Three New Mars2020 Rover Technologies: What Powers the “Body Parts” on the Mars2020 Rover?
The Mars2020 Rover Mission, designed by JPL, is the next NASA Mars Exploration Program mission that is planned to launch in 2020. Some goals of the mission include to check for past signs of life, to help prepare for manned Mars missions, and to collect soil samples of Mars back to Earth.
RTW IPC APEX EXPO: Ventec's Jack Pattie on New Materials, Industry Upswing
Ventec International Group’s Jack Pattie comments on continuing growth in sales, investment in manufacturing and distribution, and new product developments in polyimides, no-flow pre-pregs and thermally conductive materials.
EIPC’s Winter Conference in Lyon, France: Day 2 Review
The first day of the conference had started and ended in the dark—a long and technically intense day! After a convivial conference dinner and a good night’s sleep we were back on the bus, this time in daylight at the slightly later time of 8:00 a.m., for the journey from downtown Lyon back to Alstom’s conference facility in Villeurbanne, and it wasn’t raining. In fact, there was even some sunshine later in the day!
Blue Sky for Eagle Electronics
I recently had the opportunity to chat with the new director of sales and marketing at Eagle Electronics, Andy D’Agostino. I’ve visited Eagle before; they are endlessly busy, with good things going on, so I was happy when I learned that Brett McCoy was now COO and another fellow had taken over some of the sales and marketing activities. Andy comes with a wealth of experience and seems to have settled in nicely.
Part 2: EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
We continue with the rest of Pete Starkey’s report on Day 1 of the EIPC Winter Conference in Lyon, France. Included in this segment are presentations by Ventec, Ericsson, TTM and others, plus photos of their evening tour of Alstom.
EIPC’s 2018 Winter Conference in Lyon, Review of Day 1
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!
Designing Electronics for Harsh Conditions
We expect a lot from our products, especially our electronic products. Think about it: cellphones, wearables, medical devices—for some reason we think they should still work after being immersed in liquid, left outdoors in freezing temperatures or dropped on concrete from a standing position.
APCT’s Cartel Acquisition Adds Capacity, Technology and Certifications
APCT recently acquired Cartel Electronics and its affiliate, flex and rigid-flex maker Cirtech. During DesignCon 2018, I spoke with APCT President and CEO Steve Robinson about what this acquisition means for the San Jose-based fabricator.
A Conversation with Dorine Gurney, New President of Polar Instruments
Dorine Gurney has recently been named president of Polar Instruments. With a 30-year resume that includes management positions at Mentor Graphics, Lattice Semiconductor and Tektronix, she takes the reins as Ken Taylor heads into retirement. I recently caught up with Dorine at DesignCon 2018 in Santa Clara, California.
Making the Right Equipment Selection
For the January 2018 issue of SMT007 Magazine, we invited Kathy Nargi-Toth, president of Eltek USA, and Matt Turpin, president and CEO of Zentech Manufacturing to a discussion on the decision-making process for new equipment, and the key considerations for choosing the best machine solution for a process.
Cicor’s Approach to Miniaturization: Cost of Function, and More
Barry Matties spoke with Karl Heinz-Fritz, VP of technology, about Cicor’s newest product line, which can shrink the size of a circuit by up to 40%, and the importance of measuring the cost of functionality.
PCB Cooling Strategies, Part 1
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.
In Terms of Experience, a 10,000-foot View of China
In the past 30+ years of PCB manufacturing in China, you would be hard-pressed to find someone more connected to the pulse of the Asian market than Gene Weiner. Barry Matties met with the industry veteran at HKPCA to get his take on the show, the current and future market conditions of China, and any effect the new U.S. administration might have on trade relations going forward.
CES 2018, Augmented Reality and Much More
The actual CES show is spread across many locations in Las Vegas. The main exhibit halls are at or near to the Las Vegas Convention Center with three buildings, two floors each, all filled with hundreds of booths. Then there is The Sands Convention Center with multiple halls filled to the brim and hotels with their own convention centers and floors of exhibitor suites. With almost 200,000 in attendance, all locations are very busy.
