IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals


Reading time ( words)

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.

Supplier Declaration

The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. The committee discussed the use of special characters in smelter names and potential revisions to some of the declaration questions in order to improve clarity and usability.  The committee decided to meet monthly work towards publishing a revision of the standard in 2017.

Environment, Health, and Safety

The 4-33 Halogen Free Laminate Materials Subcommittee reviewed what comments from this subcommittee, if any, would be helpful in steering the U.S. EPA in its TSCA work plan to study Tetrabromobisphenol A (TBBPA).  Fern Abrams was able to lend some sanity to the discussion and the subcommittee decided to wait for the IPC-constructed comments that will be submitted to the EPA.

Management

The 8-41 Technology Roadmap Subcommittee discussed ways to improve the IPC International Technology Roadmap for Electronic Interconnection and to increase its reach to the greater electronics manufacture industry. From this brainstorming session, the group will strategize the continual awareness of the 2015 version and enhancements which can be made to the 2017 version.

Embedded Devices

Based on significant feedback following publication of IPC-7092, Design and Assembly Process Implementation for Embedded Components, the D-55 Embedded Devices Process Implementation Subcommittee is beginning work on an amendment or A revision of the standard. The subcommittee will make a decision on the best route to take IPC-7092 based on the amount of new information or inquiries for expanded topics it receives.

Share

Print


Suggested Items

IPC: Shawn DuBravac and Chris Mitchell on USMCA

07/02/2020 | Nolan Johnson, I-Connect007
On July 1, 2020, the USMCA trade act (United States-Mexico-Canada Act) phased in as a trade agreement guiding economic trade and growth in North America. Nolan Johnson spoke with both Shawn DuBravac, IPC’s chief economist, and Chris Mitchell, IPC’s vice president of global government affairs and an I-Connect007 columnist, about the impact of USMCA on North American electronics manufacturing.

Elmatica’s Didrik Bech Accepts Role as IPC Cybersecurity Task Group Vice-Chair

06/22/2020 | Nolan Johnson, I-Connect007
On June 18, Nolan Johnson spoke with Didrik Bech, Elmatica CEO and I-Connect007 columnist, who was recently selected as vice-chair for IPC’s Cybersecurity Task Group. During their conversation, Didrik outlined the task group’s mission statement and the target audience for its work. He also shared specific examples where cybersecurity is increasingly important to the electronics manufacturing industry globally.

The iNEMI 2019 Roadmap: Flexible Hybrid Electronics

06/04/2020 | Pete Starkey, I-Connect007
The emerging trend for “electronics on everything, everything with electronics” was the theme of iNEMI’s webinar presentation of the highlights of its recently published Flexible Hybrid Electronics Roadmap Chapter, delivered by Girish Wable, senior engineering services manager with Jabil. Pete Starkey provides an overview.



Copyright © 2020 I-Connect007. All rights reserved.