What’s New with IPC’s Validation Services
During this year’s IPC Fall Committee Meetings, held in conjunction with SMTAI in Chicago, I met with my friend Randy Cherry, director of IPC Validation Services. Since the inception of Validation Services three years ago, I’ve conducted video interviews with Randy at IPC APEX EXPO, and I've been tracking the growth and progress of this program. I decided that this would be a great opportunity to do a mid-year check-up on IPC’s Validation Service programs.
Tech Talk: 225 Tech Talks—1995 to 2016
Checking back on Tech Talk Nos. 100 and 200, which reflected on past and anticipated future changes in electronic packaging, I noted the production shift to Asia, followed by the relocation of the supplier base, and, more recently, the design of electronic devices.
All About Flex: Specifying a Flexible Circuit
IPC has created a specification document, IPC 6013, which is referenced for many flex circuit applications. This commercial document, in combination with the CAD data and print, is used as the product specification. Most flexible circuitry fabricators’ internal quality standards are based on IPC 6013.
Patty’s Perspective: Take Me to Your Leader
We must have touched a real hot button when we decided to do this issue on leadership. When we sent out our survey on the topic, we received a lot of responses, which we’ll review in a separate article, plus many of our regular columnists were inspired to write on the subject.
GP Ventures: Facilitating ‘Multi-layered’ M&A Deals
One of our newer I-Connect007 columnists is Tom Kastner of GP Ventures, an M&A advisory company. I spent a few minutes with Tom at SMTAI recently, and he filled me in on his background in the electronics industry, which includes specializing in buying, selling or merging businesses; his columns deal with many of the requirements and issues on all sides of those changes.
Let's Talk Testing: Don’t Reinvent the Wheel—Find an Expert!
Back in the day when I was an engineer fresh out of college, I quickly learned that experience is the solution to many problems. Now that being said, experience comes in many forms…it could be knowledge learned from a textbook, it could be an observatory comment jotted down in a notebook, it could be a conversation with a co-worker or colleague, or it could be an Internet search that finds a scholarly technical article, etc.
One World, One Industry: Voting—A Civic Duty and Industry Opportunity
On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.
All About Flex: Flexible Circuit Prototypes
Most electronic projects begin with at least one build of prototype parts before moving into volume manufacturing. But the definition of a flex circuit prototype can vary considerably from one project to another. In many cases, a prototype build is only a few parts used to verify form, fit and function, with engineering trying to determine if something actually works.
Isola CEO Jeff Waters Shares Insights and Reflections
It’s been eight months since Isola’s Jeff Waters was appointed CEO, marking his transition from the semiconductor space to the PCB industry. At PCB West, Jeff reflected on his first impressions of the PCB industry and how Isola continues to adopt changes in its manufacturing strategy and product development with a plan to become the industry leader with a global, competitive presence.
Geek-A- Palooza: Get Your Geek On in Minnesota!
If you haven’t been to Geek-A-Palooza yet, you may just get a chance, because the social networking event could be coming to your city in the near future. Barry Matties met with founder Tara Dunn following the most recent Boston event, to learn more about Geek-A-Palooza and why the laid-back atmosphere is beneficial for both the sponsors and the attendees.
Institute of Circuit Technology Hayling Island Seminar 2016
In recent years, the Hayling Island Seminar has become established as the most popular date on the Institute of Circuit Technology calendar and, as expected, the 2016 event attracted a large gathering of industry professionals to the south coast of England to share knowledge and experience and to discuss current developments.
This month, I was a guest at the High Density Packaging Users Group (HDPUG) meeting in Nashville, Tennessee. The consortium, composed of more than 50 companies (small and large) in the electronics packaging supply chain, conducts projects to solve real world problems or develop data for product parameters, package/component life, and production processing.
EIPC Reliability Workshop, Tamworth, UK, September 22, 2016
EIPC’s reliability workshop, presented in cooperation with Amphenol Invotec, attracted a capacity audience from eight countries—some delegates having travelled from as far away as Russia—to take the opportunity to learn first-hand how to meet OEM, ODM and EMS product quality and safety requirements, and to understand how interconnection stress testing techniques could be applied to determine the reliability of multilayer PCBs.
