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FlexFactor Program Informs, Inspires, Attracts, and Recruits Talent

Barry Matties and Nolan Johnson speak with Brynt Parmeter, Emily McGrath, Clarence Chi, and Mikayla Ridi about the NextFlex program FlexFactor. This initiative aims to help high school and college students see potential futures in the advanced manufacturing sector and combat common misperceptions young people might have about modern-day manufacturing.

Green Circuits' Three Tips to Be a Well-prepared Customer

Nolan Johnson speaks with Joe Garcia, VP of sales and marketing at Green Circuits, about how they can help on both the front and back end of the process, their hidden gem—design services—as well as three tips to be a well-prepared customer.

Communication and Information: Two Keys to Success

Nolan Johnson and Duane Benson, an I-Connect007 columnist and a representative from Milwaukee Electronics, discuss how assemblers can help their customers through submitting and maintaining accurate information, and engaging in open communication early and often about the highly important bill of materials.

Intelligent Healing for Complex Wounds

Blast injuries, burns, and other wounds experienced by warfighters often catastrophically damage their bones, skin, and nerves, resulting in months to years of recovery for the most severe injuries and often returning imperfect results.

BAE Systems' Next Generation HF Radar Technology to Be Developed in Laboratory

BAE Systems Australia opened a world class High Frequency laboratory in South Australia that will be used to develop new technology that will be ‘the brains’ of the upgraded Jindalee Operational Radar Network (JORN).

Incoming CEO Steve Pudles on the Acquisition of Zentech

Nolan Johnson talks to Steve Pudles about the recent acquisition of Zentech Manufacturing Inc. by BlackBern Partners LLC and Zentech management. Steve, also an investor in Zentech, steps in as the incoming CEO of the new organization and discusses the deal, his new role, changes to management, and the company's plans post-sale.

How Mission Control Used Robotics to Successfully Restore Full Power for the Space Station

Using complex robotic work to perform critical maintenance allows astronauts to spend more time working on scientific experiments and helps develop better technologies and procedures for future human and robotic exploration beyond low-Earth orbit.

Export Controls in Flux

U.S. export control rules have changed significantly over the last decade, and more changes are expected as policymakers tackle the treatment of new and foundational technologies and respond to geopolitical developments.

Catching up With Darrel Yarbrough of YES

Yarbrough Electronic Sales (YES) is one of the fastest growing contract manufacturers in the Southwest. As people get to know them better, they are becoming the go-to company in their area. In this interview, long-time industry veteran Darrel Yarbrough, owner of YES, provides a background about the company, its capabilities, and his outlook for the industry.

DARPA Tests Advanced Chemical Sensors

DARPA’s SIGMA program, which began in 2014, has demonstrated a city-scale capability for detecting radiological and nuclear threats that is now being operationally deployed.


Zentech's Mission-critical Tips for Program Success

Nolan Johnson and John Vaughan, I-Connect007 columnist and VP of sales and marketing at Zentech Manufacturing, discuss how to make customer programs successful through early communication, complete design packages, and more from a company servicing mission- and life-critical industries, including military, aerospace, and medical.

Super PCB's Jessica Zhang on LEDs and Other Trending Business Areas

In an interview with I-Connect007 at the recent West Penn SMTA Expo, Super PCB Program Manager Jessica Zhang provides an overview of the company and shares new business trends they're seeing, including LEDs, wearable devices, and more.

Small Eye in the Sky: Special Forces Will Soon Have New Enduring ISR Option

Combating counterinsurgency, conducting reconnaissance, collecting information vital to national security, United States Special Forces conduct some of the most sensitive and critical missions.

University Students Point to the Future in their Research

Cutting-edge automation, AI, machine learning, and Industry 4.0 are all part of the response to the increasing demands for printed circuit boards that are not only faster, smaller, and cheaper but also higher-frequency, lower-loss, more temperature tolerant, and higher reliability. In many cases, it will be unique and advanced research coming out of the university system that will help move the industry forward.

NASA ‘Nose’ Importance of Humans, Robots Exploring Together

NASA is sending humans forward to the Moon, this time to stay. Upcoming expeditions to the Moon will require making every moment of astronaut time outside the safety of the Gateway in orbit and lunar lander system on the surface count. Robotics will enable lunar crews to do more while minimizing their risk.

PCB Design Is All in the Family With Nicole Pacino

I shared a flight with Nicole Pacino on the way to Altium Live in Munich, and she mentioned that her father was speaking at the show. I went down the list of speakers, and it turned out that her dad is Mike Creeden of San Diego PCB. In Germany, I asked Nicole to tell us about how she got into this industry, and what we could do to draw more young people into this career.

