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Material Witness: How About that Technical Roadmap!

You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.

CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms

I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.

Stretchable Inks: Changing the Wearables Market and the Landscape of Manufacturing

I-Connect007 Publisher Barry Matties and DuPont’s Steven Willoughby and Michael Burrows spoke recently and discussed new material for wearable electronics: stretchable inks. Wearable electronics is a fast growing sector of the electronics industry that is inspiring new and exciting products, as well as changing the requirements for becoming an electronics manufacturer.

Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II

Twenty-five years ago, solder paste residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were available, either with solvent or by using water, with or without detergent. Now, the assembly world is mainly no-clean: paste formulation is safer in terms of chemical reliability and process costs are reduced without cleaning.

A Conversation (and Day) with Joe Fjelstad, Part 2

In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.

A Conversation (and Day) with Joe Fjelstad, Part 1

I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.

Zentech: Expanding EMS Solutions and Supporting Innovation

Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.

Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”

I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.

UTC Aerospace Systems’ Lead PCB Designer Presents at Designer Day

I-Connect007 Guest Editor Kelly Dack sat down with Stephen V. Chavez, lead electrical designer for UTC Aerospace Systems, at IPC APEX EXPO Designer Day, to discuss Chavez’s presentation at the event. Chavez, who provides leadership to a global team of PCB designers, spoke on the importance of workplace communication with international teams.

Insitu: Moving Mountains in a Mountain Community

Nearly 800 employees build and support Insitu’s UAS line of ScanEagles, Integrators and ground stations. Boeing’s cameras captured the first images inside of Insitu’s new production facility, Eagle Point. Watch the video for a peek inside and learn more about where high-tech meets mountain height.


IPC's 2015 Technology Roadmap for the Electronics Industry

The 2015 edition of IPC's International Technology Roadmap for Electronic Interconnections is newly launched. Jack Fisher and Marc Carter explain what goes into putting it together, and how engineers and managers can use it to give an operational perspective on trends and developments in the next 2-5 years.

Multek CTO Excited About the Challenges of the Fast-Moving Wearables Market

I-Connect007 Publisher Barry Matties and recently-appointed Multek CTO Dr. Joan Vrtis sat down at IPC APEX EXPO to discuss the rapidly evolving wearables market, especially for medical, and the myriad questions that must be addressed. Other topics include Multek’s contribution to the wearables industry and what it sees as the main challenges to putting their circuits into various applications.

Quality Assurance Through Testing

The PCB Magazine columnist Todd Kolmodin of Gardien Services discusses the challenges related to the electrical testing of high-density PCBs, and what is required to meet IPC and military specifications.

Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015

At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.

Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans

I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.

Ingredients for Success at All Flex

Dave Becker from All Flex talks with guest editor Kelly Dack about the five Keys for success in PCB manufacturing, It’s not just the technology! You have to spend time on corporate culture. The five key ingredients are…

Drive a Car? You Can Fly a Typhoon!

The EIPC conference delegates see Eurofighter assembly at Airbus Defence and Space. The major attraction was the opportunity to see the final assembly line for Eurofighter Typhoon multi-role combat aircraft destined for the German Air Force. Editor Pete Starkey has a post-show review.

Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications

Embedded computing systems used in many military and avionics applications are trending toward higher heat fluxes, and as a result performance is being hindered by thermal limitations. This article outlines a series of passive thermal improvements that are easily integrated into legacy systems and can provide a 3-4x increase in dissipated power.

Rockwell Collins’ New RSR Transforms Customer Devices for Military

Rockwell Collins’ new Remote Secure Receiver, which was recently ordered by the Battlefield Airmen Office of the Air Force Special Operations Command, is the first of its kind and features the world’s smallest, lowest power, protected, secure and trusted military Selected Availability Anti-Spoofing Module (SAASM) GPS solution.

GD Digital Modular Quadruples Navy Network Comm Capacity

Built using open architecture standards, the DMR radios will continue to provide improved functionality and interoperability while accommodating next-generation communications waveforms like MUOS, the Integrated Waveform and future advanced network communications waveforms.


CES 2015: Preview and Predictions

Looking back over the last five years of CES and analyzing predictions and items featured by the large exhibitors, you'd likely assume the 2015 show would feature more advanced 3D TVs, as they were predicted to take over the market...wrong!

A Conversation with Canice Chung, TTM Technologies

We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.
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