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Sidus Space, Inc., a Space-as-a-Service company focused on mission critical hardware manufacturing combined with commercial satellite design, manufacture, launch, and data collection, has earned an enhanced AS9100 certification expanding the scope to include engineering. Sidus Space has been AS9100 certified in manufacturing since 2013. AS9100 certification sets the worldwide aerospace quality standards as well as the quality requirements of Department of Defense (DoD), National Aeronautics and Space Administration (NASA), and the Federal Aviation Administration (FAA).
AS9100 certification expands on the ISO9001 quality standards and adds additional regulatory requirements and notations pertaining specifically to aerospace quality needs. AS9100 is backed by the International Aerospace Quality Group (IAQG) which includes representatives from many major worldwide aerospace companies.
“I am extremely proud of my team for their steadfast dedication to continuously improve by monitoring our internal business processes, creating efficiencies and increased productivity. This is part of our culture at Sidus Space and has a direct impact on maintaining high quality and achieving our customers’ expectations,” said Carol Craig, Sidus Space Founder and CEO. “Being able to enhance our AS9100 certification reaffirms that we are doing the right things and is imperative for our role as a supplier to our large aerospace customers. We have been manufacturing space hardware for the last decade, and we place significant emphasis on quality, reliability, and safety. AS9100 certification increases our customers’ confidence that we will continue to deliver quality products and services.”
Lee Ritchey, Speeding Edge
As the aerospace industry has been tasked with fitting increasingly complex electronics in existing airframes the demands on PCB substrates have begun to overtask the existing state of the art in PCB fabrication. Recently, I was called in to troubleshoot some reliability problems with a very dense PCB that had components on both sides and required the use of stacked blind vias and buried vias. The usual name for this kind of design is “build-up fabrication,” requiring many trips through the lamination, drilling, and plating operations at a fabricator.
Sam Sadri, QP Technologies
Ceramic packages were, for many years, the option of choice for semiconductor prototype assembly, particularly in military-aerospace applications. They can withstand high temperatures and can be hermetically sealed. However, they can be costly and, while they allow for rapid assembly of first samples, the final product is typically a plastic package, so the ceramic prototype doesn’t offer an accurate representation. This need for a better, more viable alternative to ceramic was one of the catalysts that gave rise to open-cavity plastic packaging (OCPP).
During an event hosted by NASA Administrator Bill Nelson and Deputy Administrator Pam Melroy at the agency's Headquarters in Washington Friday, representatives from the United States and Japan gathered to sign an agreement that builds on a long history of collaboration in space exploration between the two nations. Known as the "Framework Agreement Between the Government of Japan and the Government of the United States of America for Cooperation in Space Exploration and Use of Outer Space, Including the Moon and Other Celestial Bodies, For Peaceful Purposes," this pact recognizes a mutual interest in peaceful exploration.