EIPC Technical Snapshot: A European Roundup
Although it was originally proposed to hold a one-day face-to-face EIPC conference in Frankfurt, travel restrictions in Germany made this impractical. But the Technical Snapshot webinar format has proved so successful that it was decided to run an extended version as an alternative—two sessions, with three presentations each. It worked extremely well. The carefully selected program on February 23 featured excellent speakers, and seamless organisation added up to an outstanding event.
Finally! A Book About PCB Stackups
‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets
Pete Starkey interviews Mark Goodwin, COO of Ventec International, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market. If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
NASA Selects Developer for Rocket to Retrieve First Samples from Mars
NASA has awarded a contract to Lockheed Martin Space of Littleton, Colorado, to build the Mars Ascent Vehicle (MAV), a small, lightweight rocket to launch rock, sediment, and atmospheric samples from the surface of the Red Planet.
High-Voltage Circuit Design Guidelines and Materials
The Hubble telescope, the Cassini-Huygens mission, and other exploratory spacecraft utilize high-voltage DC power supplies for everything from vidicon camera tubes and mass spectrometers to radar and laser technologies. NASA has experienced performance problems with the 1.5 kV supplies because—as a 2006 report stated—“designers did not take the high-voltage problems seriously in the initial design.” The report cited very narrow parts parameters, electrical insulation problems in dielectrics, ceramics, bad geometries, small spacing, the use of the wrong insulating materials, and thermal expansion as causes for the power supply failures.
Real Time with... IPC APEX EXPO: Advocacy in Washington
Editor Nolan Johnson sits down for an interview with Chris Mitchell, Vice President of Global Government Relations at IPC. They discuss the industry's advocacy in Washington to educate Congress on our key issues, as well as the growth in global advocacy by IPC. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We just wrapped up IPC APEX EXPO 2022, and I think it went better than anyone could have expected. I wasn’t sure the live show would actually take place. With the COVID protocols in California changing daily, no one knew for sure that a live show would even be allowed to open. But here's my picks for the week, both from the show and from the industry.
EIPC Technical Snapshot: Considering Supply Chain and Defense
Continuing the highly successful series of EIPC’s Technical Snapshots, and featuring a programme that attracted a record attendance, the 14th online event was held on January 19. The opening presentation came from the ever-cheerful Didrik Bech, of Elmatica, who promised to provide thoughts and ideas about how to secure the supply chain to ensure compliance, not only to reduce the risks but also to increase the opportunities. Stan Heltzel from ESA Materials and Processes Section in the Netherlands gave a fascinating detailed insight into ESA’s approach to microvia reliability. And Liisa Hakola, senior scientist and project manager at the VTT Technical Research Centre of Finland gave the final presentation on how sustainability creates new opportunities for electronics industry.
Catching Up With RBP Chemical and Schlötter
It’s always great to see two very good companies form a mutually beneficial alliance. I was lucky enough to watch this particular strategic partnership come to fruition this year between RBP Chemical and Schlötter. I wanted to talk to both companies, so I sat down with Matthias Hampel, global executive representative-PCB and electronics at Schlötter, and Ernest Litynski, president of RBP Chemical Technology, to get the inside story.
Real Time with… IPC APEX EXPO 2022: Blackfox Mixes It Up with Training Opportunities
Andy Shaughnessy speaks with Jamie Noland, master IPC trainer and marketing manager for Blackfox Institute, about current and upcoming training opportunities and what you can expect from them at the show. Blackfox has expanded its offerings to reach a wider audience, including some very basic classes for beginners.
James Webb Space Telescope en Route to Discover Origins of the Universe, Study Exoplanets
A joint program between NASA and its counterparts in Europe (ESA) and Canada (CSA), Webb will observe the beginnings of our Universe by reaching back in time to just a few hundred million years after the Big Bang. It will also observe exoplanets – planets outside the Solar System – that are comparable to our own, as well as the formation and evolution of stars and galaxies. The ultimate aim of this successor to the iconic Hubble space telescope is to discover galaxies that reach back to the relative beginnings of the Universe. This state-of-the-art time machine is expected to revolutionize all aspects of modern astronomy. It will unveil the hidden side of the Universe, namely stars enveloped in clouds of dust, molecules in the atmosphere of other worlds, and the light issuing from the first stars and galaxies.