Happy’s Essential Skills: Recruiting and Interviewing
Hopefully, your career has progressed to the point that you are empowered to recruit your own team or a key person for your team. There are always technical people looking for better jobs, but many times, the most talented are busy doing their work and not looking for a new opportunity.
A Day with Pete (Starkey)
Usually the one conducting the interviews, I-Connect007’s own Pete Starkey recently found himself on the other side of the microphone when I spent time with him in his hometown of Market Bosworth, England. There, between hiking and gardening, we found time to discuss Pete’s rich history in the PCB industry and the many changes and surprises he’s seen in the manufacturing process over the years.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
Laser Pointers: Special Edition—Those Five Words I Didn’t Expect to Hear
I’m going to hijack the column this month for kind of a public service announcement regarding a topic that hit very close to home for me, and it may well hit home for others.
On February 18, 2016, I heard the words, “Mike, you have bladder cancer.”
EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry
Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.
IPC President John Mitchell Discusses IPC's Footprint in China
At the Capital Club in Beijing, IPC’s president John Mitchell met with I-Connect007’s Edy Yu to discuss the current activites of IPC China. Some of the topics covered included the growing China membership, training, trade shows and IPC China’s standards development effort.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
Institute of Circuit Technology Annual Symposium
On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.
Global Technology Development: HDP User Group European Meeting 2016
Delighted and honoured to be invited again to attend the open session of the High Density Packaging User Group (HDPUG) European Meeting, I made my way to the picturesque Grand Duchy of Luxembourg, a tiny principality bordered by Belgium, France and Germany, and ranked among the world's top-three nations in both wealth and wine consumption, to learn about the latest in collaborative research and development by member companies engaged in the manufacture of products utilising high-density electronic packages.
IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda
IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”
Stepping up to Laser Processing for Flex, Part 3: Readiness and Site Preparation
With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might crop up. However, given that laser processing equipment and flex materials are both impacted by your facilities, your attention to and investment in clean, stable, and robust facilities and support equipment will quickly pay off in less downtime, higher yield, and—perhaps most importantly—fewer headaches!
Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1
In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.
All About Flex: Imaging Methods for Etch Resist, Part 1
Imaging is a major process step in creating a copper circuit or flexible PCB. In single-sided circuit fabrication, the imaging process creates the resist pattern that protects the copper from the etchant. It is critical that this pattern precisely define the circuit traces, as issues with imaging will transfer to the subsequent processes.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 5
The outline profile of the flexible circuit is seldom uniform. One of the primary advantages of the flexible design is that the outline can be sculpted to fit into very oblique shapes. This month, Vern Solberg focuses on outline planning, physical reinforcement, and accommodating bends and folds in flexible and rigid-flex circuits.
Flex Talk: PCB Sourcing? One Size Does Not Fit All
When analyzing a set of PCBs to improve yields and maximize profits, the first place to start is with a critical review of each PCB design. Are there any attributes that are pushing your manufacturer’s standard design rules? If so, is this necessary to the design or is there another approach that could improve the manufacturer’s yields, reduce cost, and ultimately increase profit?
Stepping Up to Laser Processing for Flex, Part 2: Calculating and Optimizing Production
In Part 1 of this series, we discussed the advantages of adding flex laser processing to gain a competitive advantage. In Part 2 we will build on that discussion, looking at the ways you can optimize your flexible circuit laser processing to get the efficiencies that drive lower cost of ownership.
All About Flex: Why Copper is Ideal for Flexible Circuitry
Copper is the second-most conductive metal (in pure form). The copper used on flexible circuits can be formed by a number of methods such as electro-deposition (ED), rolling/annealing, or a combination of the two. The conductivity of copper by volume on a flexible circuit is not exactly the same as pure copper, but it is quite close.
The Importance of Choosing Equipment Suppliers Carefully and Investing in the Future
Burkle Process Technologies, a long-time PCB equipment supplier to high-end manufacturers in the world, is seeing their business continuing to grow despite the perceived slowdown in the industry in China. They ensure this by working closely with customers, making premium products to understand future technology needs, and offering the highest quality in laminating machines and technical support.
