Sanmina Adds High Speed Flex and Rigid Flex Circuit Assembly for Aerospace Applications
April 6, 2017 | PRNewswireEstimated reading time: 2 minutes
Sanmina Corporation today announced that its Backplane and Cable Division has developed new flex and rigid-flex circuit assembly capabilities for military and aerospace electronics equipment. This new technology combines the latest laminates, high performance mil-aero connectors and Sanmina's advanced circuit fabrication technologies. These advancements along with Sanmina's system design and manufacturing in AS9100C-certified circuit facilities give Sanmina's customers a complete solution for the most advanced defense and aerospace applications.
Flex and rigid-flex circuits have been used as a cost-effective interconnect system in mission critical defense and aerospace equipment for many years. As these systems evolve and data rates increase, performance requirements for interconnect become more demanding. High performance connectors are used, including D38999, D-Sub Micro-D and blind mate connectors. Flex circuit laminate materials have also evolved and with Sanmina's advanced processes can now be used with these high-speed connectors in demanding applications. The value of Sanmina's flex and rigid-flex technology in these applications results in a smaller form factor, reduced weight and cost savings. Sanmina's new flex and rigid-flex circuit fabrication technology is able to deliver data rates up to 10-15 gigabits/sec.
"Sanmina is proud to offer new technology to our customers that helps increase performance and reduce the size and weight of advanced military and aerospace products," said Alex Scroppo, Senior Vice President, Backplane and Cable Division. "We are pleased to be able to provide a complete technology and manufacturing solution to our defense and aerospace customers, a combination of services we believe to be unmatched in the industry."
Sanmina has been a technology innovator in high performance interconnect systems for many years. Sanmina offers a complete solution for backplanes, PCBs and flex circuits, including systems engineering, board design and layout, in-house laminate qualification, signal integrity, high speed connector analysis and failure analysis laboratories. Sanmina's global facilities are fully certified for defense and aerospace requirements including ITAR and AS9100C certifications, among others.
About Sanmina Corporation
Sanmina Corporation is a leading integrated manufacturing solutions provider serving the fastest growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina provides end-to-end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, storage, industrial, defense, medical, energy and industries that include embedded computing technologies such as point of sale devices, casino gaming and automotive. Sanmina has facilities strategically located in key regions throughout the world. More information about the Company is available here.
Suggested Items
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
Flex Receives Ericsson 2023 Supplier Sustainability Award
04/30/2024 | FlexEricsson recently awarded Flex with its 2023 Supplier Sustainability Award — the second time since 2021. The award recognizes the extended supply chain benefits from sustainable manufacturing operations in the Flex facility in Tczew, Poland, that runs on 100 percent renewable energy.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Real Time with… IPC APEX EXPO 2024: Insight into Summit Interconnect's Success
04/30/2024 | Real Time with...IPC APEX EXPOShane Whiteside, CEO of Summit Interconnect, discusses the company's recent recognition as one of the best PCB fabricators in the industry by receiving IPC's Peter Sarmanian award. Whiteside touches on the impact of changes in the marketplace, such as the Defense Production Act and presidential determination, on their growth. Whiteside also shares the company's focus on mechanical and data automation to enhance manufacturing processes and anticipates more automation and evolution in the industry.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.