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TRI Launches New Advanced Packaging 3D CT AXI Solution

03/26/2024 | TRI
Test Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

03/25/2024 | IPC
Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly. 

It’s Only Common Sense: Meet the New Young Guns in Sales

03/25/2024 | Dan Beaulieu -- Column: It's Only Common Sense
I have been working quite a bit lately with younger people. These salespeople are literally two generations removed from my own demographic (and most of our industry’s demographic). Most of them are 30 years old or younger. I’d dare to call them “hotshots” because they are hungry, ambitious, and passionate, and they want to succeed.

Keysight, Capgemini Validate 5G New Radio RAN Solution for Non-Terrestrial Networks

03/21/2024 | Keysight Technologies, Inc.
Keysight Technologies, Inc. and Capgemini have successfully validated non-terrestrial network (NTN) test scenarios in a set-up using Capgemini’s 5G New Radio (NR) central unit (CU) and distributed unit (DU) framework supporting NTN functionality.

New Features Boost Speed, Accuracy, Ease of Use for YAMAHA AOI System

03/18/2024 | Yamaha Robotics SMT Section
Yamaha Robotics has announced Performance-boosting upgrades for the YAMAHA YRi-V 3D AOI system. These upgrades include faster board handling, multi-component alignment checking, and enhanced LED coplanarity measurement, among others.
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