I-Connect007 Editor’s Choice: Five Must-Reads For the Week
It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet. Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.
Don't Blink: The IPC APEX EXPO Time-lapse
It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.
A Challenge Facing Aerospace Designers In 2023
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
It’s Here: The Launch of IPC Community Magazine
IPC Community Magazine launches today at IPC APEX EXPO 2023, both in digital and print form. It is now widely available for download at no cost. This magazine helps tell the stories of IPC, particularly for IPC members who use and interact with the trade organization. IPC worked closely with I-Connect007 (IPC Publishing Group) to develop the concept for the publication, and asked John W. Mitchell, president and CEO of IPC, to share a few thoughts as he looked at the magazine for the first time in print.
Durability and Cost Benefits Drive Mil-Aero Demand for OCPP
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
US, Japan Sign Space Collaboration Agreement at NASA Headquarters
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The youngsters are back in school, and we’re all back to work. The water is back on for most of us in Atlanta; when temps dropped down to 8 degrees Fahrenheit, our pipes started bursting left and right. After a Christmas dinner with no water, I have a new appreciation for H2O. It’s been a busy week, and we published a variety of articles, columns, and news items. In this week’s top five, we have news about the market in Southeast Asia, a look at what the CHIPS Act really entails, a deep dive into CMMC, and a peek at how printed electronics developers are using flexible circuit concepts to facilitate PEC. We also say goodbye to a Top Gun PCB designer who left us way too soon.
Ventec: Contextualizing the CHIPS Act
Nolan Johnson hears from Alun Morgan, Technology Ambassador at Ventec, and Mark Goodwin, Ventec’s COO, about the benefits and risks posed by new PCB-oriented legislation in the U.S. and Europe. Faced with a rapidly consolidating industry, especially in the face of mounting pressure from the Russia-fueled energy crisis, government intervention is a welcome prospect—as long as legislators are committed to addressing the full scope of the issue, including the supply chain’s migration to Asia. Ventec is hopeful that, having been called on to educate government officials on the challenges facing the industry, they will help spur future legislative changes that will protect and grow the industry’s interests.
Designing a Sustainable Future
While it may be traditionally considered a PCB fab and assembly show, IPC APEX EXPO is quickly becoming a destination for PCB designers and design engineers. Flipping through this year’s schedule, I counted 15 Professional Development and Technical Conference classes that focus on PCB design, as well as several fabrication classes that many of you should probably take. I checked in with Carlos Plaza, IPC’s senior director of educational development, to discuss the organization’s drive to present more PCB design curriculum at the upcoming show and how the show can give designers the tools they need to overcome the many challenges currently facing the industry.
Essemtec: Manufacturing Moves In-house
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.
ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.
Polar Instruments: Simulating PCB Potentialities
Nolan Johnson checks in with Polar’s Martyn Gaudion on the evolving needs of global PCB manufacturing markets in a post-pandemic world, where generating accurate PCB specification documentation is essential to successfully navigating today's rampant supply chain constraints. Polar has positioned itself to meet these needs through agile software product developments that allow OEMs and fabricators to simulate material interactions and end-product specifications, including in-demand features like a comprehensive "structure view" that allows users to visualize all the transmission lines on a given a PCB. Though keeping pace with the demands of a rapidly growing industry has been challenging, Polar's commitment to innovation has kept its software suite ahead of the curve.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Normally, the holiday season is a slow(ish) news time, but this year just feels different. My opinion is that the technology industry banked up a whole bunch of innovations and new products during the pandemic disruptions, which are coming to market as quickly as possible. The November/December news is full of technology discussion, as my selections this week clearly demonstrate.