Catching Up with Allen Keeney of Johns Hopkins University
I have always been fascinated by research labs, especially those tied to major universities. These are the true leaders of innovation and invention and at the very top of the PCB industry. So, when I met Allen Keeney, chief engineer of the Advanced Electrical Fabrication Group at the Johns Hopkins Applied Physics Laboratory (APL) in Laurel, Maryland, I jumped at the chance to talk with him. You will enjoy this look at another facet of our PCB industry.
DoD Faces Growing Risks from Reliance on Lead in Electronics
Like a cancer that spreads untreated until it becomes an urgent problem, the U.S. defense community is facing a small but growing problem that is increasingly undermining U.S. military readiness and technological dominance. The problem is lead—specifically, the lead-alloy solders that traditionally have been used to attach electronic components to printed circuit boards (PCBs). Over the last 15 years, the commercial electronics industry has shifted to lead-free solders, prompted by environmental health regulations in Europe and elsewhere. However, the U.S. Department of Defense (DoD) and its contractors never made the switch and are still heavily reliant on leaded solders. Now, leaded electronics are becoming harder to find and more outdated.
Test and Inspection: Far Beyond Opens and Shorts
Gardien Vice President Todd Kolmodin talks about test and inspection market drivers from his perspective as a test service provider. Andy Shaughnessy and Happy Holden go down the “microvia rabbit hole” with Todd, as well as explore how OEM design requirements are driving test and inspection functionality and processes. When board layer counts and feature densities force longer test times, the tradeoffs to profitability for manufacturers become time and accuracy. Minimizing time while maximizing accuracy calls for new methods, which Kolmodin explains.
Nanoracks, Voyager Space, Lockheed Martin to Build First-Of-Its-Kind Commercial Space Station
Nanoracks, in collaboration with Voyager Space and Lockheed Martin, has been awarded a $160 million contract by NASA to design its Starlab commercial space station as part of the agency’s Commercial Low-Earth Orbit (LEO) Development program.
Happy Thanksgiving From the I-Connect007 Team
In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.
RBP Discusses New Management and Plans for the Future
Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.
All Flex Discusses Merger and New Medical Applications
I recently spoke with Jamin Taylor, vice president of sales and marketing at All Flex Flexible Circuits in Minnesota. We discussed the company’s recent merger with Printed Circuits Inc., and some creative new flex applications, including flexible heaters and catheters for the medical field. As Jamin explains, "It’s always interesting to see different technologies amongst different companies. We’re working on a few new applications and products, like being able to do some fine lines and flex materials, but with large format, a longer format than usual. Some of their capabilities with lasering and fine features really help with our long flex capability; when we merge the two, we see a new market being created for that technology."
Catching Up With ACI’s Bryan Ricke
I recently visited with Bryan Ricke, business development director for Advanced Circuitry International. Bryan has been in the industry for several years, including his current position at ACI. I wanted to learn more about the type of RF and antennas that his company builds. Truthfully, in all my years in the industry, I had not heard about his company. I thought that was very interesting. As Ricke said, "Many of the largest antenna manufacturers in the world are our customers, as well as many smaller companies producing RF/microwave products. We also work with a lot of universities. Our customers say they like our commitment and the way we service them."
Honoring Those Who Served
On this Veteran’s Day holiday, the I-Connect007 staff takes a moment to honor those men and women over the years, who served to protect and defend their country. Just on the I-Connect007 staff, we have loved ones who served, ranging from World War I to present-day active-duty military. The holiday isn’t intended to be a political statement, but rather a reflection on service, duty, and personal sacrifice. In some cases, the ultimate sacrifice. Our staff has submitted images of veterans who are near and dear to their hearts. Check them out!
New Look for Ground-breaking UK-led ESA Mission to Detect Climate Change
TRUTHS, which stands for Traceable Radiometry Underpinning Terrestrial- and Helio- Studies, will provide a gold standard reference for satellites observing the Earth, Moon, and Sun. Conceived by the UK’s National Physical Laboratory (NPL) and funded by the UK Space Agency, TRUTHS is being developed by the European Space Agency (ESA). The satellite will be built by the UK space industry led by Airbus UK, along with partners across Europe, including Greece, Switzerland, Romania, and the Czech Republic, who have also provided funding for the mission.