IPC Working to Revive Lead-Free R&D in High-Reliability Sectors

Ask yourself the following question: Why is it that the aerospace, defense and high performance (ADHP) electronics sectors remain reliant on lead solders and components even as the commercial sector has largely phased out their use?

Which IPC-A-610 Class is Best for Your PCBA?

For many EMS providers, IPC-A-610 is the agreed standard to define what's acceptable and what's not in the world of PCBA production. As an OEM, it's important that you're clear on the basic principles that separate those classes so that you have a clear and realistic expectation of what the results are going to be.

Top 10 Most-Read SMT007 Articles for March

Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.

Designing Chips for Real Time Machine Learning

DARPA’s Real Time Machine Learning (RTML) program seeks to reduce the design costs associated with developing ASICs tailored for emerging ML applications by developing a means of automatically generating novel chip designs based on ML frameworks.


Nano Dimension Offers Update on Dragonfly 3D Printer a Year After Launch

The Nano Dimension Dragonfly 3D printer arrived in much fanfare a little over a year ago. The company has been selling them to customers around the world, many of whom are using them to print antennas, sensors, and PCBs. At AltiumLive in Munich, I asked Product Manager Robert Even to discuss what they’ve learned in the year since the Dragonfly debuted, and some potential uses for 3D printing technology.

Jennie Hwang: Get Ready for Disruptive Technologies

At IPC APEX EXPO 2019, Dr. Jennie S. Hwang, a columnist, author, and all-around an expert in PCB assembly, discusses some of the changes she has seen since joining the industry, and disruptive technologies that technologists we are going to have to face in the near future. Are you ready for the future?

SMTA Europe Electronics in Harsh Environments Conference 2019: A Preview

As a prelude to this year's Electronics in Harsh Environments conference, which will be held on April 2–4, 2019 in Amsterdam, Netherlands, SMTA Europe chairman Keith Bryant, supported by technical specialist Bob Willis, showcased the challenges and key issues faced by design and process engineers worldwide, in a webinar entitled "Harsh Environment Failures—Causes & Cures."

IPC Validation Services: New Programs and Updates

At the recent IPC APEX EXPO 2019 show, Randy Cherry, director of IPC Validation Services, gives Judy Warner an overview of a new IPC-1791 QML program focused on prime contractors and OEMs, and provides updates on existing programs.

IPC: Trump’s FY2020 Budget Plan Kicks Off U.S. Policy Debates

Within the last week, U.S. President Trump released his $4.7 trillion fiscal 2020 budget plan, kicking off the annual federal budget process. IPC is watching several budget debates that could impact the electronics industry and its supply chain.

NCAB Group on Supply Chain Issues

In an interview with I-Connect007, Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics.

Perspectives on Supply Chain Ripples

The ripples start at the very front of the process when the engineering and design team make their first choices about the performance characteristics for their project, then select components to fit their performance windows.

Words of Advice: What are Your Biggest Design Challenges?

In a recent survey, we asked the following question: What are your biggest design challenges? Here are just a few of the answers, edited slightly for clarity.

Digi-Key’s Dave Doherty: Tweaking the Supply Chain

In an interview with I-Connect007, Digi-Key COO Dave Doherty discusses supply chain disruptions and shortages and shares a number of ways in which Digi-Key is helping to smooth out the delivery of components even with the current turmoil.

RTW IPC APEX EXPO 2019: Five-year Standard Committee Collaboration on JS-001

David Hillman from Collins Aerospace and IPC's Teresa Rowe speak with Editor Dan Feinberg about how a seemingly simple question resulted in years of committee work to develop the JS-001 standard on the use of conformal coatings and avoiding tin whiskers.


Gene Weiner on the IPC APEX EXPO 2019 Automotive Executive Forum

Dan Feinberg spoke with Gene Weiner, president and CEO of Weiner International Associates, about IPC's history of forums, his thoughts on the Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019, and how the IPC Hall of Famers and the industry can help improve forum success.

Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program

At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.

NCAB Group on Supply Chain Issues

Wayne Antal, a key account manager with NCAB Group, discusses supply chain issues, the effect he sees on PCB fabrication channels, and how his customers are adapting to the new business dynamics. This is part one of a two-part conversation with Antal.

RTW IPC APEX EXPO 2019: Lenthor Discusses Facility Expansion and New Equipment

Rich Clemente, general manager of Lenthor Engineering, discusses with Dan Feinberg, I-Connect007 Guest Editor, the company’s expansion and new facility and equipment. He also talks about his outlook for the electronics manufacturing industry in North America.