An Opportunity to Give Thanks
I-Connect007 wants to take this opportunity to give thanks to so many people that make "the magic" happen day in and day out. Thanksgiving is a time, of course, to give thanks for the bounty that we enjoy, and that couldn't be truer each day for the support we receive in editorial, advertising, and marketing of our daily, weekly, and monthly publications. It's a pleasure to contribute to the industry—and to receive contributions. Read our Thanksgiving message and then enjoy your turkey day.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
PCB Carolina Breaks Attendance Record
PCB Carolina has been growing consistently for the past decade, and this year the show reached a milestone: more than 1,000 attendees. Yesterday, the show was the busiest I’ve ever seen it; I almost had to park off the NC State University campus. Fortunately, I’m an expert at “the parking lot game.” I waited until a guy was leaving and then I sniped his spot. Bam!
IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.
EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Where did the year go? I can’t believe we’re planning our January and February issues now. It was 84 degrees most of last week in Atlanta, and now it’s 31. I guess I should take my Hawaiian shirts out of rotation! This week we have quite a variety of articles for you. It’s officially show time and the industry is back in business in a major way. We have some news coming out of last week’s advanced packaging event in Washington, D.C., and an article about navigating SMTA International, which opens on Halloween this year in Minneapolis. We have a great column on avoiding EMI with good routing strategies, and an article on electrically conductive inks. To top it off, I-Connect007 has published a new book, written by Matt Stevenson of Sunstone Circuits, that posits a new “design for”: Designing for Reality. If you’re a designer, isn’t designing for reality what it’s all about?
EMA Helps Ease Designers’ Supply Chain Woes
Supply chain issues are continuing to cause disruptions in our industry, though lead times have dropped from astronomical to merely troublesome. In this interview, Chris Banton, EMA Design Automation’s director of marketing, explains how Cadence’s software has evolved as designers’ needs have changed in the past few turbulent years, including providing designers with component availability data early in the process.
PCB Legislative Update: HR 7677
Electronic industry association leaders like IPC, PCBAA, and USPAE have been trekking to Capitol Hill almost weekly this year to reinforce the dire state of the industry and seek additional co-sponsors for HR 7677, a bill supporting the American printed circuit board industry. However, with only 78 days until the end of the 117th Congress, it is not likely that anything will move by the end of this session.
IPC Advanced Packaging Symposium: An Urgent Need to Support Global Efforts
After two days of presentations, panel discussions, and impromptu hallway conversation at the IPC Advanced Packaging Symposium, one thing became clear: There is an urgency to support advanced packaging in all regions across the globe. The symposium, Oct. 11-12 in Washington, D.C., concluded with what seemed to be a great deal of expanded perspective for those who attended.
IPC Symposium: U.S. Must Address Critical Gaps in Advanced Packaging Needs
There is a significant capability gap in advanced substrate packaging in North America, forcing all semiconductors to be packaged in Asia and leaving North America at risk in its supply chain. This was a common theme during a two-day IPC Advanced Packaging Symposium, which launched yesterday at the Kimpton Monaco hotel in Washington, D.C.
Viasat, Inmarsat Confident their Combination Benefits Consumers
Viasat Inc. and Inmarsat remain committed to working with the UK’s Competition and Markets Authority (CMA) to demonstrate how their planned transaction will benefit airline, passenger, and enterprise users of In-Flight Connectivity (IFC) in aviation businesses.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
Michael Carano: A Focus on Process Control, Part 2
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.
The New World Order of JIC
The great business thought leader Margaret Heffernan commented that we are changing from just-in-time (JIT) to just-in-case (JIC). As we’ve worked our way through the issues of the past two years, the world is changing from a complicated to a complex system, and we must be prepared to face the challenges it brings. To survive today, we need the JIC mentality. We must be prepared for the unexpected. No longer can we rely on cycles and patterns to predict the future, or what we might be able to handle based on what that future brings. Now we must prepare for the unexpected. We must be flexible and able to adapt to whatever comes our way.