Weiner’s World—December 2017
Hold on to your seats! 2018 will be a year full of rapid changes, surprises, and growth. M&A activities will flourish. The supply chain will suffer shortages and changes as demand increases, copycats will rush to market, and new markets and potential suppliers will vanish before they are established.
Automation and Traceability Critical for High-Throughput Probe Testing
Peter Brandt, atg’s director of sales for Europe, India and Japan, joined Barry Matties at productronica to share his views on regional variations in electrical testing requirements, automation, traceability, and how to anticipate and satisfy the future demands of the market. Group general manager Dr. Jochen Kleinertz also comments on the need for close cooperation with customers to guide the R&D effort.
What’s Coming in 3D Printing Technology in 2018
First, the arrival of extrusion metal printing. Today's extrusion printers are the most prevalent and, arguably, user-friendly 3D Printers in the market. Now, after years of there being zero metal extrusion printers, there will be two in the new year from Desktop Metal and Markforged. These technologies promise new materials and a higher degree of user friendliness for metal printing.
Three Perspectives for HDI Design and Manufacturing Success
Mike Creeden has been in the PCB design industry for more than 40 years now. In June 2003, he founded San Diego PCB Inc., a design bureau serving a variety of industries, including industrial, automotive electronics, medical diagnostics, internet of things (IoT), defense, aerospace, and communications markets. So, we asked Creeden to share his insights about HDI, and how designers and manufacturers can address those issues.
Equipment Matters in Solder Paste Printing
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.
Video from productronica 2017: Rogers Discusses Trends Driving Growth
Dirk Lefelon, European sales manager for Rogers Corporation, discusses his group’s final 2017 results. He also explains what the new year will bring, including increased investment in capacity for the European market, especially for the automotive segment.
The PCB Norsemen: Industry 4.0, AI and CircuitData
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
Nine Dot Connects: Good Design Instruction is a True Value-Add
Nine Dot Connects has certainly blazed an interesting trail. The company started out as an Altium reseller, but in less than a decade, Nine Dot Connects has also become a design service bureau and a provider of PCB design instruction, training, and consulting services. I recently interviewed Paul Taubman, technical services director for Nine Dot Connects. We discussed the company’s expansion from VAR to service bureau and content provider, and the changing landscape of PCB design instruction.
Leveraging Industry Shows to Create a Presence
At the recent SMTA International show in Rosemont, Illinois, I had an opportunity to meet with Mark Osborn, president and owner of Colonial Circuits, based in Fredericksburg, Virginia. Colonial Circuits is a supplier of PCBs, mainly for the defense industry.
New I-Connect007 Team Members Tour American Standard Circuits
Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.
Achieving the Perfect Solder Joint: The Many Perspectives on Soldering
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.
IPC Status Update: Training, Standards, and More!
At the recent IPC Fall committee meetings that are co-located with the SMTA International conference and show, IPC’s president and CEO, John Mitchell, sat down for a chat with me for an update on what’s happening at IPC.
Update on IPC’s Validation Services and Hints of What’s to Come
SMTA International is the perfect time to get updates on IPC happenings. One that I’m always curious about is the Validation Services programs. At the busy show, I managed to find a quiet spot so Randy Cherry, IPC’s director of Validation Services, could fill me in on the latest.
Patty's Perspective: (Signal) Integrity for All
Our topic this month is signal integrity, certainly a common one in our industry. Signal integrity is achieved by controlling impedance, so my advice is to do that. There, I’m done. Just kidding…of course I’m not done. But if you are in PCB manufacturing and you think this is just a design problem and doesn’t concern you, please think again.
RTW SMTAI: AIM's Dr. Mehran Maalekian Speaks on New Alloys for Harsh Environments
Dr. Mehran Maalekian, R&D Manager at AIM Solder, speaks with I-Connect007 Managing Editor Andy Shaughnessy about new alloys that are targeted for high-temperature and demanding applications, particularly in harsh environments, where standard lead-free alloy such as SAC will not perform as well.
Sensible Design: Thermal Management—The Heat is On
Thermal management materials are designed to prolong equipment life and reduce incidences of failure. They also maintain equipment performance parameters and reduce energy consumption by reducing operating temperatures, and minimising the risk of damage to surrounding components. Indirectly, they maintain brand reputation, as the reliability of the equipment will be very dependent upon the effectiveness of the thermal management technique used.
