Let's Talk Testing: Don’t Reinvent the Wheel—Find an Expert!
Back in the day when I was an engineer fresh out of college, I quickly learned that experience is the solution to many problems. Now that being said, experience comes in many forms…it could be knowledge learned from a textbook, it could be an observatory comment jotted down in a notebook, it could be a conversation with a co-worker or colleague, or it could be an Internet search that finds a scholarly technical article, etc.
One World, One Industry: Voting—A Civic Duty and Industry Opportunity
On Tuesday, November 8, more than 240 million people in the United States will have the opportunity to go to the polls and vote, make their voices heard in government, and influence the direction of public policy for years to come. Much of the world is closely watching with interest in this major U.S. election.
Sensible Design: The Little Guide to Resins
I would like to start this series of columns by going back to basics, questioning the core rationale for potting and encapsulation with resins, their fundamental chemistries and how each resin type differs one from the other—indeed, how their individual properties can be exploited to maximise performance under a wide range of environmental conditions.
Disruptive Technologies– VR, AR and Star Trek
This article and subsequent follow-ups will cover various disruptive technologies. During the planning stage for this month’s issue of The PCB Magazine, I was asked to consider a number of potential topics; two of them are areas that I am very interested in—augmented reality (AR) and virtual reality (VR), and 3D printing and security.
Geek-A- Palooza: Get Your Geek On in Minnesota!
If you haven’t been to Geek-A-Palooza yet, you may just get a chance, because the social networking event could be coming to your city in the near future. Barry Matties met with founder Tara Dunn following the most recent Boston event, to learn more about Geek-A-Palooza and why the laid-back atmosphere is beneficial for both the sponsors and the attendees.
Institute of Circuit Technology Hayling Island Seminar 2016
In recent years, the Hayling Island Seminar has become established as the most popular date on the Institute of Circuit Technology calendar and, as expected, the 2016 event attracted a large gathering of industry professionals to the south coast of England to share knowledge and experience and to discuss current developments.
This month, I was a guest at the High Density Packaging Users Group (HDPUG) meeting in Nashville, Tennessee. The consortium, composed of more than 50 companies (small and large) in the electronics packaging supply chain, conducts projects to solve real world problems or develop data for product parameters, package/component life, and production processing.
EIPC Reliability Workshop, Tamworth, UK, September 22, 2016
EIPC’s reliability workshop, presented in cooperation with Amphenol Invotec, attracted a capacity audience from eight countries—some delegates having travelled from as far away as Russia—to take the opportunity to learn first-hand how to meet OEM, ODM and EMS product quality and safety requirements, and to understand how interconnection stress testing techniques could be applied to determine the reliability of multilayer PCBs.
IPC Certification Program's 'Space Hardware Addendums' Training and Certification
In this article, Sharon Montana-Beard of Blackfox discusses the IPC Certification Program's Space Hardware Addendums training and certification, the topics covered in the training course, and the benefits of the program.
Ionics EMS Talks Industry 4.0, Mil/Aero Opportunities, and Supply Chain
In an interview with SMT Magazine, Dr. Jay Sabido, president and COO of Ionics EMS Inc., discusses a wide range of topics, including Industry 4.0, automation, and the challenges in the military and aerospace industry, including lead-free, counterfeit components, and traceability.
John Cardone on Designing Flex for Spacecraft
If you watched footage of the Mars rover driving all over the red planet, you’re familiar with some of John Cardone’s handiwork. He’s been designing rigid, flex, and rigid-flex circuitry for spacecraft since he joined JPL in the early ‘80s, and he’s worked on some of the more ground-breaking flex circuits along the way. Now John runs his own design service bureau, JMC Design Services, and he continues to design circuitry for things that blast off. I caught up with John recently and asked him to give us the straight scoop on designing boards for spacecraft.
Mil/Aero Markets: F-35 Declared Combat-Ready
Electronic subsystems are an integral part of all modern military fighter jets, with a substantial portion of the electronics supporting intelligence, surveillance and reconnaissance (ISR) systems, electro-optical/infrared (EO/IR), avionics, munitions and radar related subassemblies. This equates to a very high content of PCBs and SMT assembly requirements.
Asteelflash on Mil/Aero Challenges, ITAR, and Opportunities
In an interview with SMT Magazine, Albert Yanez, corporate executive VP and president of Asteelflash, Americas, discusses the challenges in the military and aerospace industries, ITAR compliance, and the opportunities in these sectors.
