Northrop Grumman to Provide LN-200S for Lockheed Martin's Satellite Bus
January 19, 2016 | Northrop GrummanEstimated reading time: 1 minute
Northrop Grumman Corporation has been awarded a contract from Lockheed Martin Corporation to supply its LN-200S fiber-optic Inertial Measurement Unit (IMU) for the LM 300 satellite bus.
The LN-200S is a small, lightweight navigational element that senses acceleration and angular motion, providing data outputs used by vehicle control systems for attitude control and guidance. The IMU is hermetically sealed and contains no moving parts, ensuring low noise, dependability and an extended shelf life.
"The LN-200S is a low cost, reliable IMU with significant space heritage," said Bob Mehltretter, vice president, navigation and positioning systems business unit, Northrop Grumman Mission Systems. "This IMU is especially ideal for the burgeoning small satellite market due to its affordability, small size, light weight and low power consumption."
The LN-200S heritage can be traced back 20 years to its qualification for flight aboard the Clementine spacecraft. Since then, a wide range of space missions have depended on the IMU to provide reliable inertial data. The LN-200S has successfully performed on many spacecraft, including NASA's Curiosity, Spirit and Opportunity Mars rovers, as well as satellites in geosynchronous and low Earth orbits. The Coriolis spacecraft, built by Orbital ATK and launched in January 2003 with two LN-200S IMUs, continues to perform its mission in low Earth orbit. The primary IMU has far exceeded its life expectancy and requirements by providing continuous data since launch — avoiding the need to utilize the backup LN-200S IMU on the spacecraft.
About Northrop Grumman
Northrop Grumman is a leading global security company providing innovative systems, products and solutions in unmanned systems, cyber, C4ISR, and logistics and modernization to government and commercial customers worldwide.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/19/2024 | Marcy LaRont, PCB007 MagazineFor my must-read picks of the week, I’m highlighting Parker Capers, a young professional seeking employment, solid counsel from Dan Beaulieu on what your post-show plan should look like, more information and insight on “chiplets” and the need for secure data transfer standards from columnist Preeya Kuray, as well as Matt Stevenson’s design for reality wisdom. It’s a reminder to download one of our newest books (there are several) you don't want to miss if you are an assembler.
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Real Time with... IPC APEX EXPO 2024: Innovations in Thermal, Warpage, and Strain Metrology
04/17/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson talks with Neil Hubble, president of Akrometrix, about the company's leadership in thermal, warpage, and strain metrology. Neil details how Akrometrix is committed to addressing customer challenges through technological evolution, innovative solutions, and a focus on data processing. A tabletop unit for thermal warpage testing is showcased at IPC APEX EXPO this year.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.