Hamed El-Abd: A New Beginning, Part 1
While in China recently, Barry Matties joined longtime I-Connect007 friend and contributor Hamed El-Abd of WKK to congratulate him on his upcoming retirement. They reflected on his time spent in the industry, specifically in China, how far it’s come, and where it might be headed next.
The International Paris Air Show with ASC’s Anaya Vardya
The International Paris Air show is the crème de la crème of the world’s trade shows. This is the big one, where all the aircraft, airline and defense aerospace companies meet to introduce new products, discuss the future of aviation, and make deals. This year I decided to talk to my friend Anaya Vardya, ASC’s president and CEO, about the show, why he goes and what it’s like.
DARPA’s Drive to Keep the Microelectronics Revolution at Full Speed Builds Its Own Momentum
To perpetuate the pace of innovation and progress in microelectronics technology over the past half-century, it will take an enormous village rife with innovators. This week, about 100 of those innovators throughout the broader technology ecosystem, including participants from the military, commercial, and academic sectors, gathered at DARPA headquarters at the kickoff meeting for the Agency’s new CHIPS program, known in long form as the Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies program.
New Challenges Facing Mil/Aero Segment
For this month's issue, we invited a sampling of professionals whose experience centers on the electronics industry in the military and aerospace world, including experts from design, PCB manufacturing, and the assembly arena to sit down with us for a frank discussion. Our discussion centered on the challenges associated with military work, including the new regulatory requirements for cybersecurity, dealing with leaded vs. lead-free components, and the differences and similarities with the commercial world.
Stephen V. Chavez Talks Mil/Aero PCB Design
Stephen V. Chavez, CID+, is the lead PCB designer for the Electronic Systems Center division of UTC Aerospace Systems (UTAS), a military contractor that builds all manner of cutting-edge tools for the American warfigher. He’s been designing military and aerospace PCBs for decades, and he’s a veteran of the United States Marine Corps. I caught up with Steph and asked for his thoughts on designing PCBs for the military and aerospace markets.
Trilogy Circuits: Mil/Aero Demands Technological, Regulatory Expertise
In the 16 years since its founding, Trilogy Circuits has become one of the go-to companies for mil/aero PCB design and manufacturing. I spoke with Charlie Capers, president and founder of the Richardson, Texas firm, about how he keeps ahead of the game. As he explains, succeeding with mil/aero PCB work requires not only mastery of the technological side, but of the regulations and certifications as well.
IMPACT Interview: Anaya Vardya, American Standard Circuits
I-Connect007's Patty Goldman spoke with Anaya Vardya, president and CEO of American Standard Circuits, a few days after the conclusion of IMPACT, especially wanted his views as a first-timer there.
Catching up with Prototron Circuits Tucson GM Kim O’Neil
This has been an exciting year for Prototron, which has achieved Mil-PRF-31032 and gone into the flex business. Most recently, Prototron received word that they had achieved their AS9100 Rev D, which made me want to check in with Kim O'Neil and find out more.
Strategies for Compliance with DoD Regulations Including ITAR and DFARS
ITAR is usually the topic when compliance with DoD regulations is discussed. But what about DFARS? This article will examine strategies one can implement to ensure that one is compliant with all DoD regulations, by analyzing internal and external factors in relation to procurement and compliance, and by asking the vital questions: what, how, where and to whom?
IPC: Department of Labor Releases RFI to Seek Information on Overtime Regulations
This week, the Department of Labor (DOL) released a Request for Information (RFI) to gather additional feedback from the public on the overtime regulations, which define and delimit exemptions from the Fair Labor Standards Act’s minimum wage and overtime requirements for certain executive, administrative, professional, outside sales and other employees.
Punching Out! Mid-2017 Report on the State of the N.A. PCB M&A Market
One of the most popular questions we receive concerns the market for M&A. Here is our take on the current market for PCB shops in North America. In general, the PCB market in North America is not growing, which means that to grow, shops either must take market share from others, or grow through acquisitions.