A Focus on Process Control, Part 1
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Designing Through Supply Chain Pain
Engineers are accustomed to the demanding challenges of designing for miniaturization, cost reduction, cross platform compatibility, and harsh environments. What has proven to be the most painful experience of my career (and for many of my colleagues) is the sheer lack of components from which to build our designs. Development cycles—commercial, industrial, medical, avionics—have been severely impacted, from large enterprise corporations to small design/integration companies. Awareness of the situation is the first step to understanding the underlying problems faced by today’s design engineers industry wide. Here are a few of the situations I have faced in the last year alone.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
A Deeper Look at the CHIPS Act Investment
In this interview with Chris Peters at U.S. Partnership for Assured Electronics (USPAE), Nolan Johnson seeks for better understanding regarding the implications of funding the CHIPS Act. Frankly, where and how will the $52 billion be spent? Who will decide how the funds are allocated? And surprisingly, who will benefit the most from this boost into the microelectronics industry?
IPC Advanced Packaging Symposium to Draw Industry, Government Representatives
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
There was some good news this week, as Republicans and Democrats managed to cooperate long enough to pass the CHIPS Act. Members of the House and Senate don’t usually act until they get worried about being voted out of office, so pardon me if I’m not ready to sing “Happy Days Are Here Again” just yet. But this is still really good news; the politicians are on the record now, and we can hold them accountable.
Excerpt: 'The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2'
As the second in this two-part series, The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art builds on the material presented in the first book by describing up-to-the-minute products and design techniques for thermal management with IMS.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters. This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
IPC, a global electronics manufacturing industry association, has acquired media company I-Connect007, a global source for news and original content serving the printed circuit design, fabrication and assembly/EMS markets.
PCB Finance Class With Jeff De Serrano
Class is in session! PCB Technologies President Jeff De Serrano takes us through some of the struggles of the PCB industry over the past 30 years, how U.S. legislation seeks to level the playing field, and whether a “monopoly” of fabricators is healthy for our industry. In his chat with Nolan Johnson, Jeff gets out his investment playbook and talks strategy. Don’t miss this one.
FLEX Conference 2022: If You Build It, We Will Buy It
Key presentations from companies like Boeing highlight FLEX Conference and Exhibition 2022, held in concert with the annual SEMICON West show this week in San Francisco’s Moscone Center. SEMICON West claims to be “North America’s premier microelectronics exhibition and conference,” uniting players across the entire electronics manufacturing and design supply chain.
Time to Get Serious About CMMC Readiness
Divyash Patel of MX2 Technology is a leading cybersecurity expert who’s sounding the alarm about getting your company into a state of readiness. But he’s not yelling fire in a theater. Whether it’s aligning with DoD’s CMMC, or just ensuring your company’s data and processes are protected, Divyash can see what’s coming. “This is a must-have compliance program,” he says. “It needs to be taken seriously and maintained.”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In more than one conversation while discussing the industry this week, the themes have included industry turmoil, lots of business opportunities, and the urgent need to build out to meet changing demands. In fact, our July issue of PCB007 Magazine, which publishes later this month, will focus on these very topics. It’s definitely one not to be missed!
These themes also emerged in this week’s top five news items as well. Top stories include an acquisition in the soldering machinery space, sales and service expansion in Mexico, industry data from SIA on semiconductor global sales data, and strong financial numbers from two China-based manufacturers. Now, with the U.S. Congress putting its focus on the PCB industry, things could really heat up. It’s going to be an interesting year.
The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act
In this IPC-created interview between Dale Curtis, IPC Advocacy Communications and Chris Mitchell, IPC VP Global Government Relations, the importance of the semiconductor and PCB manufacturing legislation moving through US Congress is highlighted.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
I-Connect007 is excited to announce the release of the second title in Ventec’s series on thermal management, "The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates, Volume 2." This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples, and focusing on specific solutions and enhanced properties of IMS.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Market news was certainly big this week. While the U.S. stock market continues make some large swings, the PCB and PCBA are doing their own dance with the numbers. We’re still feeling the effects of the pandemic, but it seems to be more about playing catch up. Still, the industry is showing some instability, both in positive and negative ways.
Review: Institute of Circuit Technology 2022 Annual Symposium
The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.
