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iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

04/26/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.

Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period

04/24/2024 | Orbex
The UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.

Lockheed Martin Successfully Transitions Long Range Discrimination Radar To The Missile Defense Agency

04/23/2024 | Lockheed Martin
The Long Range Discrimination Radar (LRDR) at Clear Space Force Station in Clear, Alaska, completed DD250 final acceptance and was officially handed over to the Missile Defense Agency in preparation for an Operational Capability Baseline (OCB) decision and final transition to the Warfighter. In addition, prior to this transition, the system has started Space Domain Awareness data collects for the United States Space Force. 

AI Demand Drives Rapid Growth in QLC Enterprise SSD Shipments for 2024

04/23/2024 | TrendForce
North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers. This, in turn, is driving up demand for QLC enterprise SSDs.

Boeing's Janene Stinson Earns IPC Excellence in Education Award at IPC APEX EXPO 2024

04/22/2024 | IPC
The IPC Excellence in Education award was presented to Janene Stinson, Boeing, at IPC APEX EXPO 2024 in Anaheim, California, in recognition of her significant contributions to workforce development and leadership. 
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