Perspectives from a First-Timer
Brad Heath, president and CEO of EMS company VirTex, is a first-time attendee of IMPACT Washington D.C. In an interview with I-Connect007 Managing Editor Patty Goldman, he talks about his impressions of the recent IMPACT Washington D.C. event, and how he thinks the industry benefits from such meetings with the policy makers in the government.
Performance Evaluation of Thin-Film Embedded Resistors
Thin-film microstrip circuits have been widely applied in microwave communications, electronic countermeasures (ECM), and aerospace applications, etc. When manufacturing thin-film ICs, it is very important to apply deposited thin-film resistor material to fabricate high-accuracy and highly stable thin-film embedded resistors. Thin-film ICs call for thin-film resistors that meet stringent requirements.
Using Lead-Free BGAs in a Tin/Lead Soldering Process
Several electronic market segments, such as those electronics used in harsh environments or that have life/system critical functionality, remain exempt from lead-free material restrictions such as the RoHS legislation. While these market segments can use solder containing lead, it is increasingly difficult to procure advanced components in non-ROHS compliant configurations. This article discusses several aspects of having lead-free BGA components in a tin/lead soldering process.
Mil/Aero Assembly Success
Davina McDonnell, director of marketing at Michigan-based EMS firm Saline Lectronics, discusses the latest technology and business trends driving the military and aerospace industries, the challenges in these markets—including supply chain issues such as obsolete parts and counterfeit components—and their strategies to stay ahead of the competition.
The Skills Gap – Meet People Where They Are!
A perennial concern in the U.S. electronics manufacturing industry is the lack of skilled talent in many parts of the country. According to a recent IPC member survey, most companies have a hard time recruiting qualified production workers, engineers, and other technical professionals.
Patty's Perspective: What Happens in Washington Doesn’t Stay in Washington—It Reaches All of Us
I went to my second IMPACT Washington, D.C. event this year (May 1–3) and, as much as I applauded last year’s event, this one far surpassed it—just ask anyone who was there. In this month’s issue, a special section on IMPACT backs that claim.
Mr. Laminate Tells All: PTFE is About to be Banned by IEC TC111
There, I said it. Technical Committee 111 of the International Electrotechnical Commission (IEC) is preparing to effectively ban PTFE (polytetrafluoroethylene) materials from electronics. As history goes, the electronics industry has focused on only two of the four halogens (bromine and chlorine) to be limited in order to be called “halogen-free” or more accurately “low-halogen.” But now, fluorine is being dragged down too, just because of its location in the periodic table.
Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
A printed circuit board is populated with a multitude of electro-mechanical components plus various active and passive devices such as transistors, capacitors, inductors and resistors, which enable the functionality and assembly of the PCB. Increasing the density of the components on the surface of a board enables greater functionality and use.
Today’s Mil/Aero Enemies: Counterfeits, Obsolescence and Failure
The need for high-reliability electronics, components and assemblies that can perform in harsh operating conditions involving extreme temperatures, vibration, and moisture continue to challenge electronics assembly providers catering to the military and aerospace markets. These are on top of current manufacturing issues such as the miniaturization of products, shrinking component sizes, higher density board assemblies, and the obsolescence of electronic components.
The Significance of the PCB in the Value Chain of the European EMS Industry
At SMT Nuremberg, Pete Starkey meets with Dieter Weiss, who comments upon the significance of the PCB in the value chain of the European EMS industry, and looks to a future where we embrace an open-minded attitude and a willingness to work together.
Happy Holden Second Recipient of I-Connect007 'Good for the Industry' Award
Our second 'Good for the Industry' award has been presented to Happy Holden. After working with Happy for a number of years it is clear to see that he is dedicated to improving the industry. He has a long history in the PCB industry, starting off with HP in the '70s. Not only did he develop HDI, but he then wrote the HDI Handbook, which is provided to readers at no charge.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Embedded Technology: It’s All Around Us
In the early ‘80s, the PCB company I worked for was testing some of the first material for buried resistors. I can’t recall what customer it was for, or how far along the project got, but over the years it seemed like the technology was slow to be adopted and perhaps ahead of its time.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.