PCB Technologies' Subsidiary iNPACK to Exhibit at IMS Show
Jeff De Serrano, president of PCB Technologies USA, discusses the launch of their new company, iNPACK, which focuses on high-tech substrate technologies, microelectronics assembly, and electronics packaging. He details his plans to continue expanding InPack over the next year and to meet with customers and exhibit at the International Microwave Symposium Show in Denver June 19-24.
The Double-edged Sword of CMMC 2.0
For the past few years, those whose SMT provider organizations supply or contract with the U.S. Department of Defense (DoD) have been hearing about—or even gearing up for—implementation of the Cybersecurity Maturity Model Certification program, better known as CMMC. By this, I mean that you were gearing up for CMMC 1.0. Today, we have CMMC 2.0, and there are a number of changes in the new version that impact both the standards for compliance and how you certify that compliance—especially if you run a small business.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Things are heating up in the world of PCB design and manufacturing as well. In the past week, we published quite a bit of news—some good, some not so good. Some of the news is mixed, as we see with the EMS industry shipments rising YOY in April, but falling from the previous month. It’s nice to see NASA investing in American small businesses, but they didn’t really have a choice, did they?
NASA Supports Small Business Research to Power Future Exploration
NASA has selected hundreds of small businesses and dozens of research institutions to develop technology to help drive the future of space exploration, ranging from novel sensors and electronics to new types of software and cutting-edge materials. The project, funded by NASA’s Small Business Technology Transfer program, could help improve the efficiency of solar cells for space missions and use on Earth.
Jahr Turchan Discusses Blackfox's Training Scholarships for Veterans
Nolan Johnson recently interviewed Jahr Turchan, director of Veteran Services & Advanced Manufacturing Programs for Blackfox Training Institute. They discussed some of the new programs at Blackfox, including the Veteran Advanced Manufacturing Certification program. Thanks to programs like these, this is a great time for veterans transitioning into the manufacturing workplace.
PCB Technologies’ InPack to Focus on Miniaturization, Packaging
I recently spoke with PCB Technologies’ Jeff De Serrano, Yaniv Maydar, and Alon Menache about their new venture, InPack. They explain their plans to focus on advanced packaging, miniaturization, and other high-end technology, with much faster time to market, and they offer a view of the global market as well.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.
The Reality of Regulated Manufacturing
Nolan Johnson speaks with Ryan Bonner, CEO of DEFCERT, about government regulations for data and cybersecurity. A key component of moving to a digital factory will be to ensure security of the data required to operate a digital factory, and most importantly, customer design data.
Additive Design: Same Steps, Different Order
We recently spoke with Dave Torp, CEO of Winonics, about the company’s additive and semi-additive processes and what PCB designers need to know if they’re considering designing boards with these new technologies. As Dave explains, additive design is not much different from traditional design, but the steps in the design cycle are out of order, and additive designers must communicate with their fabricators because so much of the new processes are still proprietary.
Dave Hillman on Living Your Passion
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
DARPA Kicks Off Program to Explore Space-Based Manufacturing
DARPA’s Novel Orbital Moon Manufacturing, Materials, and Mass Efficient Design (NOM4D) program is underway with eight industry and university research teams on contract. The selected teams are tasked to provide foundational proofs of concept in materials science, manufacturing, and design technologies to enable production of future space structures on orbit without the volume constraints imposed by launch. All manufacturing would be done in orbital construction facilities and the results utilized in orbital applications.
Flexible Hybrid Electronics Design: Reducing Time to Market
Emerging innovations in the flexible hybrid electronics (FHE) domain are enabling new applications across multiple industries due to their highly flexible structures and additive manufacturing processes. The smaller form factor, lighter weight, and conformal capabilities are ideal for IoT edge devices in health and fitness monitoring, military asset identification and tracking, automotive displays and sensors, aerospace radar, and soft robotics. Significant industry research led by NextFlex is optimizing the processes from design through manufacture for FHE products.
