ACE and DIVSYS to Co-host Solderability and Lead Tinning Workshop in Indianapolis
February 10, 2016 | ACE Production Technologies Inc.Estimated reading time: 3 minutes
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce that its ACE Component Services Group in conjunction with DIVISYS International, LLC will co-host a solderability testing and component lead tinning workshop in Indianapolis.
The workshop will be held Tuesday, March 8, 2016 at DIVSYS International, 8110 Zionsville Road in Indianapolis, Indiana. This technical workshop will include a classroom process training session followed by a Q&A session as well as one-on-one discussion after the workshop is concluded.
Who Should Attend
- Process Engineers
- Manufacturing Engineers
- Quality Personnel
- Procurement Personnel
What They Will Learn
- Understanding the new J-STD-001 Rev F requirements
- Differences between solderability testing and component re-tinning
- Dip and look and wetting balance solderability test methods
- Motivation behind the need to hot solder dip components
- How the new J-STD-001 Rev F impacts you and your company
Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry. With implementation of the new Rev F of J-STD-001, solderability testing, gold removal and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace. This classroom session focuses on the technical aspects of solderability testing and the component re-tinning process. Topics Include:
- Tin whisker mitigation
- Gold embrittlement and removal of gold plating
- RoHS and tin-lead component supply chain trends
- Solderability testing protocols
- MIL-STD-883 and J-STD-002 standards
- SMT and through-hole component re-tinning
- Legacy component refurbishing and RoHS to tin-lead conversion
- ANSI/GEIA-STD-0006 component re-tinning requirements
- Coplanarity and solder thickness
This much anticipated workshop entitled “Solderability and Lead Tinning for the 21st Century” will describe the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. The recommendation that the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed extensively.
This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and DIVSYS International and covers all aspects of the solderability testing and component re-tinning processes. For more information about this one of a kind solderability testing and component lead tinning workshop, or to register for the workshop, contact Tammie Fish at tammie.fish@divsys.com or call 317-405-9427, Ext. 1004.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services. For more information, click here, call 509-924-4898 or email sales@ace-protech.com.
About DIVSYS
DIVSYS International, LLC is a supply chain manager of printed circuit boards with lab assurance testing of every lot in Indianapolis before shipment to the customer. DIVSYS’s fully equipped lab offers a complete range of testing services for both bare and assembled printed circuit boards. DIVSYS is comprised of technical experts in both bare and assembled boards, who have over 170 combined years of “hands-on” experience with bare board fabrication and all aspects of board assembly. This concentration of knowledge is what DIVSYS uses to assure quality printed circuit boards to meet or exceed customer requirements. This is why military, automotive, medical device and other high reliability environments are a key niche market for DIVSYS. For more information, click here, call 317-405-9427, Ext. 1004 or email sales@divsys.com.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.