEX EXPO 2024: Custom PCB Solutions With Adura
05/20/2024 | Real Time with...IPC APEX EXPOColumnist Dan Beaulieu and Sumit Tomar, CEO of Adura, discuss the company's comprehensive manufacturing of custom PCBs. The company excels in thermal PCB technology for enhanced conductivity. As Sumit explains, they also plan to venture into power management, leveraging their U.S.-based manufacturing capabilities.
Zentech First to Adopt IPC Apprenticeship National Program Standards
05/20/2024 | Cory Blaylock, IPCIPC achieved a landmark in 2023 by creating an apprenticeship program approved by the U.S. Department of Labor. With such a registered framework in place, industry can work through IPC to secure local, state, and federal dollars for workforce development in a way they’ve never been able to do before. Zentech Manufacturing, headquartered in Baltimore, Maryland, with production facilities in Bloomington, Illinois, and Richardson, Texas, is the first employer partner to adopt IPC’s national program. Click here to read their story.
Danutek Celebrates 20 Anniversary
05/20/2024 | DanutekDanutek, a leading supplier of capital equipment and service support to the electronics manufacturing sector in Europe, proudly marks its 20th anniversary this year.
GlobalFoundries Appoints KC Ang as President of Asia
05/20/2024 | GlobalFoundriesGlobalFoundries (GF) announced the appointment of industry and company veteran, Kay Chai (KC) Ang, as President of Asia and Chairman of China.