Can E-waste and Metals Recovery Efforts Lower Environmental Risks and Liability?

Gold, palladium, silver, and other precious metals (PMs) in manufacturing wastes represent high value, but how PMs are recovered can pose environmental and liability issues. Aerospace and electronics manufacturers and suppliers, in particular, produce volumes of manufacturing wastes that contain varying levels of PMs.

Award-winning Koh Young Process Optimizer

Joel Scutchfield, sales director with Koh Young America, discusses the company's outlook and new product offerings for 2019, including their Koh Young Process Optimizer (KPO), which won an award at IPC APEX EXPO 2019 for the process control software category.

Super Dry Storage Options to Manage Intermetallic Growth

Guest Editor Kelly Dack speaks with Richard Heimsch, director of Super Dry, about some of the differences between storing components and other materials for assembly floor storage versus long-term storage, and how Super Dry can help combat intermetallic growth.

RTW IPC APEX EXPO: Zentech on the Fourth Pillar of DoD Acquisitions, and NIST

Steve Williams speaks with John Vaughan, VP of sales and marketing for Zentech, about their dominance in the military/aerospace market sector, the new "fourth pillar of DoD acquisitions," and how companies that do not take the NIST initiative seriously will be quickly left behind.

RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables

Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.

IPC APEX EXPO 2019 Show Week Time-lapse Video

From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.


RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions

Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.

CES 2019: More Show Floor Favorites

In my final piece covering CES 2019, I will review more automotive technology, updates on 3D printing, and some trending devices such as smartwatches and new computer components for those that either need or just want to have extremely powerful and impressive-looking computers.

RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management

Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.

Happy Anniversary, Gerber Format: Looking Ahead to Digital Innovation

This year, we celebrate the 55th anniversary of the introduction of the Gerber machine language format. We can thank H. Joseph Gerber, the man who took manual PCB design to the next level with the automated photoplotter, for giving us this format in 1964. Gerber immigrated to the United States in 1940 with his mother following the death of his father during the Holocaust. Gerber started Gerber Scientific Instrument Company in 1948 to commercialize his first patented invention—the variable scale.

Army Researchers Explore Benefits of Immersive Technology for Soldiers

The emergence of next generation virtual and augmented reality devices like the Oculus Rift and Microsoft HoloLens has increased interest in using mixed reality to simulate training, enhance command and control, and improve the effectiveness of warfighters on the battlefield.

ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think

At the recent HKPCA show, I sat down with ESI’s Chris Ryder, director of product management—HDI—to discuss considerations for choosing a new laser system, and how ESI uses its decades of flex and rigid-flex drilling experience to help guide customers in their decision-making process.

Words of Advice: Streamlining Your Design Process

In a recent Design007 Survey, we asked the following question: What would help you streamline your design process? Here are just a few of the answers, edited slightly for clarity.

Top 10 Most-Read PCB007 Interviews of 2018

Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.

Dock Brown on Succeeding at Failure Analysis

Dock Brown of DfR Solutions gave a keynote speech at SMTAI, “Requirements for Both Cleaning and Coating to Building Medical Hardware.” Barry Matties and Happy Holden sat down with Dock to discuss the current trends he sees in failure analysis, the concept of “rules versus tools,” and how predictive engineering software used early in the design cycle can help predict failures in components and microvias and drive cost down.

Randy Burcham Discusses New Techniques for BOM, Daughterboards

During AltiumLive, I spoke with IOTA Engineering's Randy Burcham, who taught several classes during the event. He explained his methodology for filtering BOM data as well as his new approach to working with daughterboards and how he was up and running on Altium tools after only three days.


SMT Electrolytic Capacitor Solder Joint Criteria and Integrity Investigation

The body configuration of SMT electrolytic capacitors results in the solder joints being only partially visible for optical inspection purposes. Therefore, the use of adequate reflow soldering processes is critical for producing solder joints that are acceptable for their end-product use environment.

Defense Speak Interpreted: PERM—Pb-free Electronics Risk Management

In this column, we explore PERM—the Pb-free Electronics Risk Management Consortium. No, the group members do not all have curly hair! The name was chosen around 2008 by a group of engineers from aerospace, defense, and harsh environment (ADHE) organizations.

New Foldable Drone Flies through Narrow Holes in Rescue Missions

A research team from the University of Zurich has developed a new drone that can retract its propeller arms in flight and make itself small to fit through narrow gaps and holes. This is particularly useful when searching for victims of natural disasters.