Lockheed Martin, Rafael Partner to Develop SPICE-250 Weapon System For US Military
Lockheed Martin and Rafael Advanced Defense Systems Ltd., of Israel, signed an expanded teaming agreement, allowing the team to jointly develop, market, manufacture and support Rafael's Smart, Precise Impact and Cost-Effective (SPICE™) 250 weapon system for sale in the United States and in Poland.
Nanoracks, Voyager Space, Lockheed Martin Teaming to Develop Commercial Space Station
Nanoracks, in collaboration with Voyager Space and Lockheed Martin, has formed a team to develop the first-ever free flying commercial space station.
Hear Sounds From Mars Captured by NASA’s Perseverance Rover
Two microphones aboard the six-wheeled spacecraft add a new dimension to the way scientists and engineers explore the Red Planet. Thanks to two microphones aboard NASA’s Perseverance rover, the mission has recorded nearly five hours of Martian wind gusts, rover wheels crunching over gravel, and motors whirring as the spacecraft moves its arm.
IBM, Raytheon to Collaborate on Artificial Intelligence, Cryptography and Quantum Technologies
IBM and Raytheon Technologies will jointly develop advanced artificial intelligence, cryptographic and quantum solutions for the aerospace, defense and intelligence industries, including the federal government, as part of a strategic collaboration agreement the companies announced.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In some weeks, readership numbers are pretty even, which means I make my picks based on “excellence” or “achievement” of some sort. Other weeks, you readers “go viral” on a few key news items, making the selection process numerically driven. This was one of those weeks. Here, then, are the five most-read news items. Of course, leading the way are our esteemed technical editors, Pete Starkey and Dan Feinberg. These gentlemen are examples of my opening statement, as both enjoy huge popularity with readers precisely because they are so good at reporting on the industry.
BAE Systems Acquires In-Space Missions
BAE Systems has acquired In-Space Missions, a UK company that designs, builds and operates satellites and satellite systems. The acquisition will combine BAE Systems’ experience in highly secure satellite communications with In-Space Missions’ full lifecycle satellite capability, to make a compelling sovereign UK space offer.
NASA’s Perseverance Rover Collects Puzzle Pieces of Mars’ History
NASA’s Perseverance Mars rover successfully collected its first pair of rock samples, and scientists already are gaining new insights into the region. After collecting its first sample, named “Montdenier,” Sept. 6, the team collected a second, “Montagnac,” from the same rock Sept. 8.
Catching Up With AMI’s Jim Barry
I met Jim Barry 25 years ago when we worked on a project at Eltek Ltd. Since then, I have followed his career with a great deal of interest, believing that he is one of the best technical sales professionals in our industry. When Jim recently accepted the position as vice president of business development at AMI right here in Maine, I knew it was time to catch up. Jim discusses the company's plans, including its move deeper into the milaero market.
£1.2 Million Fund Will Help UK Make Space Safer
One of the biggest challenges facing the space sector is orbital congestion and space debris. There are currently around 3,000 working satellites in orbit, and an estimated 130 million other pieces of debris, including old satellites, spent rocket bodies and even tools dropped by astronauts.
Lockheed Martin Opens Advanced Manufacturing Facility to Expand Orion Spacecraft Production
Lockheed Martin opened its Spacecraft Test, Assembly and Resource (STAR) Center. The STAR Center features business and digital transformation innovations that will expand manufacturing, assembly and testing capacity for NASA's Orion spacecraft program and ultimately, future space exploration.
Americans Embrace the Importance of Semiconductors to National Security
As Congress considers legislation that would fund domestic semiconductor manufacturing, design, and research initiatives, a new poll finds a strong majority of Americans understand the critical role semiconductors play in advancing U.S. national security.
Attention Researchers: Space, Suborbital, and Climate-Focused Technologies Wanted
NASA’s 2021 Tech Flights solicitation is now open! Tech Flights offers funding opportunities to researchers from U.S.-based industry, academia, and private research institutions to rapidly test technologies on commercial suborbital vehicles with awards up to $650,000 per awardee.
NASA’s Self-Driving Perseverance Mars Rover 'Takes the Wheel'
NASA’s newest six-wheeled robot on Mars, the Perseverance rover, is beginning an epic journey across a crater floor seeking signs of ancient life. That means the rover team is deeply engaged with planning navigation routes, drafting instructions to be beamed up, even donning special 3D glasses to help map their course.
Catching up With Siber Circuits
Siber Circuits is a Canada-based PCB fabricator doing most of its business in the U.S. and often with defense contractors, proving against the odds that it can be done. I spoke with the owner and president, Simon Etherington, about his company and why his long-time customers love working with them.