The Blackfox Advanced Manufacturing Program for Military Veterans
You might be wondering why you should hire a military veteran, especially if your company has nothing to do with the military. But hiring veterans can bring a wealth of benefits, and this article highlights them. It also focuses on the Blackfox Veteran’s Training Program, the first program of its kind to provide veterans with little to no industry experience with the skills to grow their careers in the electronic assembly industry.
Let's Talk Testing: Does your Product have a Military Application?
Just like any other industry segment within the circuit board world, the military sector has its own share of documents…and likely many more than most! These documents have been developed over the years to guide, shape, and test anything and everything that might go into a jet fighter, a radar system, a warship, a weapons system, etc.
RapidScat Team Investigating Power System Anomaly
Mission managers at NASA's Jet Propulsion Laboratory, Pasadena, California, and NASA’s Marshall Space Flight Center, Huntsville, Alabama, are assessing two power system-related anomalies affecting the operation of NASA’s ISS-RapidScat instrument aboard the International Space Station.
Patty's Perspective: Are We Flying Yet?
Walt Custer is on a photo safari in Africa and suggested I take a look at some of his slides regarding the military/aerospace market and then give a little report on it. Well, I am no Walt Custer, so while I can tell you a bit about where things are, far be it from me to make predictions.
The European Space Agency on Reliability
Stan Heltzel is a materials engineer working for the European Space Agency, and he is tasked with the job of procuring and qualifying PCBs that end up in satellites. I met with Stan at EIPC’s Summer Conference to discuss his presentation on qualifying a fabricator, his role at the ESA, and updating of space standards.
Integrated Manufacturing Solutions: an EMS, ODM, CM, and OEM!
Robbin Thompson, VP Business Development at San Diego-based contract manufacturer Integrated Manufacturing Solutions (IMS), speaks with I-Connect007's Barry Matties and Judy Warner about her company's expansion, production capabilities and product lineup, as well as the culture at IMS.
Multiple Markets Merge for PCBs at H&T Global
While at the SMTA-Ohio expo I met Rob DiGiovanni, VP of sales and marketing with H&T Global, a printed circuit manufacturer based in Florida. I was attracted to the H&T booth by a large photo of an Army jeep. I wanted to learn what this particular photo had to do with PCBs, and Rob had a ready answer.
A Day with Pete (Starkey)
Usually the one conducting the interviews, I-Connect007’s own Pete Starkey recently found himself on the other side of the microphone when I spent time with him in his hometown of Market Bosworth, England. There, between hiking and gardening, we found time to discuss Pete’s rich history in the PCB industry and the many changes and surprises he’s seen in the manufacturing process over the years.
Shane Whiteside and Summit Interconnect: Aspiring to New Heights
A few weeks ago I was privileged to meet with Shane Whiteside in Anaheim, California, at KCA Electronics. Whiteside, former COO of TTM, has helped launch a new company—Summit Interconnect— which encompasses the recent acquisition of KCA Electronics and Marcel Electronics International. Once again assuming an executive role, this time as CEO and president, Whiteside shared his story, strategy and vision for this new chapter.
Lab Tests Armored Vehicles with Auto Industry 'Dummies'
In an unassuming warehouse on Aberdeen Proving Ground, Maryland sit nearly 50 men in uniform, waiting for their mission during an upcoming test event. They're sporting Army Combat Uniforms, standard-issue boots, a crane hook protruding from their heads, and a plethora of color-coded wires spilling out the back of their necks.
Designing With Tighter Tolerances
David Ledger-Thomas is a PCB design engineer with Honeywell Aerospace. He’s spent decades designing PCBs for a variety of applications, including defense, aerospace, computers, and high-performance audio. I asked David to share some of his thoughts on designing high-tech boards with increasingly finer spaces, traces and pitch.
Designers Notebook: Specifying Lead-Free Compatible Surface Finish and Coating for Solderability and Surface Protection
A majority of the components furnished for electronic assembly are designed for solder attachment to metalized land patterns specifically designed for each device type. Providing a solder process-compatible surface finish on these land patterns is vital; however, selection of the surface finish on the circuit structure, whether plated or coated, can be greatly influenced by the components’ terminal metalization and the specific alloy composition used for the assembly process.