Martyn Gaudion on Signal Integrity Modelling and Stackup Tools

The accuracy of signal integrity modelling continues to improve, and stackup tools are becoming widely used, which now include material suppliers' datasheet information. During the recent electronica show in Munich, Germany, Martyn Gaudion, managing director at Polar Instruments, explained how Polar often serves as a bridge between PCB design and fabrication, and why educating his customers is so critical.

Technology Ambassador Alun Morgan

Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Space Communications and Navigation: Supporting Exploration

NASA spacecraft have studied Earth and the surrounding universe for more than 60 years, making ground-breaking discoveries and enabling human exploration. From hundreds, thousands and millions of miles away, these spacecraft must send their critical information back to Earth and the scientists who can use it.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Tempo Automation's Open House Raises the Curtain in San Francisco

Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.

150+ Years of Experience: Reflections with Three Industry Icons

You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.

DARPA Unveils 2019 AI Colloquium

Throughout DARPA’s history, artificial intelligence (AI) has been an important area of groundbreaking research and development (R&D). In the 1960s, DARPA researchers completed some of the foundational work in the field, leading to the creation of expert systems, or the first wave of AI technologies.


Christine Pearsall on Tempo Automation and PCB West

Christine Pearsall, senior director of marketing for Tempo Automation, discusses with Consulting Technical Editor Tim Haag what services Tempo Automation provides, what attracts engineers and designers most to the company, and what events they plan to attend in the upcoming year.

Increasing Productivity for Flex Fabricators

Barry Matties and Nolan Johnson of I-Connect007 met with Shane Noel and industry veteran Mike Jennings of ESI to discuss the introduction of their CapStone laser tool, a product aimed at doubling their flex circuit fabricators’ throughput. Mike also shares advice for fabricators who are looking to move into the ever-growing flex market.

IPC Workforce Pledge Draws White House Praise, Points the Way to Jobs of the Future

President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.

Substrates for Advanced PCB Technologies: What Will the Future Hold?

The UK chapter of the global IMAPS community of electronics and microelectronic packaging engineers shared a wealth of knowledge and wisdom about PCB substrate technology trends, developments, and future requirements in a webinar on the first of November.

Catching up with... HSIO Technologies President James Rathburn

Dan Beaulieu checked in with HSIO Technologies President James Rathburn recently to see what he and his team are up to and learned how they are using liquid crystal polymers and other materials to focus on increasing high-speed and high-density PCBs for uses in all markets.

IPC Signs White House Pledge to the American Worker

IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.

Pros and Cons of Dual Sourcing

Now, more than ever, there's a need for responsive and flexible supply chains. For OEMs, one solution to mitigate the risk of supply chain disruption is to maintain relationships with more than one supplier through dual sourcing—the practice of purchasing a chosen raw material, product, or service from two (or sometimes multiple) sources. Here are it's pros and cons.

Rick Hartley is Bullish on PCB Design, 3D Printing

At the recent PCB West in Silicon Valley, Consulting Technical Editor Tim Haag met with long-time design industry veteran Rick Hartley to discuss the changing landscape of circuit board design, the layout designers of the future, and how designers can benefit from 3D printing of circuit boards.

Additive Electronics: PCB Scale to IC Scale

SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.

RTW SMTAI: MacDermid's Lenora Clark Talks Automotive Electronics Trends

Lenora Clark, director for end-user applications at MacDermid, discusses some of the trends happening in the automotive electronics industry. She talks about how her company is educating their customers in the automotive electronics sector on the available technologies in other markets such as military and aerospace, telecommunications—even the handheld market—and how they can adopt these technologies in their industry.


Taking an Independent Path: Strategies for Low Risk Sourcing of Components in a Constrained Market

Today, the challenges of a highly stressed supply chain are forcing many OEMs and EMS providers to rethink the way they source components. With parts such as multilayer ceramic capacitors (MLCCs) and other low-cost components in chronic shortage with extended lead times for delivery, manufacturers must be able to get these parts on-time at the lowest possible cost without assuming additional risk.

The Changing Shape of the HDI Market

With more mobile device designers looking to utilize the benefits of FOWLP and other direct attach package types, a new generation of HDI PCBs is already in the market. Targeting less than 30 mm features and based on mSAP techniques, these substrate-like PCBs make use of the latest high-end manufacturing processes and materials, to enable the next evolution in advanced HDI boards.

Cadence: Bullish on AI

David White has been involved with artificial intelligence research for almost 30 years. Now, David is the senior group director of R&D for Cadence Design Systems, and I knew we’d have to speak with him for this issue on AI. In a recent interview, we discussed his decades of work in AI, Cadence’s research into AI and machine learning, and what he believes AI could mean for the EDA tools of the future.