Weiner’s World: March 2016
Sellers of equipment at the Shanghai CPCA event complained of continued poor business. This was especially evident amongst those selling to firms building boards for phones and other portables devices as indicated below. However, not all reports were bad. Major fabricators such as Wu's in China, not dependent upon HDI or flexible products, stated that they were "satisfied" with their current business levels.
Designers Notebook: Flexible and Rigid-Flex Circuit Design Principles, Part 4
All of the design rules for the glass reinforced-portion of the board (land pattern geometry for mounting surface mount devices, solder mask and the like) are now well-established. One unique facet of fabricating the rigid-flex product is how the flexible portion of the circuit is incorporated with the rigid portion of the circuit. As a general rule for multilayer PCB design, furnish a balanced structure by building up the circuit layers in pairs (4, 6, 8 and so on).
The Supplier View: An Interview with Hamed El Abd
I sat down with WKK’s Hamed el Abd at CPCA, where we discussed the show, the growing trend toward automation, as well as a few other topics, namely world politics and economics and how they relate to the PCB industry.
Happy’s Essential Skills: Design of Experiments
Design of experiments (DOE) is one of the most powerful and influential engineering tools for product yield improvements, new products or processes development, or for problem solving. As mentioned in my last column, process problems led me to a career in printed circuits, and quickly solving those problems led me to a bonus stock award and a great life. Even though I knew nothing about printed circuit manufacturing processes, I was able to quickly find the root causes of all the problems and fix them. My secret? Total quality control (TQC), statistics, and DOE.
Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life
In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.
Rex Rozario, Part 3: The Future Beckons
In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?
Rex Rozario: The PCB Industry’s True Renaissance Man
In this exclusive multi-part interview that was conducted recently, I-Connect007's Barry Matties will introduce you to all of the people that Rex Rozario is, and where he, his team, and Graphic PLC are headed to next.
The Sum of All Parts: The Cost of Quality
Throughout the decades, irrespective of industry or sector, markets have thrived on competition. They have, however, also relied upon some semblance of unity within their respective competitors. Industries rely upon their individual member companies’ ability to work together for the greater good.
The Institute of Circuit Technology Tewkesbury Seminar, 1st March 2016
The Annual General Meeting of the Institute of Circuit Technology (ICT) was held at Puckrup Hall, near Tewkesbury in Gloucestershire, England, on 1st March 2016, and was followed by a well-attended evening seminar with presentations on a novel laser-induced deposition process, an analysis of the market for PCBs, and a review of three development projects in which the Institute had participated. The programme was introduced and moderated by ICT Technical Director Bill Wilkie.
Designers Notebook: Flex and Rigid-Flex Circuit Design Principles, Part 2
In this installment of "Designers Notebook," Vern Solberg discusses supplier assessment, planning of the flexible circuit outline, and various circuit routing principles. Communication between designer and fabricator is paramount, as well as an understanding of IPC-2223, which sets the specific requirements for the design of flex circuits.
The Pinless Registration System, Explained by DIS’ Bernd Gennat
I sat down at productronica recently with Bernd Gennat, VP sales Asia and Europe for Duetto Integrated Systems (DIS Inc), for an overview of the industry, including his company’s technology. Our discussion touched on trends in multilayer registration, market requirements in Europe compared with those in China, and the benefits of pinless over hard-tooled registration systems for current and future rigid, flex and flex-rigid constructions.
Mr. Laminate Tells All: CEM-3 Reinvents Itself (Again)—or, Atari Game Boards on eBay?
CEM-3 was unusual as the reinforcement was a combination of woven fiber-glass fabric and fiber-glass paper. The resin system was a dicy-cured epoxy resin yielding a Tg the same as FR-4 at the time, of 110–120°C range. Because it was all epoxy and all fiberglass, the properties were electrically identical to those of FR-4.
New Year, New Outlook for the Electronics Manufacturing Industry
As an advocate for the electronics manufacturing industry, my job is to educate and encourage policymakers to create a favorable legislative and regulatory environment for advanced manufacturing to grow and succeed. From that perspective, I think we should be proud of the significant progress we made in several areas in 2015.