Dominique Numakura, DKN Research
Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.
Latest Column: EPTE Newsletter: Ten Years After Fukushima
IPC Education Foundation, IPC
Members from the IPC Education Foundation share updates on programs and activities.
Team NCAB , NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Cooler Cao, Cabletree Industrial Company
Cooler proves there's more to cable assemblies than meets the eye.
Latest Column: Global Connections: Staying in Spec
Christine Davis, Zentech
Christine shares lessons learned from 20 years running her own company.
Latest Column: Her Voice: Twice as Much and Twice as Long
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Bob Wettermann, BEST, Inc.
Bob Wettermann looks at the challenges in rework and repair, and provides strategies in addressing them.
Sagi Reuven, Siemens Digital Industries Software
Sagi Reuven offers PCBA manufacturers advice on Lean manufacturing with a focus on ROI and customers' stories.
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: How Familiar Are You with ESG?
Alfred Macha, AMT Partners
Alfred will provide insight into topics, including process validation, operational excellence, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more.
Duane Benson, Screaming Circuits
Duane offers tips and tricks for PCB assembly issues.
Latest Column: Powerful Prototypes: Small Computer Modules
Tom Kastner, GP Ventures, Ltd.
'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.
Latest Column: Punching Out: ‘If I Were 20 Years Younger’
Eric Camden, Foresite
Eric addresses PCBA reliability issues and how to prevent suspect conditions in the first place.
Latest Column: Quest for Reliability: Here We Go (Virtual) Again
Team Electrolube, Electrolube
Team Electrolube illustrates the best PCB design practices for optimizing the conformal coating process.
Michael Ford, Aegis Software
Michael writes about the Industrial Internet of Manufacturing (IIoT), Industry 4.0 and smart factories, and how these technologies are accelerating the electronics manufacturing industry.
Latest Column: Smart Factory Insights: Me and My Digital Twin
Dr. Jennie Hwang, H-Technologies Group
As an internationally recognized SMT authority, Dr. Hwang offers her perspective on a range of technical and process issues.
Ray Prasad, Ray Prasad Consulting
Ray writes about reducing costs - improving yields - and increasing reliability.
Greg Smith, BlueRing Stencils
A discussion of the fundamental concepts and principles in SMT stencils including the latest developments and technologies.
Chris Mitchell, IPC
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Chris Ellis, Manncorp Inc.
Chris will address common problems that Manncorp customers have had with the in-house conversion process and share solutions that have worked in the past.
George Milad, Uyemura International Corporation
George's columns cover PCB plating, IPC specifications, and more
Steve Williams, The Right Approach Consulting
A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.
Latest Column: The Right Approach: Leadership 101—The Law of the Lid
Bill Cardoso, Creative Electron
Dr. Cardoso will cover everything related to X-rays from cool historical facts to the latest in technological advancements.
Latest Column: X-Rayted Files: The Bright Side of the Chip Shortage
Zulki Khan, NexLogic Technologies, Inc.
Zulki Khan talks about new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.