José Servin Receives IPC Dieter Bergman Fellowship Award
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Doug Pauls, Collins Aerospace, Receives Dieter Bergman IPC Fellowship Award
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.
David Pogue: Is the Fear of Change Holding Us Back?
David Pogue, an American technology and science writer and TV presenter, sat down with the I-Connect007 Editorial Team after his keynote presentation at IPC APEX EXPO to talk about today’s technology, the breakthroughs that have shaped our current landscape, and whether fear of change and innovation is what’s keeping us from the next technological revolution. What do you think?
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
In the news this week we found a synchrony of topics. Much of the world is aware of the speaking points from U.S. President Joe Biden’s State of the Union address this past Tuesday. In that speech, President Biden talked prominently about U.S. legislation in process to bring more technology manufacturing back to the states. In fact, Intel CEO Pat Gelsinger was not only an invited guest, but was referred to directly in the speech as a positive example. I can only assume that President Biden meant that moment to be a motivator for other CEOs in the industry.
EIPC Technical Snapshot: A European Roundup
Although it was originally proposed to hold a one-day face-to-face EIPC conference in Frankfurt, travel restrictions in Germany made this impractical. But the Technical Snapshot webinar format has proved so successful that it was decided to run an extended version as an alternative—two sessions, with three presentations each. It worked extremely well. The carefully selected program on February 23 featured excellent speakers, and seamless organisation added up to an outstanding event.
Finally! A Book About PCB Stackups
‘The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design’ is the latest addition to I-Connect007’s comprehensive, educational library. In this book, brought to readers by Siemens Digital Industries Software and I-007eBooks, author and stackups expert Bill Hargin discusses materials, laminate datasheets, impedance planning, and more. This book provides the reader with a broader understanding of stackup planning and material selection in an effort to comprehend what Hargin calls “the design within the design.”
Real Time with… IPC APEX EXPO 2022: The Supply Chain and Markets
Pete Starkey interviews Mark Goodwin, COO of Ventec International, on the impact of the current supply chain condition. Their conversation also covers aerospace and the U.S. market. If you were unable to attend IPC APEX EXPO 2022, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
NASA Selects Developer for Rocket to Retrieve First Samples from Mars
NASA has awarded a contract to Lockheed Martin Space of Littleton, Colorado, to build the Mars Ascent Vehicle (MAV), a small, lightweight rocket to launch rock, sediment, and atmospheric samples from the surface of the Red Planet.
High-Voltage Circuit Design Guidelines and Materials
The Hubble telescope, the Cassini-Huygens mission, and other exploratory spacecraft utilize high-voltage DC power supplies for everything from vidicon camera tubes and mass spectrometers to radar and laser technologies. NASA has experienced performance problems with the 1.5 kV supplies because—as a 2006 report stated—“designers did not take the high-voltage problems seriously in the initial design.” The report cited very narrow parts parameters, electrical insulation problems in dielectrics, ceramics, bad geometries, small spacing, the use of the wrong insulating materials, and thermal expansion as causes for the power supply failures.
Real Time with... IPC APEX EXPO: Advocacy in Washington
Editor Nolan Johnson sits down for an interview with Chris Mitchell, Vice President of Global Government Relations at IPC. They discuss the industry's advocacy in Washington to educate Congress on our key issues, as well as the growth in global advocacy by IPC. If you didn't make it to IPC APEX EXPO, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
We just wrapped up IPC APEX EXPO 2022, and I think it went better than anyone could have expected. I wasn’t sure the live show would actually take place. With the COVID protocols in California changing daily, no one knew for sure that a live show would even be allowed to open. But here's my picks for the week, both from the show and from the industry.