The 21st Century PCB Factory– Designed to Eliminate Offshore Cost Advantages
Over 15 years have passed since North America and Europe ceased being the center of worldwide PCB fabrication and were supplanted by a Chinese market with low-cost labor, lax environmental requirements, and strong government support. In just a few short years, the superior offshore cost advantages of this new dynamic put volume PCB production in the West out of business, aside from the military and specialty technology applications contained in the few shops that continue to exist today.
Zentech’s Matt Turpin on IMPACT Washington, D.C.’s Benefits
At the recent IMPACT Washington, D.C. 2016 event in Capitol Hill, Matt Turpin, CEO of EMS firm Zentech discusses with I-Connect007's Patty Goldman his expectations on the event, its importance, and how, so far, it has helped the electronics manufacturing industry in the United States.
Against the Density Wall: Landless Vias Might be the Answer
I saw my first landless via multilayer while visiting NEC in Japan in 1985. You may not know much about landless vias. This has been a well-kept secret for the last 30 years, possibly because it is not permitted on military boards, and therefore, discouraged in all IPC standards. So when a company showed us their landless via boards, we said, "You can't do that!"
EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry
Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.
Finessing Miniaturized Magnetics into the Microelectronics Mix
A newly-announced DARPA program is betting that unprecedented on-chip integration of workhorse electronic components, such as transistors and capacitors, with less-familiar magnetic components with names like circulators and isolators, will open an expansive pathway to more capable electromagnetic systems.
RTW IPC APEX EXPO: Bob Neves Talks Trends Driving Test Services in China
Bob Neves, chairman and CTO of Microtek Laboratories China, talks with I-Connect007 guest editor Dick Crowe about a variety of issues, including the growing automotive electronics and military/aerospace industries, and how companies in the US that are buying boards and assemblers buying their materials in China can benefit from his company's test services locally.
Ken Moffat of American Standard Circuits Talks Aerospace Accreditation, DfM, and More
At the recent SMTA West Penn Expo & Tech Forum, I had the opportunity to speak with Ken Moffat, of American Standard Circuits, based in Chicago. Among the topics we discussed was the importance of attending local chapter shows like this one, and ASC’s value-added services such as DfM, especially in the metal-backed and RF arenas.
EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry
Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.
RTW IPC APEX EXPO: ACE's Alan Cable Discusses Benefits of Selective Soldering, and Need for Lead Tinning
Alan Cable, president of ACE Production Technologies, talks to I-Connect007 guest editor Mark Thompson about selective soldering and how it helps electronics assemblers overcome the high cost of labor.
Institute of Circuit Technology Annual Symposium
On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.
What You Probably Don't Know About NASA
While at Maker Faire 2016 in San Mateo recently, I met with George Gorospe of NASA’s Ames Research Center to discuss his group’s recent findings and projects, NASA’s CubeSats and microsatellites, and what the commercialization of space travel means for the near future.
CODE Takes Next Steps toward More Sophisticated, Resilient, and Collaborative Unmanned Air Systems
DARPA’s Collaborative Operations in Denied Environment (CODE) program seeks to help the U.S. military’s unmanned aircraft systems (UASs) conduct dynamic, long-distance engagements of highly mobile ground and maritime targets in denied or contested electromagnetic airspace, all while reducing required communication bandwidth and cognitive burden on human supervisors.
Global Technology Development: HDP User Group European Meeting 2016
Delighted and honoured to be invited again to attend the open session of the High Density Packaging User Group (HDPUG) European Meeting, I made my way to the picturesque Grand Duchy of Luxembourg, a tiny principality bordered by Belgium, France and Germany, and ranked among the world's top-three nations in both wealth and wine consumption, to learn about the latest in collaborative research and development by member companies engaged in the manufacture of products utilising high-density electronic packages.
Accelerating Complex Computer Simulations: Thinking beyond Ones and Zeros
Whether designed to predict the spread of an epidemic, understand the potential impacts of climate change, or model the acoustical signature of a newly designed ship hull, computer simulations are an essential tool of scientific discovery.
IMPACT Washington, D.C. 2016: Industry Leaders Advocate for a Pro-Manufacturing Policy Agenda
IPC places a high priority on educating government officials about key policy issues of importance to the electronics industry. That’s why top executives from leading electronics companies gathered in Washington, D.C. recently for “IMPACT Washington, D.C. 2016.”