EIPC Technical Snapshot Review: Microvia Reliability Issues
Since the mid-1990s, when they were developed for mass production in the mobile phone industry, microvias have become principal enablers for high-density designs, and have evolved from single-level to complex stacked and staggered structures. They are fundamentally robust interconnects, although some aspects of their reliability are still under investigation.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s summertime here in Atlanta. The masks are gone, and my Hawaiian shirts are back in rotation! It feels like we’re getting back to normal. Speaking of normal, it looks like DesignCon, PCB West, SMTA International, and IPC APEX EXPO are good to go; they’re set to be live, in-person events, just like in the “olden days” of early 2020.
Increasing Productivity Through Training
Too often when we think of training our manufacturing workforce, we focus on the shop floor. We look for opportunities mainly with those who are doing the making. We need to cast a wider gaze as the manufacturing process is not limited to the manufacturing floor. Quality, engineering, sales and marketing, logistics, and even accounting/finance are all part of the process that starts with a business plan and culminates with your trinket in the hands of your happy customer. All departments make up that “well-oiled machine.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In case you’ve been on the beach with an umbrella drink in your hand, in industry news we saw the soft opening of a new laminate facility and more M&A activity in the PCB fab segment. And we ran some really great content from our contributors, with articles on how to save your company money and how to save yourself time in the design cycle. Plus, Editor Nolan Johnson channels his inner John Updike with his review of one of the most popular manufacturing strategy books ever, three decades after its publication.
Medical, Defense Face Shortage of Multilayer Ceramic Capacitors
Industrial, medical, and military demand for high-quality, high-voltage multilayer ceramic capacitors (MLCCs) has been hit hard by a shift in production by the world’s largest MLCC manufacturers who are focusing on a seemingly insatiable demand for smaller, lower voltage—and in some way—lower-performance MLCCs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Finally, it’s May. The snow has melted, the flowers are beginning to bloom, and summer is just around the corner. We’re slowly getting back to normal after the craziest year I can remember. And our industry is on the move! This week, we bring you a veritable seafood platter of articles and columns about PCB design, fabrication, and assembly.
IPC-2581 Revision C: Complete Build Intent for Rigid-Flex
With the current design transfer formats, rigid-flex designers face a hand-off conundrum. You know the situation: My rigid-flex design is done so now it is time to get this built and into the product. Reviewing the documentation reveals that there are tables to define the different stackup definitions used in the design. The cross-references for the different zones to areas of the design are all there, I think. The last time a zone definition was missed, we caused a costly mistake.
I-Connect007 'Just Ask' Q&A Compilation Available Now
Throughout 2020, we asked you to send us your questions for Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. You all had plenty of questions for these industry experts. The following is a handy compilation of your questions and their answers.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I’m sure it’s just me being hyperaware, but I can’t shake it: Mars is where it’s at right now. Is it just me, or do you get the same feeling from the news? There are the Mars rovers—three generations of them still rolling, now—and a drone helicopter winding up for a maiden flight any day now. But that’s not all. There’s SpaceX’s StarShip, rapid-prototyping its way into a manned flight to Mars. And NASA’s whole “return to the Moon” project is simply a shakedown for the U.S. government contractors’ Mars flight hardware, too.
Rooting Out an 'Us vs. Them' Mentality: An Interview with Laura Kriska
Earlier this year, I-Connect007 columnist Dan Beaulieu submitted a book review on "The Business of WE: The Proven Three-Step Process for Closing the Gap Between Us and Them in Your Workplace." As a follow up to that review, Dan has interviewed the book's author, Laura Kriska.
I-Connect007 Video: A Salute to The Industry
I-Connect007 has produced this new one-minute video to acknowledge nearly 35 years of sharing your stories. In 1987 we launched our first industry publication and we have been dedicated to covering this industry ever since. We did not start out as publishers: in fact, our background was in printed circuit board fabrication. In 1987 there were still nearly 3,000 PCB shops in North America. At the time, profits were goods, trade events included giant industry parties (remember the extravagant hospitality suites in Anaheim?), and the industry was in a state of change.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was a lot going on in the industry this week, and most of it happened at the virtual IPC APEX EXPO. Sure, it wasn’t the same as being in San Diego, but the show went pretty well, especially for a first-time event. There were a few technical snafus, but the IPC technical staff was responsive and took care of most of the issues right away. As I said a few months ago, how would you like to be in trade show management during a pandemic? So, without further ado, here are my top five stories from the past week.
