Dr. Jennie Hwang to Address Role of Intermetallics and Solder Joint Reliability at SMTAI

Reading time ( words)

Solder joint reliability plays a critical role in the reliability of the entire spectrum of end-use electronic products—from consumer to military, from computing to IoT, and from medical to avionic applications. In lead-free electronics, intermetallic compounds become increasingly important to the performance and reliability of solder interconnections in the chip level, package level and board level. Understanding the essential fundamentals and key factors behind intermetallics and solder joint reliability is a necessity to designing and manufacturing reliable products.

On September 25, Dr. Jennie S. Hwang leverages decades of extensive real-world experiences and deep knowledge to address solder joint reliability and the role of intermetallic compounds at the upcoming SMTA International event. Dr. Hwang will discuss relevant aspects of solder joint reliability at her Workshop 1, "Reliability of Electronics – The Role of Intermetallic Compounds", and Workshop 7, "Solder Joint Reliability - Principles and Applications". Attendees are encouraged to bring their own selected systems for deliberation.

For more information or to register, click here.



Suggested Items

Real Time with… SMTAI: Alpha's Strategies to Ensure Reliability of Assemblies

10/04/2016 | Real Time with...SMTAI
I-Connect007’s Judy Warner and Robert Wallace, regional marketing manager and channel partner manager for the Americas for Alpha Assembly Solutions, discuss how Alpha helps ensure reliability of their customers’ assemblies by providing soldering material set combinations that had been fully tested together for the J-STD-004B.

A Closer Look at SMTA

12/29/2015 | Stephen Las Marias, I-Connect007
Tanya Martin, director of operations at SMTA, responded to our I-Connect007 questionnaire recently, which focused on the association’s mission, membership statistics, and how SMTA best serves its members. She also talks about how SMTA satisfies its members' need for technical information, and some of SMTA's success stories in the industry.

Honeywell Paper Investigates Avionics Vibration Durability

12/14/2015 | Andy Shaughnessy, I-Connect007
Dr. Joseph Juarez, principal mechanical engineer at Honeywell International, discusses with I-Connect007's Andy Shaughnessy his SMTA paper, which addresses avionics vibration durability between tin-lead and lead-free solder, the years of testing he conducted, the importance of doing a good soldering job, and some of the surprising findings of his research.

Copyright © 2021 I-Connect007. All rights reserved.