SMTA Welcomes New Board Members


Reading time ( words)

The SMTA is pleased to announce its election results for the Board of Directors for the term that began at SMTA International (September 27 - October 1, 2015). Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. was elected Treasurer. Eileen Hibbler, TEK Products, was elected VP Membership. Richard Coyle, Ph.D., Alcatel-Lucent, and Tim Jensen, Indium Corporation, were appointed to the Strategic Development Committee.

Those remaining on the SMTA Board of Directors include: President, Bill Barthel, Plexus Corporation; Secretary, Richard Henrick, Sanmina Corporation; VP Expos, Debbie Carboni, KYZEN Corporation; VP Communications, Michelle Ogihara, Seika Machinery, Inc.; VP Technical Programs, Raiyomand Aspandiar, Ph.D., Intel Corporation; Strategic Development Committee members include: Chair, Matt Kelly, P.Eng, MBA, IBM Corporation; Martin Anselm, Ph.D., RIT; and Scott Priore, Cisco Systems, Inc.

SMTA_Board_Memebers.JPG

The SMTA bids a fond farewell to departing Strategic Development Committee Chair, Jeff Kennedy, Celestica, Inc.; VP Membership, Roy Starks, LogiSync LLC; Treasurer, Randy Schueller, Ph.D., DfR Solutions; and Secretary, Scott Nelson, Harris Corporation. They are congratulated for a job well done and given thanks for the years of dedication to the SMTA.

For more information on the SMTA Board of Directors election results, contact Tanya Martin: tanya@smta.org or 952-920-7682.

About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share

Print


Suggested Items

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 1)

07/16/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
Since 2006 and the implementation of the RoHS directive, the interest in bismuth-tin solder alloys—whose melting point around 140°C is very desirable because it allows for the use of lower temperature laminate materials and reduces thermal stress on sensitive components—has only increased as the industry has searched for Pb-free alternatives to the chosen standard, SAC305, which melts at considerably higher temperatures than the incumbent tin-lead alloys.

Top 10 Most-Read SMT007 Articles for March

04/01/2019 | I-Connect007
Starting this month, we will take a look back at the most popular SMT007 news, articles, interviews, and columns over the past 30 days. For the month of March, these are the top 10 most-read SMT007 articles. Check them out.

RTW IPC APEX EXPO 2019: Reducing Voiding in Reflow Soldering

03/06/2019 | Real Time with...IPC
Chris Nash, product manager for PCB assembly solder paste at Indium Corporation, speaks with Kelly Dack and highlights Indium’s take on three important aspects of reliability: thermal, mechanical, and electrical. He talks about challenges of all three aspects, which include solder voiding, and how Indium helps the industry address these issues through its solder paste formulations.



Copyright © 2019 I-Connect007. All rights reserved.