Beyond FR-4: High-Performance Materials for Advanced Designs, Part 1
In the past 40-plus years of PCB manufacturing, the primary material of choice has overwhelmingly been e-glass supported FR-4 resin laminates. This is due to the excellent dimensional stability and reasonably acceptable thermal performance (based on glass transition temperature [Tg] and decomposition temperature [Td]). In general, these materials exhibit impressive performance and excellent cost for a wide range of applications.
Rogers: 'To PIM-test Our Material, You Have to Build a Circuit'
Passive intermodulation (PIM) is a circuit anomaly that has been occurring in cellular base station antennas, causing tremendous frustration and cost to antenna OEMs. As the supplier of the materials being used by these OEMs, Rogers Corp., and more specifically, Product Manager Tony Mattingly, must come up with a solution.
Today’s MilAero Options, Part 1: 'Pride Goeth Before...'
Historians, with their 20/20 hindsight, often write about the inevitable decline and fall of kingdoms, empires, religions, organizations, governments, and all the other permanent structures we humans build.
IPC President John Mitchell on the Past, Present, and Future, Part 1
We conducted this interview with IPC President John Mitchell on the show floor at IPC APEX EXPO to discuss the event, the changes on the IPC board, and the key metrics that IPC uses to measure their own performance and effectiveness. John also invites the industry to a unique challenge.
Catching up with…PNC: Open House Planned for May
I’m a great believer in open houses. Any time customers and vendors get together to learn and talk about what they can do for each other it’s a good thing. That’s why, when I heard that PNC, in Nutley, New Jersey, planned to hold an open house on May 20, I wanted to learn more about it. So I called my friend Sam Sangani, the company’s owner, to learn more about it.
Karl's Tech Talk: Green Legislation and the Impact on Electronic Materials and Processes
In general, “green” and “environmentally friendly” refer to manufacturing that involves the replacement of toxic substances with less toxic materials, the elimination of materials or processing steps, less consumption of chemicals (i.e., more efficient or higher yield processing), reduction of water use, reduction of energy use, less space requirement (i.e., smaller equipment footprint), recycling, and on-site recovery of materials.
Catching up with…Fastrak Manufacturing’s Phil Guzman
Fastrak Manufacturing is one of those companies that focus on solving problems, tough problems, problems that other companies cannot solve. Technically a contract manufacturer, Fastrak is much more than that, working with companies who have an engineering/manufacturing problem to solve, or with inventors trying to get a new product developed, manufactured and out to the market in a limited amount of time.
IPC APEX EXPO: Blackfox Celebrating 20 Years of Providing Quality Training
Sharon Montana-Beard, vice president of sales and operations at Blackfox, talks with I-Connect007's Andy Shaughnessy about the company's 20th year in business, their recent partnership with Pace, as well as their latest developments and activities.
Walt Custer Elaborates on his Annual IPC APEX EXPO Forecast Presentation
IPC APEX EXPO 2016 has come and gone, and this year, Walt Custer’s annual presentation forecasting the upcoming year for the industry was much anticipated, as always. I met up with Walt at the show to learn about his presentation and dig deeper into his findings.
IPC APEX EXPO: Acromag Discusses Newly Launched Electronic Contract Manufacturing Division
Acromag’s David Wolfe and Stacy Moore talk with I-Connect007’s Andy Shaughnessy about the company’s newly launched electronic contract manufacturing division, and the services it will offer to industries including telematics, military, aerospace, and automotive.
Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life
In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.
IPC APEX EXPO: Glenn Oliver on His IPC 'Best Paper' on High-Frequency Materials
Glenn Oliver of DuPont discusses his award-winning paper, “Round Robin of High-Frequency Test Methods by IPC-D24C Task Group." Co-authors include Jonathan Weldon of DuPont, John Andresakis of Park Electrochemical, Chudy Nwachukwu of Isola, John Coonrod of Rogers Corporation, David L. Wynants of Taconic Advanced Dielectric Division, and Don DeGroot of Connected Community Networks. The paper looks at high-frequency offerings from a variety of materials providers.
Rex Rozario, Part 3: The Future Beckons
In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?
Rex Rozario, Part 2: The Beat Goes on: New Developments at Exeter, the Music Scene, and China
In Part 2 of I-Connect007’s multi-part interview with PCB industry icon Rex Rozario, we continue to discover more about what has made Graphic PLC the company it is today. Rex explains the work they’re doing with Exeter University, Graphic’s success in China, and his own personal experience in the UK music scene.