BAE Systems Reveals Handheld Cognitive Electronic Warfare Technology for DARPA
September 27, 2016 | Business WireEstimated reading time: 1 minute
Through a contract from the U.S. Defense Advanced Research Projects Agency (DARPA), BAE Systems has developed a new lightweight, handheld tactical sensor that soldiers can easily carry and use to better understand radio frequency (RF) signals for enhanced situational awareness.
By using cognitive processing algorithms, this handheld electronic warfare (EW) technology can quickly detect and identify multiple interfering signals, such as jammers or enemy communication signals, across a wide spectrum and in changing and challenging environments. The new capability can be leveraged across multiple platforms and can integrate, for example, into a variety of EW, SIGINT, and signal receiver and communication systems, both large and small.
“By drastically reducing the size, weight, and power of this new cognitive EW system, we’re making it easier for our warfighters to be aware of, classify, and manage a wide range of signals in the battlespace, which is crucial for tactical situational awareness,” said Joshua Niedzwiecki, director of Sensor Processing and Exploitation at BAE Systems. “Better situational awareness on the battlefield means superior protection for our troops and a greater ability to defeat hostile threats.”
The technology was developed under DARPA’s Computational Leverage Against Surveillance Systems (CLASS) program and the Cognitive radio Low-energy signal Analysis Sensor ICs (CLASIC) program. This new handheld EW capability improves on today’s portable spectrum analyzers, which are often bulky, power hungry, and unable to handle interference or classify the signals they detect. Using advanced signal processing algorithms, BAE Systems radically reduced the time and the computing power needed to process detected signals to such an extent that the new system uses only one low-power chip. The result is a 10-times reduction in size, weight, and power compared to conventional spectrum analyzers.
During recent field tests, the new technology successfully detected and identified more than 10 signal types across a wide bandwidth in the presence of interference. The company expects to continue to mature this technology for eventual deployment within its EW, SIGINT, and tactical communications portfolios.
Suggested Items
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.