A Challenge Facing Aerospace Designers In 2023


Reading time ( words)

As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication.

ritchey_fig1_0123.jpgRecently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.

The designers decided to reach down from the outer layer to the third layer below the surface using stacked blind vias.

The process used to create the structure in Figure 1 is to fabricate a PCB using the ordinary lamination, drilling, and plating processes employed for any multilayer PCB. Once this is done, a laser drill is used to create the first blind via at the bottom of the stack as shown in Figure 1.

To read this entire article, which appeared in the January 2023 issue of Design007 Magazine, click here.

Share




Suggested Items

Durability and Cost Benefits Drive Mil-Aero Demand for OCPP

01/17/2023 | Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).

US, Japan Sign Space Collaboration Agreement at NASA Headquarters

01/16/2023 | NASA
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.

Intel Joins DARPA’s Space-BACN to Accelerate Inter-Satellite Communications

10/12/2022 | Intel
The U.S. Defense Advanced Research Projects Agency (DARPA) has selected Intel for Phase 1 of the Space-Based Adaptive Communications Node (Space-BACN) program, which aims to create a low-cost, reconfigurable optical communications terminal that will translate information between diverse satellite constellations.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.