Northrop Grumman Demos Mission Management Control Capabilities
August 11, 2015 | PRNewswireEstimated reading time: 1 minute
Northrop Grumman Corporation successfully demonstrated mission management control features that create more unmanned aircraft system (UAS) versatility and efficiencies. During a series of high-altitude, long-endurance RQ-4 Global Hawk demonstrations, the UAS seamlessly responded to external requests to dynamically alter its route of flight and sensor functionality, thereby breaking the one-user to one-vehicle paradigm.
"Northrop Grumman's Control Mission Management System [CMMS] team is proud to contribute to the standardization of command and control (C2) systems for multiple UAS," said Michael Leahy, program director, CMMS, Northrop Grumman. "Our customers' advanced intelligence, surveillance and reconnaissance requirements call for modern ground control systems based on emerging standards that can be used across air vehicle platforms – that's what we strive to deliver."
The demonstration verified that Global Hawk is capable of integrating advanced mission management capability without changes to the air vehicle software.
This demonstration supported the broader objectives of the U.S. Air Force's Common Mission Control Center (CMCC) program. The Global Hawk interfaced to the CMCC using the UAS C2 Initiative (UCI) message set, which is an emerging standard that enables interoperability across multiple weapon systems.
By demonstrating the ability to interface with this new message standard, Northrop Grumman again illustrated the growth potential of the Global Hawk system and the flexibility to support emerging concepts of operation.
About Northrop Grumman
Northrop Grumman is a leading global security company providing innovative systems, products and solutions in unmanned systems, cyber, C4ISR, and logistics and modernization to government and commercial customers worldwide. Please visit www.northropgrumman.com for more information.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Intel Announces New Program for AI PC Software Developers and Hardware Vendors
03/27/2024 | Intel CorporationIntel Corporation announced the creation of two new artificial intelligence (AI) initiatives as part of the AI PC Acceleration Program: the AI PC Developer Program and the addition of independent hardware vendors to the program.
SEMI ESD Alliance 2024 CEO Executive Outlook to Explore the Evolving RISC-V Movement and Semiconductor Design Ecosystem
03/27/2024 | SEMIKey executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies. Registration opens soon.
CentraTEQ to Showcase Wide Range of Vibration & Environmental Test Systems at Battery Tech Expo 24
03/26/2024 | CentraTEQEnvironmental and vibration test specialists CentraTEQ are excited to be exhibiting at the upcoming Battery Tech Expo, scheduled to take place at Silverstone on April 25, 2024.
SEMI 3D & Systems Summit To Spotlight Trends In Hybrid Bonding, Chiplet Design And Environmental Sustainability
03/26/2024 | SEMILeading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024,