EIPC Technical Snapshot: Considering Supply Chain and Defense
Continuing the highly successful series of EIPC’s Technical Snapshots, and featuring a programme that attracted a record attendance, the 14th online event was held on January 19. The opening presentation came from the ever-cheerful Didrik Bech, of Elmatica, who promised to provide thoughts and ideas about how to secure the supply chain to ensure compliance, not only to reduce the risks but also to increase the opportunities. Stan Heltzel from ESA Materials and Processes Section in the Netherlands gave a fascinating detailed insight into ESA’s approach to microvia reliability. And Liisa Hakola, senior scientist and project manager at the VTT Technical Research Centre of Finland gave the final presentation on how sustainability creates new opportunities for electronics industry.
Catching Up With RBP Chemical and Schlötter
It’s always great to see two very good companies form a mutually beneficial alliance. I was lucky enough to watch this particular strategic partnership come to fruition this year between RBP Chemical and Schlötter. I wanted to talk to both companies, so I sat down with Matthias Hampel, global executive representative-PCB and electronics at Schlötter, and Ernest Litynski, president of RBP Chemical Technology, to get the inside story.
Real Time with… IPC APEX EXPO 2022: Blackfox Mixes It Up with Training Opportunities
Andy Shaughnessy speaks with Jamie Noland, master IPC trainer and marketing manager for Blackfox Institute, about current and upcoming training opportunities and what you can expect from them at the show. Blackfox has expanded its offerings to reach a wider audience, including some very basic classes for beginners.
James Webb Space Telescope en Route to Discover Origins of the Universe, Study Exoplanets
A joint program between NASA and its counterparts in Europe (ESA) and Canada (CSA), Webb will observe the beginnings of our Universe by reaching back in time to just a few hundred million years after the Big Bang. It will also observe exoplanets – planets outside the Solar System – that are comparable to our own, as well as the formation and evolution of stars and galaxies. The ultimate aim of this successor to the iconic Hubble space telescope is to discover galaxies that reach back to the relative beginnings of the Universe. This state-of-the-art time machine is expected to revolutionize all aspects of modern astronomy. It will unveil the hidden side of the Universe, namely stars enveloped in clouds of dust, molecules in the atmosphere of other worlds, and the light issuing from the first stars and galaxies.
Catching Up with Allen Keeney of Johns Hopkins University
I have always been fascinated by research labs, especially those tied to major universities. These are the true leaders of innovation and invention and at the very top of the PCB industry. So, when I met Allen Keeney, chief engineer of the Advanced Electrical Fabrication Group at the Johns Hopkins Applied Physics Laboratory (APL) in Laurel, Maryland, I jumped at the chance to talk with him. You will enjoy this look at another facet of our PCB industry.
DoD Faces Growing Risks from Reliance on Lead in Electronics
Like a cancer that spreads untreated until it becomes an urgent problem, the U.S. defense community is facing a small but growing problem that is increasingly undermining U.S. military readiness and technological dominance. The problem is lead—specifically, the lead-alloy solders that traditionally have been used to attach electronic components to printed circuit boards (PCBs). Over the last 15 years, the commercial electronics industry has shifted to lead-free solders, prompted by environmental health regulations in Europe and elsewhere. However, the U.S. Department of Defense (DoD) and its contractors never made the switch and are still heavily reliant on leaded solders. Now, leaded electronics are becoming harder to find and more outdated.
Test and Inspection: Far Beyond Opens and Shorts
Gardien Vice President Todd Kolmodin talks about test and inspection market drivers from his perspective as a test service provider. Andy Shaughnessy and Happy Holden go down the “microvia rabbit hole” with Todd, as well as explore how OEM design requirements are driving test and inspection functionality and processes. When board layer counts and feature densities force longer test times, the tradeoffs to profitability for manufacturers become time and accuracy. Minimizing time while maximizing accuracy calls for new methods, which Kolmodin explains.
Nanoracks, Voyager Space, Lockheed Martin to Build First-Of-Its-Kind Commercial Space Station
Nanoracks, in collaboration with Voyager Space and Lockheed Martin, has been awarded a $160 million contract by NASA to design its Starlab commercial space station as part of the agency’s Commercial Low-Earth Orbit (LEO) Development program.