Institute of Circuit Technology Hayling Island Seminar

After an extreme summer heat wave had left trees dehydrated and struggling to morph into their customary display of reds and golds, the leaves were brown and brittle as the great and good of the UK printed circuit board industry crossed the bridge from the mainland of the south coast of England to Hayling Island for the autumn seminar of the Institute of Circuit Technology on September 20, 2018.

GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions

Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.

Defense Speak Interpreted: Defense Electronic Supply Chain Issues

On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.

SLP: The Next Level of Technology

As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?

XR Update: Emerging Realities

The rate of advance in the use of XR—the term now being used to cover AR (augmented reality), VR (virtual reality), and MR (mixed reality)—in many areas, along with advances in the hardware and network capability supporting the use of XR, is accelerating. And because things are moving so quickly, here's a quick review and an update on recent developments in this field.

Artificial Intelligence: More Questions than Answers

I’ve been covering artificial intelligence (AI) and related technologies for years, particularly at events such as the annual Consumer Electronics Show (CES). As I write this, we are in the run-up to CES 2019, and the Artificial Intelligence Conference in San Francisco, so the AI landscape is likely to change—at an ever-accelerating rate. Let’s look at some of the challenges facing AI now, and then after CES 2019 we can take another look.

The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors

I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”


Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.

PCBs Are Moisture-Sensitive Devices

Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.

Reliability Takes on a New Urgency

Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.

Atotech on Challenges and Opportunities in PCB Manufacturing

Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.

PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective

The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.

IMPACT on DIVSYS and NWSC Crane

I-Connect007's Patty Goldman has known DIVSYS’ Stan Bentley for many years, having met when the company was called Diversified Systems and they made circuit boards and finished products at their facility in Indianapolis. They saw each other at IMPACT recently, and of course had to have a chat.

Calumet Electronics on IMPACT 2018

This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.

Best Practices to Achieve Zero Defects

To ensure that a complex electronics build can be completed on time, on budget and with zero defects, here is a list of checks and balances that will help you with adjustments or corrections real time, instead of discovering them at the end of the build or worse, when it's already arrived at the end user.

Alpha's Revolutionary Approach to Low-Temp Soldering

In an interview with I-Connect007, Morgana Ribas discusses the new technology on low-temperature solder that she has developed at Alpha Assembly Solutions. She also talks about why there is a need for a low-temperature process and the benefits it offers.

Agfa: Staying Ahead of the Technology Curve

In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.


IMPACT Washington D.C., 2018 with Juki Automation’s Bill Astle

I-Connect007's Patty Goldman caught up with Juki Automation’s Bill Astle during a luncheon on the last day of IMPACT Washington D.C., 2018. As a first-time attendee, Bill came away feeling like he made the right connections with key members of Congress, and he looks forward to returning to the event in the future.

An Owner’s Positive Take on IMPACT 2018: American Standard Circuits’ Founder & Chairman Gordhan Patel

During a full day at IMPACT 2018, I had a chance to speak with American Standard Circuits’ founder and chairman Gordhan Patel. We had much to talk about after listening to several speakers from the departments of Defense and Education, and the International Trade Administration.

Welcome to the Silicon Valley Neighborhood: Nano Dimension Arrives in California

I-Connect007 Technical Editor Dan Feinberg accepted an invitation recently to tour Nano Dimension’s new USA headquarters in Santa Clara’s Silicon Valley, which included a sit-down with President and Co-Founder Simon Fried.

EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1

Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.

It’s Time to Retire ROSE Testing

Over the last two to three years, there has been considerable discussion within various IPC committees about the role of the ROSE test in today's assembly environment. The transition from predominantly water wash processes to "no clean" has meant the advent of very different flux compositions. The question has been posed as to whether the ROSE test is still a viable option for evaluating PCB and PCBA cleanliness.

Excerpt: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals

The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.

5G—Generation after Generation

If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).

Catching up with Fineline-Global N. American CEO Eran Navick

After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.

APCT Moves into Rigid-Flex with Cartel, Cirtech Acquisition

When I spoke with APCT President Steve Robinson a year ago, he said he was interested in adding flex and rigid-flex capabilities, and working closely with designers and engineers. With the recent acquisition of Cartel and their subsidiary Cirtech, APCT now has a flex and rigidflex facility, along with military and aerospace certifications. At DesignCon 2018, I asked Steve to discuss these acquisitions and what they mean for APCT and their customers.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.


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