Vertical Integration on the Rise
Alex Stepinski, founder and vice president of GreenSource, shares his thoughts after his presentation in the managers' forum at IPC APEX EXPO. Alex’s presentation focused on the vertical integration trend and zero waste. Alex has been a pioneer in zero waste since he opened Whelen Engineering Company's captive PCB fabrication shop in New Hampshire, a state that has strict regulations about manufacturing waste. Alex spun off GreenSource as a commercial venture two years ago, after visiting 50 factories in 19 countries, and flying over 1 million air miles.
Bonding Hybrid Multilayer Constructions at Rogers Corporation
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.
Focus on Smart Processes, Not Just Smart Factories
Nolan Johnson talks to Audra Thurston, Todd Brassard, and Meredith LaBeau about how Calumet is focusing on smart processes, and not as much on smart factories. While modern manufacturing equipment and next-gen technologies can be impressive, so much innovation still hinges on human beings. Calumet believes by investing in their workforce and instilling a culture of innovation throughout their company and supply chain, they’ll see faster advancement.
Catching Up With Sean McConville, Niche Electronics
Dan Beaulieu catches up with Sean McConville, vice president of business development at Niche Electronics, who shares his background in the industry, the strengths of his company, and how the pandemic has affected its business.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
I’m following the landing procedures for NASA’s Perseverance Mars lander as I’m finishing my Top 5 list for the week. The successful landing of the lander seems a nice highlight for this week. Our global aerospace programs, both national and private enterprise, make these missions seem almost, almost routine. They are, as we all know, anything but routine. No surprise, then, that aerospace-related news percolated to the top of mind for our readers this week.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We’re moving on into 2021, and there’s quite a bit going on in the world of PCB design, fabrication, and assembly. IPC APEX EXPO is fast approaching, and I know a lot of you will be attending, albeit virtually. In this week’s Top Five, columnist Eric Camden provides a how-to guide for PCBA technologists planning their IPC APEX EXPO schedule.
USPAE Launches $42M DoD Consortium
The I-Connect007 editorial team recently interviewed Chris Peters, Kevin Sweeney and Shane Whiteside, members of the U.S. Partnership for Assured Electronics (USPAE), about the award the association received from the Department of Defense to create the Defense Electronics Consortium. In this conversation, they discuss the objectives of the consortium, which was created to help the government identify and address potential risks in the electronics industry.
Wild River ISI-56 Platform Accelerates SerDes Testing
I recently spoke with Al Neves, founder and CTO of Wild River Technology, about the release of their new ISI-56 loss modeling platform. Al explains why it was so critical that this tool meets the stringent requirements of the IEEE P370 specification (which he helped develop), and why he believes this is currently the best tool for SerDes testing and characterization.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we have a variety of news and articles to share, and it’s all positive. We have a new president, and he’s pledging to help American businesses. December PCB sales were up 4.5% over the same period a year ago. Atotech is just about ready to launch an IPO. Sunstone has tweaked its free CAD tool, PCB123, to make it even easier for designers to receive their Gerber files. And columnist John Watson breaks down what we all learned during the chaos that was 2020.
Tech 2 Tech: KYZEN’s Short Technical Sessions a Big Hit
Nolan Johnson gets an update from Tom Forsythe on KYZEN’s Tech 2 Tech sessions. These brief 15-minute sessions were set up during the pandemic by KYZEN for customers, prospects, and new engineers around cleaning, and have since found traction with their manufacturers, reps and distributors.
Your Greatest Competition is Yourself
It really doesn’t matter who you think your external competitors are, because the only competitor that really matters is you. Of course, you will look externally to stay on top of latest trends, but when it comes to competition, just competing with yourself is a win. When you look at yourself as your greatest competitor you will start with a huge advantage: you already have great intel on how “your competition” thinks. Ask yourself, “What can I do to displace my ‘competitor’ and create something much better?”
Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 5
The following is an excerpt from Chapter 5 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It’s a new year, and time for new resolutions and new beginnings. “New year, new you” certainly is reflected in this past week’s news. We saw several announcements regarding mergers, acquisitions, and organizational changes, plus some government legislation to help kick off the new year. Based on viewing activity, readers were keen to keep up on the changes under way.
