The 21st Century PCB Factory– Designed to Eliminate Offshore Cost Advantages


Reading time ( words)

Over 15 years have passed since North America and Europe ceased being the center of worldwide PCB fabrication and were supplanted by a Chinese market with low-cost labor, lax environmental requirements, and strong government support. In just a few short years, the superior offshore cost advantages of this new dynamic put volume PCB production in the West out of business, aside from the military and specialty technology applications contained in the few shops that continue to exist today.

Recently, however, the conditions that created the current equilibrium appear to be shifting again. In this new dynamic, automation, innovative green wastewater technologies, and next generation process equipment innovations have combined to make new factories capable of achieving rapid ROI for PCB fabrication almost anywhere in the world. This paper means to illustrate this new dynamic, and provide case study examples from the new greenfield installation at our captive facility in New Hampshire.

Read the full article here.


Editor's Note: This article originally appeared in the June 2016 issue of The PCB Magazine.

Share

Print


Suggested Items

8 Measures for Sales and Operations Planning in Turbulent Times, Part 2

07/28/2020 | Fane Friberg, CEPHAS
In this series, CEPHAS principal Fane Friberg highlights the interdependent elements of an effective S&OP process for leaders of supply chain management. While some companies tend to fall back on the status quo, Freiberg highlights why it’s critical to actually increase the frequency of the S&OP rather than decrease the operations. His first focus was to stay committed to the process. Today, he discusses strategic imperatives.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2020 I-Connect007. All rights reserved.