Tulane University Conducts Conflict Minerals Market Impact Survey


Reading time ( words)

IPC members and many other companies are continuing to be burdened by compliance with U.S. conflict minerals regulations, while Europe contemplates its own conflict minerals regulations. In a continuing effort to quantify the burdens experienced by companies, especially those in the supply chain, Tulane University is conducting a Conflict Minerals Market Survey. The survey results will also assist IPC and other industry associations in lobbying for less burdensome regulations in other parts of the world, such as those currently being considered in the European Union.

All companies impacted by conflict minerals legislation or produce, procure or consume tin, tungsten, tantalum and/or gold (3TG) are invited to participate. This survey will focus on the upstream and downstream 3TG supply chain. The survey can be found here. The deadline to complete the survey is June 15, 2015. The survey is expected to take survey respondents between 10 and 30 minutes to complete and is available in English, French and Mandarin.

Share


Suggested Items

Defense Speak Interpreted: Defense Electronic Supply Chain Issues

10/09/2018 | Dennis Fritz, Fritz Consulting
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.

SLP: The Next Level of Technology

10/02/2018 | Patty Goldman, I-Connect007
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?

The IPC High-Reliability Forum for Mil-Aero and Automotive Sectors

09/24/2018 | Happy Holden, I-Connect007
I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”



Copyright © 2018 I-Connect007. All rights reserved.