Tales from a Trailblazer: An Interview with Christine Davis
Columnist Steve Williams recorded a series of interviews with new I-Connect007 columnist Christine Davis, president and founder of contract manufacturer CAMtek, who recently joined Zentech Bloomington. As a female business owner in a male-dominated industry, Christine has a unique perspective on what it takes to thrive in the electronics industry, and shares some of her stories and lessons learned along the journey.
I-Connect007 Wishes You a Happy New Year
Could there be a more welcome year in recent memory than 2021? If there’s one thing most of us can agree on, it’s that we want 2020 squarely in our rearview mirror as we speed ahead with a fresh, new start. This past year has brought with it much reflection, change and even some consternation. Thank you for taking this journey with us!
Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s mainstream news was dominated—well, my personalized online news feed was, at least—by ballistics. SpaceX was in the news daily for lobbing multiple pieces of iron, even as their CEO took his household suborbital, leaving California and touching down in Texas. Pandemic numbers charts continue their skyward trajectory worldwide. The ever-present military tests and technology demonstrations, seemed a bit more commonplace this week as well. Worldwide political news, in general, seemed to follow parabolic curves like an Australian boomerang, veering off in unexpected ways only to suddenly cut a curving path and return.
Just Ask Tara Dunn: The Exclusive Compilation
We asked for you to send in your questions for Averatek’s Tara Dunn, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. And if you’d like to hear more from Tara, be sure to view her Flex007 column series “Flex Talk.”
Stephen Chavez and Happy Holden on Designing Reliable Vias
Andy Shaughnessy and Happy Holden speak with Stephen Chavez, a staff engineer with an aerospace company and chairman of the Printed Circuit Engineering Association (PCEA), about designing vias for greater reliability. They also address several areas where they can look to improve reliability, a variety of steps that designers should take to help ensure more robust vias, and some testing and educational resources that PCB designers and design engineers should be aware of.
Use of IMS Thermal Materials in Multilayer Stackups for Power Applications
This roundtable discussion brings together the expertise of Ventec International Group’s Global Head of IMS Technology Chris Hanson and Technical Manager Denis McCarthy. Rax Ribadia of Excello Circuits provides hands-on fabrication experience from a specialist PCB manufacturer, and I-Connect007 editors Andy Shaughnessy and Pete Starkey contribute to a conversation that explores applications, materials, design considerations, and mechanisms of heat transfer.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Well, it’s the last Friday in November. On any normal year in the U.S., this would be “Black Friday” because, for many retailers, the kickoff to the holiday season’s shopping spree is the source for most of the operating income for the year. While it remains to be seen how exactly how much traditional in-store and online retailing will rake in, with the varied pandemic lockdowns, it’s clear that readers wanted to get the latest electronics industry sales numbers!
Our Thanksgiving Wish
As we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.
IPS Expanding to Accommodate Growing Market
I recently had the opportunity to visit IPS in their Cedar City, Utah, facility, where Mike Brask, founder and president of IPS, shared his business strategy and gave me a tour of the expanding manufacturing facility. IPS produces a wide range of PCB manufacturing equipment, including plating, DES, VCM, VRPs, ventilation, and spare parts for older equipment.
The Heterogeneous Integration Roadmap for Aerospace and Defense
Most people in the semiconductor industry are familiar with the International Technology Roadmap for Semiconductors (ITRS), which provided guidance for the industry starting in 1991 (as the National Technology Roadmap for Semiconductors). As the benefits of Moore’s Law became more difficult and more expensive to achieve, the organization decided to publish a final version in 2016. The baton was handed to the Heterogeneous Integration Roadmap (HIR), with the realization that heterogeneous integration—assembling different types of devices rather than monolithic fabrication—is an important enabler for continued progress in the semiconductor industry.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
In my top five picks, we have news about columnist Tara Dunn moving to Averatek to work with their A-SAP additive processes, and an interview with Audrey Sim regarding the “hybrid” model adopted by the HKPCA for its upcoming Electronic Circuits World Convention. We also have a compilation of the questions that readers have asked Joe Fjelstad and news about DownStream Technologies adding support for flex, rigid-flex, and embedded component designs. Finally, we share a review of some of KYZEN’s new training sessions on cleaning electronic assemblies—virtual courses that pack a lot of information into 15-minute snapshots. Knowing how tight everyone’s schedules are now, 15-minute events might be the ticket.
