DARPA Launches Future Technology Forum
September 10, 2015 | DARPAEstimated reading time: 1 minute
Today marks the start of Wait, What? A Future Technology Forum—DARPA's groundbreaking foray into emerging technologies and how those technologies are likely to change our world in the years ahead. The event, which is taking place in St. Louis, is being attended by more than 1,200 engineers, scientists and other innovators from big and small companies, universities, government and private research laboratories and other crucibles of ingenuity, with the goal of sharing and generating new ideas at the boundaries of today’s technological capabilities.
“By exchanging insights from multiple fields and exploring those fields’ dynamic intersections, participants in Wait, What? can point DARPA to some of the most promising areas of change and possibility,” said DARPA Director Arati Prabhakar. “And by describing DARPA’s unique mission and demonstrating how we do our work, we hope these scientists and engineers will think more about the world of national security and imagine ways to bring their big ideas to this vital field.”
Plenary presentations by renowned leaders in a wide array of disciplines will be webcast live, starting with opening remarks by Prabhakar and Secretary of Defense Ash Carter at 2 p.m. Central time. Wait, What? will continue through Friday, Sept. 11, at noon Central time.
The venue is full to capacity with registered participants, but remote viewers can check the agenda and watch the livestreamed plenary presentations at www.darpawaitwhat.com.
Followers can also participate in the Forum remotely by downloading the DARPA Wait, What? app from Google or the Apple store. The app offers background on presenters and agenda topics and allows individuals everywhere to participate in interactive discussions with participants.
To get even more out of Wait, What?, follow DARPA on Twitter, Facebook, Google+, Instagram and YouTube (@darpa using hashtag #waitwhat15), and look for unique images and videos of DARPA technology demonstrations on Instagram. Viewers can also submit questions via Twitter during live webcast Q&As using hashtag #waitwhat15.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.