EIPC Technical Snapshot Review: Microvia Reliability Issues

June 22, 2021 | Pete Starkey, I-Connect007

Since the mid-1990s, when they were developed for mass production in the mobile phone industry, microvias have become principal enablers for high-density designs, and have evolved from single-level to complex stacked and staggered structures. They are fundamentally robust interconnects, although some aspects of their reliability are still under investigation.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

June 18, 2021 | Andy Shaughnessy, Design007 Magazine

It’s summertime here in Atlanta. The masks are gone, and my Hawaiian shirts are back in rotation! It feels like we’re getting back to normal. Speaking of normal, it looks like DesignCon, PCB West, SMTA International, and IPC APEX EXPO are good to go; they’re set to be live, in-person events, just like in the “olden days” of early 2020.


Just Ask... Featuring:

  • Responding to Questions about the Future of Electronics by Dr. John Mitchell
  • A Supply Chain Question answered by Dick Crowe
  • A Copper Shortage Question answered by Michael Coll
  • Question about Substituting Heavy Copper answered by Kim Sauer
  • An Alternative to Solder Question answered by Chuck Bauer and Joe Fjelstad
  • Achieving Finer Lines and Spaces on a Budget, a question answered by Eran Lipp and Yaad Eyila
  • A Simple Question Can Save You Time and Money by John Steinar Johnsen

Surface Prep and Protection Featuring:

  • Surface Prep vs. Cleaning Interview with Tom Forsythe
  • The State of the Coating Industry by Phil Kinner
  • Cleaning and Inspection by Graham Naisbitt
  • Cleaning and Coating Webinar Highlights by Phil Kinner
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