ELCOSINT - The Future of High Temperature Interconnect
The increasing need for electronic assemblies to endure high-temperature operating conditions in aerospace, automotive, oil and gas drilling, power management and renewable energy applications, whether those conditions involve high ambient temperatures, high cycle temperatures or high junction temperatures, is driving the development of high temperature interconnection technologies.
Perovskite Photovoltaics Excitement
Ultrathin, flexible, stretchable and lightweight versions have been produced by Johannes Kepler University in Austria powering a miniature aircraft and airship. With 100% yield, exhibiting 12% efficiency they are only 3μm thick and weigh 5.2g m-3. Organolead halide perovskites are promising because they absorb light more efficiently: thinner layers are needed. Researchers suggest it could power EIVs as robotic insects and drones, and its flexibility and stretchability could be useful in bio-electronics.
Fortifying Computer Chips for Space Travel
Space is cold, dark, and lonely. Deadly, too, if any one of a million things goes wrong on your spaceship. It's certainly no place for a computer chip to fail, which can happen due to the abundance of radiation bombarding a craft. Worse, ever-shrinking components on microprocessors make computers more prone to damage from high-energy radiation like protons from the sun or cosmic rays from beyond our galaxy.
Gary Ferrari Shares His Thoughts on PCB Design and More
Recently, I spoke with Gary Ferrari, director of technical support at Firan Technology Group, about numerous topics related to PCB design. Our conversation ranged from CID training to the need for reaching high school students as a way of introducing more young people to career opportunities in our industry. We also covered strategies for helping customers design and build better product, and keeping designers provided with the most critical part of their supply chain—information.
Could 'Windbots' Someday Explore the Skies of Jupiter?
A team of engineers at NASA's Jet Propulsion Laboratory, who wondered if a probe could be buoyant in the clouds of Earth or a distant gas giant planet, like Jupiter, has recently begun studying their question, thanks to a one-year, $100,000 study, funded by NASA's Innovative Advanced Concepts (NIAC) program.
A Look at the High-Reliability Interconnect Market
In an interview with I-Connect007, Mark Cormier of Miraco Inc. discusses his company's activities and capabilities, the latest trends and drivers in the high-reliability segment, and their strategies when it comes to managing their assembly work as well as their audit processes to find EMS providers.
Changing the Face of Displays…One Button at a Time
Michael Detarando, president and CEO of Incom, and Emilijo Mihatov, business development manager at Fairlight discuss with I-Connect007's Barry Matties how Fairlight is incorporating Incom's technology into their famous products for the recording and broadcast industries, along with other applications such as elevator control panels.
Avoid Overbuilding your RF Printed Circuit Board
Today, many companies are overbuilding and “overmaterializing” their RF printed circuit boards. In this interview, James Hofer of Accurate Circuit Engineering (ACE) shares some strategies to avoid doing both, which will help lower the total cost of your PCB and improve the overall product quality. Hofer also discusses some of the challenges in the laminate supply chain.
EIPC Summer Conference: Day 2
Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
EIPC Summer Conference, Berlin: Day 1
Berlin, capital of Germany and a world city of culture, politics, media and science, was the venue for the 2015 EIPC Summer Conference, which attracted delegates from sixteen countries, including Russia, Hong Kong, Japan, Israel, USA and Canada, as well as the European Union, to experience a programme of 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organisation.
American Standard Circuits’ Unique Offerings Contribute to Long-term Success
At the recent IMS RF and microwave show in Phoenix, Arizona, Anaya Vardya, CEO of American Standard Circuits, sat down with I-Connect007's Barry Matties to discuss the current market trends, the company's recent equipment investments, and where American Standard Circuits' growth will likely come from.
NEPCON China 2015 a Resounding Success in Shanghai
The three-day event was a complete success, bringing together nearly 22,000 trade visitors and high-quality buyers, as well as 450 leading brand names from 22 countries and regions worldwide. NEPCON China keeps up with market trends and gathers resources from all stakeholders to present a comprehensive event that covers SMT, new electronics materials, soldering, dispensing, electronics automation, measurement and other innovative technologies and products across the world.
Flexible Circuits and UAV Applications
The utility offered by flexible circuits in UAVs mimics the advantages that make it popular in other portable electronic applications: lightweight, thin, highly reliable, flexible during use, and an ability to electrically connect across multiple layers as part of a complete packaging interconnect solution.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
CyberOptics: Honing in on the High-Reliability Market with 3D AOI and SPI Platforms
I-Connect007 Publisher Barry Matties and CyberOptics’ Sean Langbridge spent time together in China recently, where they discussed, among other things, the company’s newest product launch, a 3D AOI and SPI platform. Langbridge also discusses the latest requirements for inspection.
Reliability Assessment of No-clean and Water-soluble Solder Pastes, Part II
Twenty-five years ago, solder paste residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were available, either with solvent or by using water, with or without detergent. Now, the assembly world is mainly no-clean: paste formulation is safer in terms of chemical reliability and process costs are reduced without cleaning.
A Conversation (and Day) with Joe Fjelstad, Part 2
In Part 2 of this multi-part interview series, Verdant Electronics Founder and CEO Joe Fjelstad, and I-Connect007 Publisher Barry Matties discuss the future of what’s to come for the electronics industry, which, according to Fjelstad, has a lot to do with where we’ve just been in our quest for lead-free manufacturing. He also offers his view on the natural order of the evolution of personal political persuasions.
A Conversation (and Day) with Joe Fjelstad, Part 1
I-Connect007 Publisher Barry Matties and industry veteran Joe Fjelstad, CEO and founder of Verdant Electronics, met recently to spend a day together enjoying the Evergreen Aviation & Space Museum (home of the Spruce Goose), located in the Oregon community of McMinnville. Their conversation ebbed and flowed between a wide variety of topics, from the electronics industry, to political shenanigans and the “war against failure.” In Part 1 of this multi-part series, Fjelstad introduces his “war against failure” idea, and what went terribly wrong in the advent of lead-free manufacturing.
Zentech: Expanding EMS Solutions and Supporting Innovation
Zentech CEO and President Matt Turpin sat down with I-Connect007 Publisher Barry Matties recently for a wide-ranging discussion of the state of both domestic and global manufacturing, and Zentech’s recent acquisition that will significantly expand the company’s capabilities. They also focused on supply chain issues, automation, regulations, and the importance of STEM education in the U.S.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.
UTC Aerospace Systems’ Lead PCB Designer Presents at Designer Day
I-Connect007 Guest Editor Kelly Dack sat down with Stephen V. Chavez, lead electrical designer for UTC Aerospace Systems, at IPC APEX EXPO Designer Day, to discuss Chavez’s presentation at the event. Chavez, who provides leadership to a global team of PCB designers, spoke on the importance of workplace communication with international teams.
Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015
At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
Rockwell Collins’ New RSR Transforms Customer Devices for Military
Rockwell Collins’ new Remote Secure Receiver, which was recently ordered by the Battlefield Airmen Office of the Air Force Special Operations Command, is the first of its kind and features the world’s smallest, lowest power, protected, secure and trusted military Selected Availability Anti-Spoofing Module (SAASM) GPS solution.